Methods for electron beam patterning
    4.
    发明授权
    Methods for electron beam patterning 有权
    电子束图案化方法

    公开(公告)号:US09182660B2

    公开(公告)日:2015-11-10

    申请号:US13486000

    申请日:2012-06-01

    摘要: A method for electron-beam patterning includes forming a conductive material layer on a substrate; forming a bottom anti-reflective coating (BARC) layer on the conductive material layer; forming a resist layer on the BARC layer; and directing an electron beam (e-beam) to the sensitive resist layer for an electron beam patterning process. The BARC layer is designed such that a top electrical potential of the resist layer is substantially zero during the e-beam patterning process.

    摘要翻译: 电子束图案化方法包括在基板上形成导电材料层; 在导电材料层上形成底部抗反射涂层(BARC)层; 在BARC层上形成抗蚀剂层; 并将电子束(电子束)引导到用于电子束图案化工艺的敏感抗蚀剂层。 BARC层被设计成使得在电子束图案化工艺期间抗蚀剂层的顶部电势基本为零。

    Method for proximity correction
    7.
    发明授权
    Method for proximity correction 有权
    邻近校正方法

    公开(公告)号:US08762900B2

    公开(公告)日:2014-06-24

    申请号:US13534765

    申请日:2012-06-27

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5081 G03F1/36 G03F1/70

    摘要: A method of an integrated circuit (IC) design includes receiving an IC design layout. The IC design layout includes an IC feature with a first outer boundary and a first target points assigned to the first outer boundary. The method also includes generating a second outer boundary for the IC feature and moving all the first target points to the second outer boundary to form a modified IC design layout.

    摘要翻译: 集成电路(IC)设计的方法包括接收IC设计布局。 IC设计布局包括具有第一外边界的IC特征和分配给第一外边界的第一目标点。 该方法还包括为IC特征产生第二外部边界并将所有第一目标点移动到第二外部边界以形成修改的IC设计布局。

    METHOD FOR PROXIMITY CORRECTION
    9.
    发明申请
    METHOD FOR PROXIMITY CORRECTION 有权
    近似校正方法

    公开(公告)号:US20140007023A1

    公开(公告)日:2014-01-02

    申请号:US13534765

    申请日:2012-06-27

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5081 G03F1/36 G03F1/70

    摘要: A method of an integrated circuit (IC) design includes receiving an IC design layout. The IC design layout includes an IC feature with a first outer boundary and a first target points assigned to the first outer boundary. The method also includes generating a second outer boundary for the IC feature and moving all the first target points to the second outer boundary to form a modified IC design layout.

    摘要翻译: 集成电路(IC)设计的方法包括接收IC设计布局。 IC设计布局包括具有第一外边界的IC特征和分配给第一外边界的第一目标点。 该方法还包括为IC特征产生第二外部边界并将所有第一目标点移动到第二外部边界以形成修改的IC设计布局。

    METHODS FOR ELECTRON BEAM PATTERNING
    10.
    发明申请
    METHODS FOR ELECTRON BEAM PATTERNING 有权
    电子束图案的方法

    公开(公告)号:US20130323918A1

    公开(公告)日:2013-12-05

    申请号:US13486000

    申请日:2012-06-01

    IPC分类号: H01L21/02

    摘要: A method for electron-beam patterning includes forming a conductive material layer on a substrate; forming a bottom anti-reflective coating (BARC) layer on the conductive material layer; forming a resist layer on the BARC layer; and directing an electron beam (e-beam) to the sensitive resist layer for an electron beam patterning process. The BARC layer is designed such that a top electrical potential of the resist layer is substantially zero during the e-beam patterning process.

    摘要翻译: 电子束图案化方法包括在基板上形成导电材料层; 在导电材料层上形成底部抗反射涂层(BARC)层; 在BARC层上形成抗蚀剂层; 并将电子束(电子束)引导到用于电子束图案化工艺的敏感抗蚀剂层。 BARC层被设计成使得在电子束图案化工艺期间抗蚀剂层的顶部电势基本为零。