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公开(公告)号：US20110031112A1
公开(公告)日：2011-02-10
申请号：US12906530
申请日：2010-10-18
CPC分类号： G01B7/06 , C25D7/123 , C25D17/001 , C25D21/12 , G01B7/287 , H01L21/67253 , Y10T428/24802
摘要： A method and apparatus for measuring differential voltages in an electrolyte of an electrochemical plating cell. Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials. A real time thickness profile may be generated from the thickness values.
摘要翻译： 一种用于测量电化学电镀单元的电解质中的差分电压的方法和装置。 电流密度根据测得的差分电压计算，并与电镀材料的厚度值相关。 可以从厚度值产生实时厚度分布。
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2.发明申请公开(公告)号：US20090182454A1
公开(公告)日：2009-07-16
申请号：US12014076
申请日：2008-01-14
IPC分类号： B25J13/00
CPC分类号： H01L21/681 , B25J9/1692 , G05B2219/37283 , H01L21/67742
摘要： A substrate-handling robot which serves a processing tool such as a plating tool may be automatically controlled by a controller to perform a self-calibration procedure. As part of the procedure, an end effector of the robot is moved to interact with sensors provided on a calibration fixture that is positioned in a substrate placement location for which the calibration procedure is performed. The calibration fixture may have an opening formed therein to allow movement of the robot end effector within the calibration fixture. Sensor light beams generated by the sensors may interact with the end effector during the automatic calibration process so as to determine calibration data for the substrate placement location.
摘要翻译： 用于诸如电镀工具的处理工具的基板处理机器人可以由控制器自动控制以执行自校准程序。 作为该过程的一部分，机器人的末端执行器被移动以与设置在校准夹具上的传感器相互作用，校准夹具位于执行校准过程的衬底放置位置。 校准夹具可以具有形成在其中的开口，以允许机器人末端执行器在校准夹具内的移动。 由传感器产生的传感器光束可在自动校准过程中与端部执行器相互作用，以便确定衬底放置位置的校准数据。
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3.发明授权公开(公告)号：US07319920B2
公开(公告)日：2008-01-15
申请号：US10705175
申请日：2003-11-10
CPC分类号： H01L21/67259 , H01L21/68707
摘要： A substrate-handling robot which serves a processing tool such as a plating tool may be automatically controlled by a controller to perform a self-calibration procedure. As part of the procedure, an end effector of the robot is moved to interact with sensors provided on a calibration fixture that is positioned in a substrate placement location for which the calibration procedure is performed. The calibration fixture may have an opening formed therein to allow movement of the robot end effector within the calibration fixture. Sensor light beams generated by the sensors may interact with the end effector during the automatic calibration process so as to determine calibration data for the substrate placement location.
摘要翻译： 用于诸如电镀工具的处理工具的基板处理机器人可以由控制器自动控制以执行自校准程序。 作为该过程的一部分，机器人的末端执行器被移动以与设置在校准夹具上的传感器相互作用，校准夹具位于执行校准过程的衬底放置位置。 校准夹具可以具有形成在其中的开口，以允许机器人末端执行器在校准夹具内的移动。 由传感器产生的传感器光束可在自动校准过程中与端部执行器相互作用，以便确定衬底放置位置的校准数据。
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公开(公告)号：US07223323B2
公开(公告)日：2007-05-29
申请号：US10616284
申请日：2003-07-08
申请人： Michael X. Yang , Ming Xi , Russell C. Ellwanger , Eric B. Britcher , Bernardo Donoso , Lily L. Pang , Svetlana Sherman , Henry Ho , Anh N. Nguyen , Alexander N. Lerner , Allen L. D'Ambra , Arulkumar Shanmugasundram , Tetsuya Ishikawa , Yevgeniy Rabinovich , Dmitry Lubomirsky , Yeuk-Fai Edwin Mok , Son T. Nguyen
