公开(公告)号：US20190226918A1

公开(公告)日：2019-07-25

申请号：US16341876

申请日：2017-09-13

申请人： Thomas Hand

发明人： Thomas Hand

IPC分类号： G01K1/14 ,  G01K1/16 ,  G01K7/22 ,  G01K13/02

摘要： A contact temperature sensor is disclosed. In an embodiment a contact temperature sensor has a contact body including a bottom wall configured to bring the contact temperature sensor in contact with a test piece, a heat-conducting metal sheet arranged on a side of the bottom wall facing towards the test piece, wherein the heat-conducting metal sheet is configured to conform to a surface shape of the test piece when the contact body is brought in contact with the test piece, a temperature sensor element and a heat-conducting pad arranged to thermally couple the temperature sensor element and the heat-conducting metal sheet, wherein the heat-conducting pad is in each case directly thermally coupled to the heat-conducting metal sheet and the temperature sensor element.

公开(公告)号：US12111201B2

公开(公告)日：2024-10-08

申请号：US17636738

申请日：2020-09-07

申请人： TDK Electronics AG

发明人： Michael Gebhart ,  Stefan Sax ,  Thomas Koidl ,  Michael Pirolt

IPC分类号： G01F23/2962

CPC分类号： G01F23/2962

摘要： In an embodiment a sensor system includes a housing, an electronic circuit and an ultrasonic distance sensor, wherein the electronic circuit and the ultrasonic distance sensor are arranged in the housing, and wherein the sensor system is configured to measure a distance between the sensor system and a surface of a material in a container by an echo propagation time of an ultrasonic burst in air.

公开(公告)号：US12102009B2

公开(公告)日：2024-09-24

申请号：US17112402

申请日：2020-12-04

申请人： Relyon Plasma GmbH ,  TDK Electronics AG

发明人： Stefan Nettesheim ,  Klaus Forster ,  Markus Puff ,  Johann Pichler

IPC分类号： H01L41/053 ,  H01G4/12 ,  H01G4/224 ,  H01G4/40 ,  H10N30/40 ,  H10N30/88

CPC分类号： H10N30/883 ,  H01G4/12 ,  H01G4/224 ,  H01G4/40 ,  H10N30/40

摘要： A device (1) comprising an electro-ceramic component (2) which has a first electrical contact (3A), provided on a first side face (2A) of the electro-ceramic component (2) in the excitation zone (11), and a second electrical contact (3B) provided on a second side face (2B) of the electro-ceramic component (2). A sealing compound (20) is placed around the electro-ceramic component (2) so that the first electrical contact (3A) and the second electrical contact (3B) are covered by the sealing compound (20) and a free end (26) of a section (24) of the high-voltage zone (12) of the electro-ceramic component (2) projects beyond a free end (22) of the sealing compound (20).

公开(公告)号：US12094673B2

公开(公告)日：2024-09-17

申请号：US16956406

申请日：2018-12-04

申请人： TDK Electronics AG

发明人： Robert Hoffmann ,  Jonas Weinhardt

IPC分类号： H01H50/54 ,  H01H47/00 ,  H01H50/02 ,  H01H50/18 ,  H01H50/64

CPC分类号： H01H47/002 ,  H01H50/023 ,  H01H50/18 ,  H01H50/546 ,  H01H50/641

摘要： A relay is disclosed. In an embodiment a relay includes a first switching contact having a first main contact, a second main contact and a first movable contact; a second switching contact having a third main contact, a fourth main contact and a second movable contact, wherein the second switching contact is electrically isolated from the first switching contact; and an actuator configured to move both the first and second movable contacts from a first switching state into a second switching state by moving a drive element of the actuator from a first position into a second position.

公开(公告)号：US20240288317A1

公开(公告)日：2024-08-29

申请号：US18572331

申请日：2022-05-30

申请人： TDK Electronics AG

发明人： Markus WEHRING ,  Daniel GILLE ,  Carsten DEHOFF

IPC分类号： G01K1/16 ,  G01K1/14

CPC分类号： G01K1/16 ,  G01K1/14

摘要： A measuring assembly for measuring a temperature of a test body is provided, wherein at least two separate wires suitable for thermal conduction are led away from a test body and combined into a wire bundle at a distance from the test body, and wherein a temperature sensor is attached to the wire bundle by clamping action by means of a holder. Preferably, the holder comprises a holder base having an inner side and an outer side, and spring clips connected thereto, wherein a recess for receiving a temperature sensor is arranged on the inner side of the holder base, and wherein two of the spring clips are arranged opposite each other with respect to the holder base and are adapted to generate a clamping force towards the inner side of the holder base.

公开(公告)号：US20240288315A1

公开(公告)日：2024-08-29

申请号：US18570302

申请日：2022-03-10

申请人： TDK Electronics AG

发明人： Jeremiah WELCH ,  Jason BLUME ,  Carsten DEHOFF, ,  Jordi BASIANA MARTÍ

IPC分类号： G01K1/08 ,  F16L59/02 ,  G01K1/143 ,  G01K13/02

CPC分类号： G01K1/08 ,  F16L59/029 ,  G01K1/143 ,  G01K13/02 ,  G01K2201/02

摘要： Assembly to protect a sensing device including a pipe configured for transportation of a fluid, a sensing device arranged on a peripheral surface of the pipe and in thermal contact with the pipe and a protection element for protection of the sensing device against mechanical impacts and for thermal isolation of the device against the environment.

公开(公告)号：US20240262035A1

公开(公告)日：2024-08-08

申请号：US18625468

申请日：2024-04-03

申请人： TDK Electronics AG

发明人： Thomas Lenzen ,  Reinhard Neureiter ,  Christoph Recher

IPC分类号： B29C64/165 ,  B29C64/205 ,  B29C64/232 ,  B29C64/236 ,  B29C64/245 ,  B29C64/264 ,  B29C64/35 ,  B29C64/357 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00

CPC分类号： B29C64/165 ,  B29C64/205 ,  B29C64/232 ,  B29C64/236 ,  B29C64/245 ,  B29C64/264 ,  B29C64/35 ,  B29C64/357 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00

摘要： A 3D printer for additively manufacturing a multilayer component. The 3D printer includes at least two separate dispensers coating a conveyor belt with respectively different raw material, a manufacturing unit in which at least part of the raw material is added to the component as a new layer, at least two separate recovery devices for selectively recovering the respectively different raw material, which is not consumed when a layer is added to the component, and for returning the raw material to the respective associated dispenser, and conveyor belt that transports the raw material from the dispenser to the manufacturing unit and further to the recovery device in the lateral direction.

公开(公告)号：US20240234019A1

公开(公告)日：2024-07-11

申请号：US18563043

申请日：2022-06-24

申请人： TDK Electronics AG

发明人： Felipe JEREZ GALDEANO ,  Thomas GIMPEL ,  Thomas LENZEN ,  Anneliese DRESPLING ,  Reinhard NEUREITER

IPC分类号： H01F27/29 ,  H01F17/00 ,  H02M3/04

CPC分类号： H01F27/292 ,  H01F17/0006 ,  H01F2017/004 ,  H02M3/04

摘要： An inductor with reduced losses is provided. The inductor comprises a first terminal, a second terminal and a conductor between the first terminal and the second terminal. The first terminal, the conductor and the second terminal establish a monolithic structure.

公开(公告)号：US12014852B2

公开(公告)日：2024-06-18

申请号：US17636286

申请日：2020-09-15

申请人： TDK Electronics AG

发明人： Jan Ihle ,  Thomas Bernert ,  Gerald Kloiber

IPC分类号： H01C7/04 ,  G01K7/22 ,  H01C1/14 ,  H01C17/075

CPC分类号： H01C7/041 ,  G01K7/22 ,  H01C1/1413 ,  H01C7/048 ,  H01C17/075

摘要： In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

公开(公告)号：US20240194623A1

公开(公告)日：2024-06-13

申请号：US18554923

申请日：2022-03-08

申请人： TDK ELECTRONICS AG

发明人： Mehrdad Shayganpoor ,  Guenter Aflenzer ,  Davor Tomassevic ,  Thomas Feichtinger

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L21/784 ,  H01L23/31

CPC分类号： H01L24/05 ,  H01L21/561 ,  H01L23/3171 ,  H01L24/02 ,  H01L24/03 ,  H01L24/06 ,  H01L24/95 ,  H01L21/784 ,  H01L2224/0231 ,  H01L2224/02331 ,  H01L2224/02371 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/03002 ,  H01L2224/03422 ,  H01L2224/05008 ,  H01L2224/05082 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/0529 ,  H01L2224/05339 ,  H01L2224/05347 ,  H01L2224/05548 ,  H01L2224/05583 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/06181 ,  H01L2224/95001 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/1203

摘要： A semiconductor die and a method for manufacturing a semiconductor die are disclosed. In an embodiment a semiconductor die includes a base body having a semiconductor material and a surface with two contact areas having contact pads at which the semiconductor die is electrically contactable and two metal caps arranged directly at the contact pads.