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公开(公告)号：US20240234457A1
公开(公告)日：2024-07-11
申请号：US18217681
申请日：2023-07-03
发明人： JUI-HUNG HSU , LI-CHUN HUNG , CHIEN-CHEN LEE
IPC分类号： H01L27/146
CPC分类号： H01L27/14623 , H01L27/14618 , H01L27/14636
摘要： A chip package structure includes a substrate, a chip, a light-permeable element, a first anti-reflective layer, and an adhesive element. The chip is disposed on the substrate. The light-permeable element is disposed above the chip. The light-permeable element has a first surface and a second surface opposite to each other, and the first surface faces the chip. The first anti-reflective layer covers at least part of the first surface. The adhesive element is connected between the chip and the light-permeable element, and the adhesive element separates the chip and the light-permeable element. The adhesive element and the first anti-reflective layer are not in contact with each other.
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公开(公告)号：US20240055453A1
公开(公告)日：2024-02-15
申请号：US17965742
申请日：2022-10-13
发明人： JUI-HUNG HSU , CHIEN-CHEN LEE , LI-CHUN HUNG
IPC分类号： H01L27/146
CPC分类号： H01L27/14623 , H01L27/14618 , H01L27/14636
摘要： A sensor package structure is provided and includes a substrate, a sensor chip mounted on the substrate, a supporting layer being ring-shaped and disposed on the sensor chip, a light-permeable layer, and a grooved shielding layer that is ring-shaped and that is disposed on a lower surface of the light-permeable layer. The grooved shielding layer includes an inner barrier and an outer barrier respectively located at two opposite sides of the supporting layer. An inner edge of the inner barrier has an opening directly located above a sensing region of the sensor chip. The inner barrier, the outer barrier, and a part of the lower surface of the light-permeable layer jointly define a ring-shaped groove. The part of the lower surface of the light-permeable layer is disposed on the supporting layer, so that a part of the supporting layer is arranged in the ring-shaped groove.
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公开(公告)号：US20240234475A9
公开(公告)日：2024-07-11
申请号：US18184976
申请日：2023-03-16
发明人： LI-CHUN HUNG , JUI-HUNG HSU , CHIEN-CHEN LEE
IPC分类号： H01L27/146 , H01L23/00
CPC分类号： H01L27/14683 , H01L24/48 , H01L24/85 , H01L27/14618 , H01L27/14636 , H01L2224/48227 , H01L2224/85801
摘要： A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; forming a mirror ink on the substrate; placing a chip upside-down on the substrate; forming soldering wires coupled with the chip and the substrate; forming a support body on the substrate; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the mirror ink and the mirror ink reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process in which the package layer and the substrate are cut to form the chip package structure.
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公开(公告)号：US20240234166A9
公开(公告)日：2024-07-11
申请号：US18526100
申请日：2023-12-01
发明人： LI-CHUN HUNG , JUI-HUNG HSU , CHIEN-CHEN LEE
IPC分类号： H01L21/52 , H01L23/00 , H01L23/04 , H01L27/146
CPC分类号： H01L21/52 , H01L23/041 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L27/14618 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247
摘要： A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; forming a support body on the substrate; providing at least one reflecting member at a periphery of the support body; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process to form the chip package structure.
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公开(公告)号：US20240136386A1
公开(公告)日：2024-04-25
申请号：US18184976
申请日：2023-03-15
发明人： LI-CHUN HUNG , JUI-HUNG HSU , CHIEN-CHEN LEE
IPC分类号： H01L27/146 , H01L23/00
CPC分类号： H01L27/14683 , H01L24/48 , H01L24/85 , H01L27/14618 , H01L27/14636 , H01L2224/48227 , H01L2224/85801
摘要： A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; forming a mirror ink on the substrate; placing a chip upside-down on the substrate; forming soldering wires coupled with the chip and the substrate; forming a support body on the substrate; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the mirror ink and the mirror ink reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process in which the package layer and the substrate are cut to form the chip package structure.
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公开(公告)号：US20240136202A1
公开(公告)日：2024-04-25
申请号：US18526100
申请日：2023-12-01
发明人： LI-CHUN HUNG , JUI-HUNG HSU , CHIEN-CHEN LEE
IPC分类号： H01L21/52 , H01L23/00 , H01L23/04 , H01L27/146
CPC分类号： H01L21/52 , H01L23/041 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L27/14618 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247
摘要： A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; forming a support body on the substrate; providing at least one reflecting member at a periphery of the support body; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process to form the chip package structure.
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公开(公告)号：US20230207709A1
公开(公告)日：2023-06-29
申请号：US18110637
申请日：2023-02-16
发明人： FU-CHOU LIU , JUI-HUNG HSU , YU-CHIANG PENG , CHIEN-CHEN LEE , YA-HAN CHANG , LI-CHUN HUNG
IPC分类号： H01L31/02 , H01L31/0203
CPC分类号： H01L31/02002 , H01L31/0203
摘要： A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 µm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
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公开(公告)号：US20230207708A1
公开(公告)日：2023-06-29
申请号：US18110610
申请日：2023-02-16
发明人： FU-CHOU LIU , JUI-HUNG HSU , YU-CHIANG PENG , CHIEN-CHEN LEE , YA-HAN CHANG , LI-CHUN HUNG
IPC分类号： H01L31/02 , H01L31/0203
CPC分类号： H01L31/02002 , H01L31/0203
摘要： A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 um. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
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公开(公告)号：US20230197863A1
公开(公告)日：2023-06-22
申请号：US18110666
申请日：2023-02-16
发明人： FU-CHOU LIU , JUI-HUNG HSU , YU-CHIANG PENG , CHIEN-CHEN LEE , YA-HAN CHANG , LI-CHUN HUNG
IPC分类号： H01L31/02 , H01L31/0203
CPC分类号： H01L31/02002 , H01L31/0203
摘要： A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
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