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公开(公告)号：US20240363482A1
公开(公告)日：2024-10-31
申请号：US18755319
申请日：2024-06-26
发明人： KAI-MOU CHOU , SHIH-HAN WU , JHIH-WEI LAI , JIAN-YU SHIH
IPC分类号： H01L23/373 , B32B9/00 , F28F21/08
CPC分类号： H01L23/3735 , B32B9/005 , F28F21/081 , B32B2307/302 , B32B2307/7376
摘要： A ceramic metal composite substrate includes a metal core layer, two soldering layers, and two ceramic covering layers. The metal core layer is a metal-diamond composite layer, and the metal core layer has two metallic surfaces spaced apart from each other along a thickness direction by a predetermined thickness. The two soldering layers are respectively formed on the two metallic surfaces. The two ceramic covering layers are respectively fixed to the two metallic surfaces through the two soldering layers. Each of the two ceramic covering layers has a heat-transfer coefficient greater than or equal to 20 W/m·k, and a sum of thicknesses of the two ceramic covering layers and thicknesses of the two soldering layers is less than or equal to the predetermined thickness. Each of the two ceramic covering layers overlaps at least 80% of an area of the corresponding metallic surface along the thickness direction.
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公开(公告)号：US20240363479A1
公开(公告)日：2024-10-31
申请号：US18210165
申请日：2023-06-15
发明人： KAI-MOU CHOU , SHIH-HAN WU , JHIH-WEI LAI , JIAN-YU SHIH
IPC分类号： H01L23/373 , H05K1/02
CPC分类号： H01L23/3735 , H05K1/0206
摘要： A ceramic metal composite substrate (CMCS) includes a metal core layer, two soldering layers, and two ceramic covering layers. The metal core layer includes copper, and the metal core layer has two metallic surfaces spaced apart from each other along a thickness direction by a predetermined thickness. The two soldering layers are respectively formed on the two metallic surfaces. The two ceramic covering layers are respectively fixed to the two metallic surfaces through the two soldering layers. Each of the two ceramic covering layers has a heat-transfer coefficient greater than or equal to 20 W/m·k, and a sum of thicknesses of the two ceramic covering layers and thicknesses of the two soldering layers is less than or equal to the predetermined thickness. Each of the two ceramic covering layers overlaps at least 80% of an area of the corresponding metallic surface along the thickness direction.
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公开(公告)号：US20240360043A1
公开(公告)日：2024-10-31
申请号：US18449680
申请日：2023-08-14
发明人： Kai-Mou CHOU , Shih-Han WU , Jhih-Wei LAI , Jia-Yu SHIH
CPC分类号： C04B37/021 , C04B37/023 , C04B41/009 , C04B41/5032 , C04B41/5063 , C04B41/5064 , C04B41/5066 , C04B41/522 , C04B41/87 , C04B41/89 , C04B2237/366 , C04B2237/368 , C04B2237/407 , C04B2237/60
摘要： A composite ceramic substrate having multi-layer configuration includes a nitride ceramic core layer, two composite layers respectively formed on two opposite sides of the nitride ceramic core layer, and two ceramic covering layers that are respectively formed on the two composite layers. Each of the two ceramic covering layers is coated on the corresponding composite layer so as to be jointly sintered to the nitride ceramic core layer. Each of the two ceramic covering layers and the nitride ceramic core layer are of different materials, and a composite material of each of the two composite layers includes the material of the ceramic covering layer connected thereto and the material of the nitride ceramic core layer. A sum of the thicknesses of the two ceramic covering layers and the thicknesses of the two composite layers is less than or equal to a thickness of the nitride ceramic core layer.
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公开(公告)号：US20240284592A1
公开(公告)日：2024-08-22
申请号：US18201677
申请日：2023-05-24
发明人： CHENG-YU CHEN , SHIH-HAN WU , JHIH-WEI LAI , JIAN-YU SHIH , MING-YEN PAN
CPC分类号： H05K1/09 , H05K3/241 , H05K2201/0183 , H05K2201/095 , H05K2201/10416
摘要： A printed circuit board (PCB) is disclosed. The PCB includes a substrate having a plurality of through holes, a plurality of thermally-conductive blocks disposed in the through holes respectively, bonding structures respectively disposed in each through holes, and a metal circuit formed on the substrate. Particularly, the thermally-conductive block is tightly attached to the inner wall of the through hole through the bonding structure. In brief, the bonding structure includes a metal block and metal layers coated on both surfaces of the metal block to replace the conventional adhesive layer made of epoxy resin to tightly fix the thermally-conductive block in the through hole.
