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公开(公告)号：US20230207709A1
公开(公告)日：2023-06-29
申请号：US18110637
申请日：2023-02-16
发明人： FU-CHOU LIU , JUI-HUNG HSU , YU-CHIANG PENG , CHIEN-CHEN LEE , YA-HAN CHANG , LI-CHUN HUNG
IPC分类号： H01L31/02 , H01L31/0203
CPC分类号： H01L31/02002 , H01L31/0203
摘要： A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 µm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
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公开(公告)号：US20230207708A1
公开(公告)日：2023-06-29
申请号：US18110610
申请日：2023-02-16
发明人： FU-CHOU LIU , JUI-HUNG HSU , YU-CHIANG PENG , CHIEN-CHEN LEE , YA-HAN CHANG , LI-CHUN HUNG
IPC分类号： H01L31/02 , H01L31/0203
CPC分类号： H01L31/02002 , H01L31/0203
摘要： A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 um. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
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公开(公告)号：US20230197863A1
公开(公告)日：2023-06-22
申请号：US18110666
申请日：2023-02-16
发明人： FU-CHOU LIU , JUI-HUNG HSU , YU-CHIANG PENG , CHIEN-CHEN LEE , YA-HAN CHANG , LI-CHUN HUNG
IPC分类号： H01L31/02 , H01L31/0203
CPC分类号： H01L31/02002 , H01L31/0203
摘要： A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
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