Abstract:
Provided are a method and a terminal for unlocking a locked mode of the terminal. The terminal may include a display to display a home screen in an unlocked mode and a lock screen in a locked mode, an appearance of the lock screen being the same as a home screen, a user interface to receive inputs to unlock the lock screen, and a controller configured to unlock the lock screen based on the received inputs. The input may be received when the lock screen is displayed on the display in the lock mode, the input having a prescribed pattern. When the prescribed pattern of the input corresponds to a previously stored unlocking pattern, the lock screen may be unlocked to display the home screen.
Abstract:
A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less.
Abstract:
A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less.
Abstract:
An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1: Connection resistance increment (%)=|(A−B)/A|×100 (Expression 1) where A is a connection resistance measured after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85° C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.
Abstract:
Provided are a method and a terminal for unlocking a locked mode of the terminal. The terminal may include a display to display a home screen in an unlocked mode and a lock screen in a locked mode, an appearance of the lock screen being the same as a home screen, a user interface to receive inputs to unlock the lock screen, and a controller configured to unlock the lock screen based on the received inputs. The input may be received when the lock screen is displayed on the display in the lock mode, the input having a prescribed pattern. When the prescribed pattern of the input corresponds to a previously stored unlocking pattern, the lock screen may be unlocked to display the home screen.
Abstract:
A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate.
Abstract:
An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1: Connection resistance increment (%)=(A−B)/A×100 (Expression 1) where A is a connection resistance measured after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85° C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.
Abstract:
A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate.