Composite structure with optical fiber embedded in one of its surface layers and a process for its connection and repair
    3.
    发明申请
    Composite structure with optical fiber embedded in one of its surface layers and a process for its connection and repair 有权
    具有嵌入其表面层之一的光纤的复合结构及其连接和修复的过程

    公开(公告)号:US20070122099A1

    公开(公告)日:2007-05-31

    申请号:US11441273

    申请日:2006-05-25

    IPC分类号: G02B6/00

    摘要: The invention relates to a composite structure (11) formed by a plurality of layers (13, 15, 17, 19, 21, 23) including an optical fiber (25) for structural monitoring purposes which is at least partly embedded in a surface layer (13) of said structure (11), and insulation means of the optical fiber (25) areas susceptible to repair with respect to the surface layer (13) in which they are integrated, particularly a protective cover (27) and top and bottom separating films (31, 33), and a process of repairing said areas comprising the following steps: removing the protective cover (27) and the top separating film (31), extracting the area, repairing the optical fiber, relocating the area and providing a new protective cover (27).

    摘要翻译: 本发明涉及由多个层(13,15,17,19,21,23)形成的复合结构(11),其包括用于结构监视目的的光纤(25),所述光纤至少部分地嵌入表面层 (11)的所述表面层(13),并且所述光纤(25)的绝缘装置相对于所述结构(11)的表面层(13)易于修复,特别是保护盖(27)以及顶部和底部 分离膜(31,33)以及修复所述区域的过程包括以下步骤:去除保护盖(27)和顶部分离膜(31),提取区域,修复光纤,重新定位该区域并提供 一个新的保护罩(27)。

    Method to monitor structural damage occurrence and progression in monolithic composite structures using fibre Bragg grating sensors
    5.
    发明申请
    Method to monitor structural damage occurrence and progression in monolithic composite structures using fibre Bragg grating sensors 有权
    使用光纤布拉格光栅传感器监测单片复合结构中结构损坏发生和进展的方法

    公开(公告)号:US20060140532A1

    公开(公告)日:2006-06-29

    申请号:US11296855

    申请日:2005-12-07

    IPC分类号: G02B6/00 G02B6/34

    CPC分类号: G01M11/085 G01M11/086

    摘要: A method of monitoring structural damage in a composite structure manufactured by co-curing, co-bonding or secondary bonding of several sub-components (7, 8), using fibre optic Bragg grating sensors attached or embedded to or between (in the bonding line) said sub-components, comprising a first step of measuring the wavelength spectra (31, 33, 40) of said Bragg grating sensors at the end of the manufacturing of the part, and in a known load condition, considered as reference and a second step of identifying the occurrence of a failure of the structure and the progress of said failure detecting the release of the residual stresses/strains stored during the curing process by measuring changes (31 to 32, 33 to 34, 40 to 41) with respect to said reference wavelength spectra.

    摘要翻译: 通过使用附接或嵌入或嵌入(在接合线中(在接合线中)之间的光纤布拉格光栅传感器来监测复合结构中的结构损伤的方法,所述复合结构通过共同固化,共连接或二次接合几个子部件(7,8) )所述子部件,包括测量部件制造结束时所述布拉格光栅传感器的波长光谱(31,33,40)的第一步骤,以及被认为是参考的已知负载条件和第二步骤 通过测量变化(31至32,33至34,40至41),确定结构故障的发生和所述故障的进展的步骤,其检测在固化过程中存储的残余应力/应变的释放 所述参考波长光谱。

    Hybrid Group IV/III-V Semiconductor Structures
    6.
    发明申请
    Hybrid Group IV/III-V Semiconductor Structures 审中-公开
    混合组IV / III-V半导体结构

    公开(公告)号:US20110254052A1

    公开(公告)日:2011-10-20

    申请号:US13062304

    申请日:2009-09-16

    IPC分类号: H01L29/12 H01L21/20

    摘要: Described herein are semiconductor structures comprising (i) a Si substrate; (ii) a buffer region formed directly over the Si substrate, wherein the buffer region comprises (a) a Ge layer having a threading dislocation density below about 105 cm−2; or (b) a Ge1-xSnx layer formed directly over the Si substrate and a Ge1-x-ySixSny layer formed over the Ge1-xSnx layer; and (iii) a plurality of III-V active blocks formed over the buffer region, wherein the first III-V active block formed over the buffer region is lattice matched or pseudomorphically strained to the buffer region. Further, methods for forming the semiconductor structures are provided and novel Ge1-x-ySixSny, alloys are provided that are lattice matched or pseudomorphically strained to Ge and have tunable band gaps ranging from about 0.80 eV to about 1.4O eV.

    摘要翻译: 本文描述的是包括(i)Si衬底的半导体结构; (ii)直接形成在所述Si衬底上的缓冲区,其中所述缓冲区包括(a)穿透位错密度低于约105cm -2的Ge层; 或(b)直接形成在Si衬底上的Ge1-xSnx层和形成在Ge1-xSnx层上的Ge1-x-ySixSny层; 和(iii)形成在所述缓冲区上的多个III-V有源块,其中形成在所述缓冲区上的所述第一III-V有源块与所述缓冲区是晶格匹配的或伪形变应变的。 此外,提供了用于形成半导体结构的方法,并且提供新颖的Ge1-x-ySixSny合金,它们是与Ge晶格匹配或伪晶变应变的,并具有约0.80eV至约140eV的可调带隙。

    Coherent evanescent wave imaging
    9.
    发明授权
    Coherent evanescent wave imaging 失效
    相干ev逝波成像

    公开(公告)号:US06980716B1

    公开(公告)日:2005-12-27

    申请号:US10112006

    申请日:2002-03-29

    摘要: Methods and apparatus for gathering image information from nanostructures includes a composite waveguide of conductive nanoparticles in a dielectric medium. The waveguide is irradiated with preferably coherent blue light to form a slow surface wave. The evanescent wave that is the “tail” of the surface wave exists outside the waveguide contiguous to its surface. The nanostructures are located to encounter the evanescent wave. The slowing of the wave that occurs in the waveguide reduces the wave's speed and wavelength sufficiently such that nanostructures can be imaged. Upon encountering the evanescent wave, the nanostructures radiate. This radiation causes a backward scattering from the structures and a forward perturbation of the wavefront of the surface wave. From the scattering and perturbation information about the physical characteristics of the nanostructures sufficient to form an image is derived.

    摘要翻译: 用于从纳米结构收集图像信息的方法和装置包括介电介质中的导电纳米颗粒的复合波导。 用优选的相干蓝光照射波导以形成缓慢的表面波。 作为表面波的“尾”的ev逝波存在于与其表面相邻的波导的外侧。 纳米结构位于遇到ev逝波。 在波导中发生的波的减慢使得波的速度和波长充分地降低,使得可以对纳米结构进行成像。 当遇到ev逝波时,纳米结构辐射。 这种辐射导致结构的反向散射和表面波的波前的向前扰动。 从散射和扰动信息得到关于形成图像的纳米结构的物理特征。