公开(公告)号：US20100289148A1

公开(公告)日：2010-11-18

申请号：US12843934

申请日：2010-07-27

申请人： Tasao SOGA ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao SOGA ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/15

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US08125090B2

公开(公告)日：2012-02-28

申请号：US12843934

申请日：2010-07-27

申请人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US5901967A

公开(公告)日：1999-05-11

申请号：US928923

申请日：1997-09-12

申请人： Eiichi Morisaki

发明人： Eiichi Morisaki

IPC分类号： B23Q3/12 ,  B23B5/22

CPC分类号： B23Q3/12 ,  Y10T279/12 ,  Y10T279/1291 ,  Y10T279/20 ,  Y10T279/3406

摘要： In a changeable chuck system which can grip and release a workpiece by means of a chuck C by itself, fluid shut-off valves 20a and 20b are provided on a fluid supply portion provided on the tip of a main spindle 2 of a machine tool. When the chuck C is mounted on the main spindle 2, the fluid shut-off valves 20a and 20b are automatically connected to fluid couplers 111a and 111b provided behind the chuck C, and a jaw operating cylinder 90 provided in the chuck C is actuated by a fluid supplied from a rear portion of the main spindle 2 to open and close gripping jaws 93. Thus, the gripping jaws 93 can be operated by means of the jaw operating cylinder 90 provided in the chuck C when the chuck C is mounted on the tip of the main spindle 2.

摘要翻译： 在通过卡盘C自身夹持和释放工件的可变卡盘系统中，流体切断阀20a和20b设置在设置在机床主轴2的尖端上的流体供应部分上。 当卡盘C安装在主轴2上时，流体切断阀20a和20b自动地连接到设置在卡盘C后面的流体连接器111a和111b，并且设置在卡盘C中的卡爪操作缸90由 从主轴2的后部提供的流体以打开和关闭夹爪93.因此，当卡盘C安装在夹头C上时，可以通过设置在卡盘C中的夹爪操作缸90来操作夹爪93 主轴2的尖端。

公开(公告)号：US5158307A

公开(公告)日：1992-10-27

申请号：US836999

申请日：1992-02-14

申请人： Hidekatsu Toyano ,  Eiichi Morisaki

发明人： Hidekatsu Toyano ,  Eiichi Morisaki

IPC分类号： B23B31/16 ,  B23B31/177

CPC分类号： B23B31/16266 ,  B23B31/16295 ,  Y10T279/1973 ,  Y10T279/1993 ,  Y10T279/20

摘要： A machine tool chuck in which a wedge member is provided to cause radial displacement of workpiece clamping pawls for replacement. The replacement can be made with minimum variations in radial position at which the clamping pawls are relocated. To this end, the clamping pawls and slide blocks are slidably guided radially through a chuck body independently of each other. Each clamping pawl and each slide block are in slidable engagement with a sloping wedge action portion of an axial slidable wedge bar in such a way that axial displacement of the wedge bar will force both the clamping pawl and the slide block to move radially independently of each other while maintaining the geometric relationship therebetween. For replacement of the clamping pawl, the wedge bar is moved backward to cause its wedge action portion to be disengaged from the clamping pawl whereby the clamping pawl can be slid radially outwardly for replacement.

摘要翻译： 一种机床卡盘，其中设置楔形构件以引起工件夹紧爪的更换的径向位移。 可以在夹紧爪被重新定位的径向位置的最小变化下进行更换。 为此，夹紧爪和滑动块可以彼此独立地径向滑动地引导通过卡盘体。 每个夹紧爪和每个滑动块都能够与轴向可滑动的楔形杆的倾斜的楔形作用部分滑动接合，使得楔形杆的轴向位移将迫使夹紧爪和滑动块彼此径向独立地移动 另一方面保持它们之间的几何关系。 为了更换夹紧爪，楔形杆向后移动以使其楔形作用部分与夹紧爪分离，由此夹紧爪可以径向向外滑动以便更换。

公开(公告)号：US5033183A

公开(公告)日：1991-07-23

申请号：US354353

申请日：1989-05-19

申请人： Eiichi Morisaki

发明人： Eiichi Morisaki

IPC分类号： B23B31/16 ,  B23B31/39

CPC分类号： B23B31/16 ,  B23B31/39 ,  Y10S279/901 ,  Y10T279/1986 ,  Y10T483/171

摘要： A chuck jaw changer for a machine tool has a jaw changing arm which is swingable about a vertical rotating shaft. The two ends of the arm have elongated magazine holders extending transversely to the length of the arm. The magazine holder has a guide groove in which an elongated jaw magazine is fitted slidably along the length of the holder. The magazine is formed with a plurality of jaw storage grooves spaced apart from each other and chuck jaws are detachably accommodated in the storage grooves, respectively. When the jaw changing arm is indexed to position the magazine holder into registry with the jaw mounting groove of the chuck, one of the jaw storage grooves of the magazine is brought into alignment with the jaw mounting groove so that a jaw changing device operates to shift the jaw between the storage groove and the jaw mounting groove for changing the jaw. The other jaw storage grooves can be brought into alignment with the jaw mounting groove one by one by shifting the magazine along the magazine holder by means of a traversing device.

摘要翻译： 用于机床的卡盘卡爪更换器具有可围绕垂直旋转轴摆动的卡爪更换臂。 臂的两端具有横向于臂的长度延伸的细长的刀架保持架。 刀库保持器具有引导槽，其中细长的卡爪库沿着保持器的长度可滑动地装配。 刀库形成有彼此间隔开的多个钳口存储槽，并且卡盘爪分别可拆卸地容纳在存储槽中。 当夹爪更换臂被分度以将仓夹固定器与卡盘的爪安装槽对准时，刀库的一个夹爪存放槽与夹爪安装槽对准，使得夹钳更换装置工作以移位 存储槽和钳口安装槽之间的钳口用于改变钳口。 通过移动装置，可以通过沿刀库保持架移动刀库，使其它钳口存储槽逐一与刀片安装槽对齐。

公开(公告)号：US4431201A

公开(公告)日：1984-02-14

申请号：US244325

申请日：1981-03-16

申请人： Eiichi Morisaki

发明人： Eiichi Morisaki

IPC分类号： B23B31/16 ,  B23B31/14 ,  B23B31/177

CPC分类号： B23B31/14 ,  Y10T279/19 ,  Y10T279/243

摘要： A centrifugal force compensation device in a wedge-type balanced rotary chuck having jaws comprises, for each jaw, a balance weight and means for doubling the centrifugal force acting on the balance weight and applying the doubled force to the back face of that jaw near the outer periphery thereof thereby to press forward the jaw and impart thereto a moment urging it to rotate inward toward the chuck axis, whereby the so-called jaw flotation phenomenon is countered and prevented and, simultaneously, the reduction in chuck gripping force due to centrifugal force is compensated for.

摘要翻译： 具有夹爪的楔形平衡旋转卡盘中的离心力补偿装置包括用于每个夹爪的平衡重和用于加倍作用在平衡重上的离心力的装置，并且将加倍的力施加到靠近该颚的后表面 的外周，从而向前推压爪，并赋予其一定的力矩，促使其朝向卡盘轴线向内旋转，由此所谓的卡爪浮选现象得到抵制和防止，同时由于离心力而使卡盘夹紧力减小 被补偿。

公开(公告)号：US08004075B2

公开(公告)日：2011-08-23

申请号：US11739122

申请日：2007-04-24

申请人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/22 ,  H01L23/24

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US20070246833A1

公开(公告)日：2007-10-25

申请号：US11739122

申请日：2007-04-24

申请人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/48

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。