公开(公告)号：US06841084B2

公开(公告)日：2005-01-11

申请号：US10073503

申请日：2002-02-11

Applicant: Dan Lillie ,  Jiangtao Wang

Inventor： Dan Lillie ,  Jiangtao Wang

IPC: H05K1/16 ,  C23F1/02 ,  C23F1/28 ,  C23G1/02 ,  C23G1/06 ,  H01C17/24 ,  H01L21/02 ,  H01L21/3213 ,  H05K3/06 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  C23F3/00

CPC classification number: H05K3/067 ,  C23F1/28 ,  H01C17/2416 ,  H01L21/32135 ,  H01L28/24 ,  H05K1/167

Abstract: A resistive etching solution containing thiourea, which is particularly suitable for etching an electrically resistive material comprised of a nickel-chromium alloy. The resistive etching solution allows for fast and effective etching of a nickel-chromium alloy in cases where the ratio of (a) copper surface area to (b) nickel/chromium surface area, is relatively large, and where fine feature etching is desired.

Abstract translation: 含有硫脲的电阻蚀刻溶液，其特别适用于蚀刻由镍 - 铬合金构成的电阻材料。 在（a）铜表面积与（b）镍/铬表面积的比例相对较大的情况下，以及需要精细特征蚀刻的情况下，电阻蚀刻溶液可以快速有效地蚀刻镍 - 铬合金。

公开(公告)号：US06770976B2

公开(公告)日：2004-08-03

申请号：US10074988

申请日：2002-02-13

Applicant: Jiangtao Wang ,  Dan Lillie ,  David B. Russell ,  Sidney J. Clouser

Inventor： Jiangtao Wang ,  Dan Lillie ,  David B. Russell ,  Sidney J. Clouser

IPC: H01L2348

CPC classification number: C25D1/04 ,  H05K3/025

Abstract: A method and apparatus for forming a relatively thin releasable layer of copper on a carrier substrate. First, a separation facilitating layer is provided on the carrier substrate. A layer of vapor-deposited copper is then formed over the separation facilitating layer to protect the separation facilitating layer during subsequent processing. Thereafter, the thickness of the copper layer is increased by the electrodeposition of copper onto the vapor-deposited layer. The copper layer is applied to a dielectric and is released from the carrier substrate at the separation facilitating layer.

Abstract translation: 一种用于在载体基底上形成相对薄的可释放铜层的方法和装置。 首先，在载体基板上设置分离促进层。 然后在分离促进层上形成一层蒸汽沉积的铜，以在随后的处理期间保护分离促进层。 此后，通过将铜电沉积到气相沉积层上，铜层的厚度增加。 将铜层施加到电介质上，并在分离促进层从载体衬底释放。

公开(公告)号：US06447929B1

公开(公告)日：2002-09-10

申请号：US09649922

申请日：2000-08-29

Applicant: Jiangtao Wang ,  Dan Lillie ,  Sidney J. Clouser

Inventor： Jiangtao Wang ,  Dan Lillie ,  Sidney J. Clouser

IPC: B32B1508

CPC classification number: B32B15/08 ,  C25D5/12 ,  C25D5/16 ,  C25D7/0614 ,  C25D7/0635 ,  H05K3/0097 ,  H05K3/025 ,  H05K3/384 ,  H05K2203/0307 ,  H05K2203/1536 ,  Y10T428/12417 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12847 ,  Y10T428/12903

Abstract: A component for use in forming a printed circuit board comprised of a copper foil, a layer of chromium chemically deposited thereon, the layer of chromium having a thickness of less than about 0.10 &mgr;m; and a layer of electrodeposited copper on the layer of chromium, the layer of electrodeposited copper having a thickness of less than 35 &mgr;m. A nodular treatment layer is provided on the copper foil and the layer of electrodeposited copper.

Abstract translation: 一种用于形成印刷电路板的部件，包括铜箔，化学沉积在其上的铬层，厚度小于约0.10μm的铬层; 以及铬层上的电沉积铜层，电沉积铜层的厚度小于35μm。 在铜箔和电沉积铜层上提供结节处理层。

公开(公告)号：US06489035B1

公开(公告)日：2002-12-03

申请号：US09628766

申请日：2000-07-31

Applicant: Jiangtao Wang ,  John Callahan ,  Dan Lillie

Inventor： Jiangtao Wang ,  John Callahan ,  Dan Lillie

IPC: B32B1504

CPC classification number: C23C2/02 ,  C23C2/26 ,  C23C14/024 ,  C23C14/025 ,  C23C28/044 ,  C23C28/321 ,  C23C28/345 ,  H05K1/167 ,  H05K3/384 ,  H05K3/388 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0361 ,  Y10T428/12438 ,  Y10T428/12472

Abstract: A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 Å and about 70 Å. A vapor deposited resistive material is provided on the stabilization layer.

Abstract translation: 由经过处理以在其上具有稳定层的铜箔组成的​​片材。 稳定层由氧化锌，氧化铬或其组合构成，其厚度介于约和之间。 在稳定层上提供蒸镀电阻材料。

公开(公告)号：US06489034B1

公开(公告)日：2002-12-03

申请号：US09500192

申请日：2000-02-08

Applicant: Jiangtao Wang ,  John Callahan ,  Dan Lillie

Inventor： Jiangtao Wang ,  John Callahan ,  Dan Lillie

IPC: B32B1504

CPC classification number: H05K1/167 ,  C23C2/02 ,  C23C2/26 ,  C23C14/024 ,  C23C14/025 ,  C23C28/321 ,  C23C28/322 ,  C23C28/3225 ,  C23C28/345 ,  C23C28/3455 ,  H05K3/384 ,  H05K3/388 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0361 ,  Y10T428/12438

Abstract: A method of applying a metal onto a copper layer, comprising the steps of: stabilizing a surface of a copper layer by applying a stabilization layer thereto, the stabilization layer comprised of zinc oxide, chromium oxide, nickel, nickel oxide or a combination thereof and having a thickness of between about 5 Å and about 70 Å; and vapor depositing a metal selected from the group consisting of aluminum, nickel, chromium, copper, iron, indium, zinc, tantalum, tin, vanadium, tungsten, zirconium, molybdenum and alloys thereof onto the stabilized surface of the copper layer, and a sheet material formed thereby.

Abstract translation: 一种在铜层上施加金属的方法，包括以下步骤：通过向其施加稳定层来稳定铜层的表面，所述稳定层由氧化锌，氧化铬，镍，氧化镍或其组合构成，稳定层由 具有约5埃至约70埃的厚度; 并将从铝，镍，铬，铜，铁，铟，锌，钽，锡，钒，钨，锆，钼及其合金中选出的金属蒸镀沉积在铜层的稳定化表面上， 由此形成的材料。