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公开(公告)号：US20240276650A1
公开(公告)日：2024-08-15
申请号：US18323856
申请日：2023-05-25
发明人： Yu-Hsien LIAO , Shih-Han WU , Jhih-Wei LAI , Jian-Yu SHIH , Ming-Yen PAN
CPC分类号： H05K3/305 , H05K1/0306 , H05K1/09 , H05K3/146 , H05K3/386 , H05K3/445 , H05K2203/1338
摘要： A manufacturing method of a circuit board. The manufacturing method includes: providing a first substrate; forming an opening on the first substrate; disposing a second substrate, which has a plurality of through holes in the opening; forming an adhesive layer between the first substrate and the second substrate; forming a bonding layer on the first substrate and the second substrate; forming a metal layer on the bonding layer; and patterning the metal layer to form a circuit layer. A circuit board is also disclosed in the disclosure.
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公开(公告)号：US20240234475A9
公开(公告)日：2024-07-11
申请号：US18184976
申请日：2023-03-16
发明人： LI-CHUN HUNG , JUI-HUNG HSU , CHIEN-CHEN LEE
IPC分类号： H01L27/146 , H01L23/00
CPC分类号： H01L27/14683 , H01L24/48 , H01L24/85 , H01L27/14618 , H01L27/14636 , H01L2224/48227 , H01L2224/85801
摘要： A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; forming a mirror ink on the substrate; placing a chip upside-down on the substrate; forming soldering wires coupled with the chip and the substrate; forming a support body on the substrate; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the mirror ink and the mirror ink reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process in which the package layer and the substrate are cut to form the chip package structure.
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公开(公告)号：US20240128291A1
公开(公告)日：2024-04-18
申请号：US18206146
申请日：2023-06-06
发明人： CHIA-SHUAI CHANG , CHIEN-HUNG LIN , WEI-LI WANG , WEN-FU YU , BAE-YINN HWANG
IPC分类号： H01L27/146 , H01L23/00
CPC分类号： H01L27/14618 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/29017 , H01L2224/32225 , H01L2224/48227 , H01L2224/73215
摘要： A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.
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公开(公告)号：US11764240B2
公开(公告)日：2023-09-19
申请号：US17731052
申请日：2022-04-27
发明人： Chia-Shuai Chang
IPC分类号： H01L27/146
CPC分类号： H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L27/14698
摘要： An image sensing chip package structure includes a chip, an adhesive loop and a light-transmissible substrate member. The chip includes an image sensing region. The adhesive loop is connected to the chip, and has an inner peripheral surface that defines a plurality of protrusions which surround the image sensing region of the chip. The light-transmissible substrate member is connected to the adhesive loop oppositely of the chip to cover the image sensing region of the chip. Methods of manufacturing the image sensing chip package structures are also provided.
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公开(公告)号：US20140110159A1
公开(公告)日：2014-04-24
申请号：US13960897
申请日：2013-08-07
申请人： Chien-Cheng Wei , Wu-Hui Cheng
发明人： Chien-Cheng Wei , Wu-Hui Cheng
CPC分类号： H05K1/0271 , H05K1/0265 , H05K1/0306 , H05K3/06 , H05K3/108 , H05K3/146 , H05K3/16 , H05K3/388 , H05K2201/0338 , H05K2201/09845 , H05K2203/058 , H05K2203/1476 , H05K2203/1572
摘要： A stress-reduced circuit board includes an insulating substrate, and first and second electrically conductive layers which are stacked one upon the other, and which respectively have peripheral marginal regions that are configured in a stepped arrangement. The first electrically conductive layer is configured to have an area dimension larger than that of the second electrically conductive layer and a thickness not greater than that of the second electrically conductive layer so as to minimize stress caused by a difference in coefficients of thermal expansion between the insulating substrate and the first and second electrically conductive layers.
摘要翻译： 应力降低电路板包括绝缘基板以及彼此堆叠的第一和第二导电层，并且分别具有以阶梯式布置的周边边缘区域。 第一导电层被配置为具有比第二导电层的面积尺寸更大的面积尺寸，并且其厚度不大于第二导电层的厚度，以便使由于第二导电层之间的热膨胀系数的差异而引起的应力最小化 绝缘基板和第一和第二导电层。
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公开(公告)号：US20140090825A1
公开(公告)日：2014-04-03
申请号：US14077430
申请日：2013-11-12
发明人： Wen-Chung CHIANG
IPC分类号： F28F3/12
CPC分类号： F28F3/12 , F28F21/04 , F28F21/085 , F28F2255/18 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed.
摘要翻译： 一种液冷式散热装置，包括限定液体室的室限制体，其适于容纳液体冷却剂，并且具有围绕液体室的周围壁;盖板，覆盖液体室并烧结结合到周围壁 与液体室空间连通的液体入口以及与液体室空间连通的液体出口。 还公开了制造液冷式散热装置的方法。
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