发明人： Michael X. Yang , Ming Xi , Russell C. Ellwanger , Eric B. Britcher , Bernardo Donoso , Lily L. Pang , Svetlana Sherman , Henry Ho , Anh N. Nguyen , Alexander N. Lerner , Allen L. D'Ambra , Arulkumar Shanmugasundram , Tetsuya Ishikawa , Yevgeniy Rabinovich , Dmitry Lubomirsky , Yeuk-Fai Edwin Mok , Son T. Nguyen
CPC分类号： H01L21/6719 , A23D7/00 , A23D7/005 , A23D7/01 , A23J7/00 , B08B3/02 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02 , C25D21/02 , C25D21/08 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/6715 , H01L21/67196 , H01L21/6723 , H01L21/68 , H01L21/6838 , H01L21/68707
摘要： Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
摘要翻译： 本发明的实施方案通常提供电化学电镀系统。 电镀系统包括位于与主机处理平台连通的基板装载站，位于主机上的至少一个基板镀覆单元，位于主机上的至少一个基板斜面清洁单元，以及与 主机和加载站中的至少一个，层叠基板退火站中的每个室具有加热板，冷却板和基板传送机器人。
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公开(公告)号：US20060266653A1
公开(公告)日：2006-11-30
申请号：US11137711
申请日：2005-05-25
IPC分类号： C25D21/12
CPC分类号： G01B7/06 , C25D7/123 , C25D17/001 , C25D21/12 , G01B7/287 , H01L21/67253 , Y10T428/24802
摘要： A method and apparatus for measuring differential voltages in an electrolyte of an electrochemical plating cell. Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials. A real time thickness profile may be generated from the thickness values.
摘要翻译： 一种用于测量电化学电镀单元的电解质中的差分电压的方法和装置。 电流密度根据测得的差分电压计算，并与电镀材料的厚度值相关。 可以从厚度值产生实时厚度分布。
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6.发明申请公开(公告)号：US20050102064A1
公开(公告)日：2005-05-12
申请号：US10705175
申请日：2003-11-10
申请人： Bernardo Donoso , Yeuk-Fai Mok , Vincent Burkhardt
发明人： Bernardo Donoso , Yeuk-Fai Mok , Vincent Burkhardt
IPC分类号： G06F19/00 , H01L21/00 , H01L21/687
CPC分类号： H01L21/67259 , H01L21/68707
摘要： A substrate-handling robot which serves a processing tool such as a plating tool may be automatically controlled by a controller to perform a self-calibration procedure. As part of the procedure, an end effector of the robot is moved to interact with sensors provided on a calibration fixture that is positioned in a substrate placement location for which the calibration procedure is performed. The calibration fixture may have an opening formed therein to allow movement of the robot end effector within the calibration fixture. Sensor light beams generated by the sensors may interact with the end effector during the automatic calibration process so as to determine calibration data for the substrate placement location.
摘要翻译： 用于诸如电镀工具的处理工具的基板处理机器人可以由控制器自动控制以执行自校准程序。 作为该过程的一部分，机器人的末端执行器被移动以与设置在校准夹具上的传感器相互作用，校准夹具位于执行校准过程的衬底放置位置。 校准夹具可以具有形成在其中的开口，以允许机器人末端执行器在校准夹具内的移动。 由传感器产生的传感器光束可在自动校准过程中与端部执行器相互作用，以便确定衬底放置位置的校准数据。
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7.发明授权公开(公告)号：US06736408B2
公开(公告)日：2004-05-18
申请号：US10057114
申请日：2002-01-25
IPC分类号： B23B3100
CPC分类号： H01L21/6838 , B23B31/307 , B25B11/005 , Y10T279/11
摘要： In a first aspect, a rotary vacuum-chuck is provided that may hold a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate. The chuck has one or more openings in fluid communication with the hollow rotary shaft. A venturi is formed near an end of the hollow rotary shaft to apply vacuum to the hollow rotary shaft and the openings in the chuck surface. No seal is required between the end of the hollow rotary shaft and a surrounding stationary block.
