Method of making a structure for top surface gettering of metallic
impurities
    3.
    发明授权
    Method of making a structure for top surface gettering of metallic impurities 失效
    制造金属杂质顶表面吸气结构的方法

    公开(公告)号:US5556793A

    公开(公告)日:1996-09-17

    申请号:US144623

    申请日:1993-11-01

    CPC classification number: H01L21/3221

    Abstract: A method for gettering metallic impurities from a semiconductor substrate (25). A gettering structure is fabricated in inactive areas of a semiconductor chip (31). The gettering structure is manufactured by forming an oxide (30) having a bird's head structure contacting a heavily doped region (28). The combination creates precipitation nuclei to which the metallic impurities migrate. The metallic impurities are sequestered by the precipitation nuclei or trap sites and rendered incapable of degrading the electrical characteristics of a semiconductor device.

    Abstract translation: 一种用于从半导体衬底(25)吸收金属杂质的方法。 在半导体芯片(31)的无源区域中制造吸气结构。 通过形成具有与重掺杂区域(28)接触的鸟头结构的氧化物(30)来制造吸气结构。 该组合产生沉淀核,金属杂质迁移到沉淀核。 金属杂质被沉淀核或捕集点隔离,并且不能降低半导体器件的电特性。

    Double implanted laterally diffused MOS device and method thereof
    5.
    发明授权
    Double implanted laterally diffused MOS device and method thereof 失效
    双向植入横向扩散MOS器件及其方法

    公开(公告)号:US5371394A

    公开(公告)日:1994-12-06

    申请号:US153503

    申请日:1993-11-15

    CPC classification number: H01L29/66659 H01L29/1045 H01L29/1083 H01L29/7835

    Abstract: An NMOS transistor has a source and a drain composed of n+ type of semiconductor material. A substrate region composed of a p type of semiconductor material is disposed between the source and the drain. A gate region is disposed above the substrate region and between the source region and the drain region. A first implant region is disposed adjacent to the source region and the gate region. The first implant region is composed of p type of semiconductor material with a first doping concentration. A second implant region is disposed between the first implant region and the substrate. The second implant region is composed of p type of semiconductor material with a second doping concentration. The channel doping profile first and second implant regions is tailored to obtain the optimum internal electric field to maximize device transconductance, while simultaneously controlling the device threshold voltage and punch through characteristics.

    Abstract translation: NMOS晶体管具有由n +型半导体材料构成的源极和漏极。 由p型半导体材料构成的衬底区域设置在源极和漏极之间。 栅极区域设置在衬底区域之上并且在源极区域和漏极区域之间。 第一注入区域邻近源极区域和栅极区域设置。 第一注入区域由具有第一掺杂浓度的p型半导体材料组成。 第二植入区域设置在第一植入区域和基底之间。 第二注入区由具有第二掺杂浓度的p型半导体材料组成。 沟道掺杂分布第一和第二注入区域被定制以获得最佳内部电场以最大化器件跨导,同时控制器件阈值电压和穿透特性。

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