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    Method for manufacturing thin-film magnetic head sliders
    2.
    发明授权
    Method for manufacturing thin-film magnetic head sliders 有权
    制造薄膜磁头滑块的方法

    公开(公告)号：US07191508B2

    公开(公告)日：2007-03-20

    申请号：US10917591

    申请日：2004-08-13

    Applicant: Cherngye Hwang ,  Kim Y. Lee ,  Gary McClelland ,  Dennis Richard McKean ,  Timothy Clark Reiley

    Inventor： Cherngye Hwang ,  Kim Y. Lee ,  Gary McClelland ,  Dennis Richard McKean ,  Timothy Clark Reiley

    IPC: G11B5/127 ,  H04R31/00

    CPC classification number: G11B5/3173 ,  G11B5/102 ,  G11B5/105 ,  G11B5/3106 ,  G11B5/3163 ,  Y10T29/49032 ,  Y10T29/49041

    Abstract: A method for manufacturing thin-film magnetic head sliders is disclosed. Initially, an elastic layer, which may be made of poly-dimethyl siloxane (PDMS), is spun on a wafer and is thermally cured. Then, a resist layer is spun on the elastic layer. Both the resist layer and the elastic layer are subsequently peeled off together from the wafer. Next, the peeled resist layer/elastic layer is applied onto a group of magnetic heads with the resist layer in direct contact with the magnetic heads. Finally, the elastic layer is peeled off from the resist layer such that the resist layer remains attaching to the magnetic heads.

    Abstract translation: 公开了一种制造薄膜磁头滑块的方法。 最初，可以由聚二甲基硅氧烷（PDMS）制成的弹性层在晶片上旋转并被热固化。 然后，在弹性层上旋转抗蚀剂层。 抗蚀剂层和弹性层随后从晶片一起剥离。 接下来，将剥离的抗蚀剂层/弹性层施加到一组磁头上，其中抗蚀剂层与磁头直接接触。 最后，弹性层从抗蚀剂层剥离，使得抗蚀剂层保持附着在磁头上。

    Method for repairing photoresist layer defects using index matching overcoat
    5.
    发明授权
    Method for repairing photoresist layer defects using index matching overcoat 失效
    使用指数匹配大衣修复光致抗蚀剂层缺陷的方法

    公开(公告)号：US07461446B2

    公开(公告)日：2008-12-09

    申请号：US11257911

    申请日：2005-10-24

    Applicant: Dennis Richard McKean ,  Gary John Suzuki

    Inventor： Dennis Richard McKean ,  Gary John Suzuki

    IPC: G11B5/127 ,  H04R31/00

    CPC classification number: G11B5/102 ,  Y10S438/946 ,  Y10T29/4903 ,  Y10T29/49041 ,  Y10T29/49046 ,  Y10T29/49798

    Abstract: A method is presented for repairing damaged photomasks for electronic component fabrication processes, particularly for fabrication of the ABS of a disk drive slider. The method includes applying an overcoat of material having index of fraction which is close to the index of refraction of the photoresist material of the damaged photomask to produce a non-scattering boundary surface. The overcoat material preferably includes an overcoat base material which is a polymer having an index of refraction which is in the range of plus or minus 0.1 from the index of refraction of said photoresist material.

    Abstract translation: 提出了一种用于修复用于电子元件制造工艺的损坏的光掩模的方法，特别是用于制造磁盘驱动器滑块的ABS。 该方法包括施加具有接近损伤的光掩模的光致抗蚀剂材料的折射率的分数的材料的外涂层以产生非散射边界表面。 外涂层材料优选包括外涂层基材，其是具有折射率的聚合物，其折射率从所述光致抗蚀剂材料的折射率在正或负0.1的范围内。

    Elimination of write head plating defects using high activation chemically amplified resist
    6.
    发明授权
    Elimination of write head plating defects using high activation chemically amplified resist 失效
    使用高激活化学放大抗蚀剂消除写头电镀缺陷

    公开(公告)号：US07413845B2

    公开(公告)日：2008-08-19

    申请号：US10831412

    申请日：2004-04-23

    Applicant: Kim Y. Lee ,  Dennis Richard McKean

    Inventor： Kim Y. Lee ,  Dennis Richard McKean

    IPC: G03F7/00

    CPC classification number: G03F7/405 ,  G03F7/0392 ,  G11B5/3116 ,  G11B5/3163 ,  Y10T29/49021

    Abstract: Methods of forming a component of a thin film magnetic head and improving the plating of a component of a thin film magnetic head are provided. The methods include the use of a high activation energy chemically amplified photoresist (CARS) that is contacted with a low pH high saturation magnetic moment plating solution to form a magnetic head component that is essentially free of plating defects. The methods find utility in hard disk drive applications, such as in the manufacture of magnetic poles for the write head of a hard disk drive.