摘要翻译： 在第一方面中，提供一种旋转式真空吸盘，其可以保持诸如硅晶片的基板旋转。 真空吸盘包括中空旋转轴和安装在中空旋转轴上并具有适于支撑基底的表面的卡盘。 卡盘具有与中空旋转轴流体连通的一个或多个开口。 在中空旋转轴的端部附近形成文丘里管，以向空心旋转轴和卡盘表面中的开口施加真空。 在空心旋转轴的端部和周围的固定块之间不需要密封。
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公开(公告)号：US06612014B1
公开(公告)日：2003-09-02
申请号：US09616308
申请日：2000-07-12
IPC分类号： B23Q700
CPC分类号： H01L21/68728 , H01L21/67034 , Y10T29/49998
摘要： An apparatus and associated method for securing a wafer to a SRD spider, the SRD spider has a plurality of spider arms. The apparatus includes a plurality of spaced surfaces disposed on a distal end of one of the spider arms, each of the surfaces being spaced perpendicularly from the longitudinal axis of the spider arm. In one aspect, the two surfaces are positioned to limit production of a wedging force between that spaced surface and the wafer. In one embodiment, a post at least partially defines each one of the plurality of spaced surfaces.
摘要翻译： 一种用于将晶片固定到SRD蜘蛛的装置和相关方法，SRD蜘蛛具有多个蜘蛛臂。 该装置包括设置在一个蜘蛛臂的远端上的多个间隔表面，每个表面与该蜘蛛臂的纵向轴线垂直地间隔开。 在一个方面，两个表面被定位成限制在该间隔表面和晶片之间的楔入力的产生。 在一个实施例中，柱至少部分地限定多个间隔开的表面中的每一个。
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公开(公告)号：US06517130B1
公开(公告)日：2003-02-11
申请号：US09524977
申请日：2000-03-14
IPC分类号： B66C102
CPC分类号： H01L21/68707 , B25J15/0616 , H01L21/6838 , Y10S414/141
摘要： In one aspect, a vacuum chuck supports a substrate on an end effector, the vacuum chuck comprising a position reference structure and a suction cup. The position reference structure is mounted to the surface and comprises a reference surface. The suction cup is located proximate the reference surface and comprising a suction mount. In another aspect, a method of chucking a substrate to a vacuum chuck is provided. The vacuum chuck comprises a suction cup and a position reference structure. The method comprises attaching the suction cup to the substrate to form a seal therebetween. The suction cup is deformed such that the substrate contacts the position reference structure. The substrate is then leveled on the position reference structure.
摘要翻译： 在一个方面，真空吸盘支撑末端执行器上的基板，真空卡盘包括位置参考结构和吸盘。 位置参考结构安装到表面并且包括参考表面。 吸盘位于参考表面附近并且包括抽吸座。 另一方面，提供了将基板夹持到真空吸盘的方法。 真空吸盘包括吸盘和位置参考结构。 该方法包括将吸盘连接到基底以在其间形成密封。 吸盘变形使得基板接触位置参考结构。 然后将基板平整在位置参考结构上。
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公开(公告)号：US07837851B2
公开(公告)日：2010-11-23
申请号：US11137711
申请日：2005-05-25
IPC分类号： C25D21/12
CPC分类号： G01B7/06 , C25D7/123 , C25D17/001 , C25D21/12 , G01B7/287 , H01L21/67253 , Y10T428/24802
摘要： A method and apparatus for measuring differential voltages in an electrolyte of an electrochemical plating cell. Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials. A real time thickness profile may be generated from the thickness values.
摘要翻译： 一种用于测量电化学电镀单元的电解质中的差分电压的方法和装置。 电流密度根据测得的差分电压计算，并与电镀材料的厚度值相关。 可以从厚度值产生实时厚度分布。
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