Invention Application
- Patent Title: SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM OR ANISOTROPIC CONDUCTIVE ADHESIVE FILM
- Patent Title (中): 用于各向异性导电胶膜或单向导电胶粘剂的组合物的半导体器件
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Application No.: US13667146Application Date: 2012-11-02
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Publication No.: US20130113119A1Publication Date: 2013-05-09
- Inventor: Hyun Hee NAMKUNG , Jae Sun HAN , Hyun Wook KIM , Jin Young SEO , Kwang Jin JUNG , Dong Seon UH
- Applicant: Hyun Hee NAMKUNG , Jae Sun HAN , Hyun Wook KIM , Jin Young SEO , Kwang Jin JUNG , Dong Seon UH
- Priority: KR10-2011-0114432 20111104
- Main IPC: H01B1/12
- IPC: H01B1/12 ; H01L23/482
Abstract:
A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less.
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