    Abstract translation: 提供了形成薄膜磁头的部件并改善薄膜磁头的部件的电镀的方法。 这些方法包括使用与低pH高饱和磁矩电镀溶液接触的高活化能化学放大光致抗蚀剂（CARS），以形成基本上没有电镀缺陷的磁头组分。 该方法可用于硬盘驱动器应用，例如用于制造用于硬盘驱动器的写头的磁极。

    Methods of making magnetic write heads with use of linewidth shrinkage techniques
    7.
    发明授权
    Methods of making magnetic write heads with use of linewidth shrinkage techniques 失效
    使用线宽收缩技术制造磁头的方法

    公开(公告)号：US07343666B2

    公开(公告)日：2008-03-18

    申请号：US10881782

    申请日：2004-06-30

    Applicant: Kim Y. Lee ,  Jyh-Shuey Jerry Lo ,  Dennis Richard McKean

    Inventor： Kim Y. Lee ,  Jyh-Shuey Jerry Lo ,  Dennis Richard McKean

    IPC: G11B5/127 ,  H04R31/00

    CPC classification number: G11B5/3163 ,  G11B5/3116 ,  Y10T29/49043 ,  Y10T29/49046 ,  Y10T29/49048 ,  Y10T29/49052

    Abstract: In one illustrative example, a method for use in making a magnetic write head includes the steps of forming a first pole piece layer of a first pole piece; forming a patterned resist over the first pole piece layer; electroplating a pedestal over the first pole piece layer within a channel of the patterned resist; electroplating a metal gap layer over the pedestal within the channel of the patterned resist; forming a resist channel shrinking film over the patterned resist; baking the resist channel shrinking film over the patterned to thereby reduce a width of the channel; removing the resist channel shrinking film; electroplating a second pole piece within the reduced-width channel of the patterned resist; removing the patterned resist; and milling the pedestal, using the second pole piece as a mask, to form a central notched pedestal having side walls with angled slopes.

    Abstract translation: 在一个说明性示例中，用于制造磁写头的方法包括以下步骤：形成第一极片的第一极片层; 在所述第一极片层上形成图案化抗蚀剂; 在图案化的抗蚀剂的通道内的第一极片层上电镀一个基座; 在图案化的抗蚀剂的通道内的基座上方电镀金属间隙层; 在图案化的抗蚀剂上形成抗蚀剂通道收缩膜; 在图案上烘烤抗蚀剂通道收缩膜，从而减小通道的宽度; 去除抗蚀剂通道收缩膜; 在图案化的抗蚀剂的减小宽度的通道内电镀第二极片; 去除图案化的抗蚀剂; 并使用第二极片作为掩模铣削基座，以形成具有倾斜斜面的侧壁的中心凹口底座。

    Planarization method for a structure having a first surface for etching and a second surface
    10.
    发明授权
    Planarization method for a structure having a first surface for etching and a second surface 失效
    具有用于蚀刻的第一表面和第二表面的结构的平面化方法

    公开(公告)号：US07263763B2

    公开(公告)日：2007-09-04

    申请号：US11168215

    申请日：2005-06-27

    Applicant: Qing Dai ,  Jennifer Qing Lu ,  Dennis Richard McKean ,  Eun Row ,  Li Zheng

    Inventor： Qing Dai ,  Jennifer Qing Lu ,  Dennis Richard McKean ,  Eun Row ,  Li Zheng

    IPC: G11B5/127 ,  H04R31/00

    CPC classification number: G11B5/6005 ,  G11B5/3106 ,  G11B5/3163 ,  G11B5/3169 ,  G11B5/3173 ,  Y10S438/976 ,  Y10T29/49023 ,  Y10T29/49041 ,  Y10T29/49048 ,  Y10T29/49052 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/49176 ,  Y10T29/49192 ,  Y10T29/4922 ,  Y10T29/49224 ,  Y10T156/1082 ,  Y10T156/1153

    Abstract: A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

    Abstract translation: 提供了一种使结构平坦化的方法，其最小化步骤高度，减少工艺步骤，改善清洁度，并提供增加的脱粘方便性。 将结构放置在工作表面朝下的粘合剂层上，使得结构在加热期间保持固定。 使用双层封装膜来实现平坦化。 载体用热塑性薄膜层，然后是化学惰性的保护性聚合物薄膜层进行双层叠，可以承受蚀刻和清洁过程。 热塑性层层压在载体的顶部上; 聚合物层层压在接合的热塑性层和载体的顶部上。 然后将具有双层膜的载体放置在结构的背面，以防止在光带期间从正面的化学侵蚀并且使得能够平坦化。 当施加热量时，双层包封膜熔化并将聚合物层推入结构之间的间隙，从而实现完全平坦化。

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