知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

42 条记录 (耗时 0.026 秒)

    Adhesive chuck, and apparatus and method for assembling substrates using the same
    2.
    发明授权
    Adhesive chuck, and apparatus and method for assembling substrates using the same 失效
    粘合剂卡盘，以及使用其组装基板的装置和方法

    公开(公告)号：US08361267B2

    公开(公告)日：2013-01-29

    申请号：US13035007

    申请日：2011-02-25

    申请人： Seok-Hee Shim

    发明人： Seok-Hee Shim

    IPC分类号： B29C65/18 ,  B32B37/14 ,  B23K37/04 ,  H05K3/36

    CPC分类号： H01L21/6831 ,  H01L21/67092 ,  H01L21/6875 ,  Y10S29/90 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/53265 ,  Y10T279/34

    摘要： An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an to operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.

    摘要翻译： 公开了一种粘合卡盘，以及用于组装使用其的基板的装置和方法。 该装置包括腔室，腔室内的第一粘合卡盘，并且具有多个粘合突起，以通过分子间吸引力粘附到从外部输送到腔室中的第一基底;以及驱动单元，用于将第一基底粘附到 第一粘合剂卡盘和彼此朝向彼此压缩和组装的第二基板。 该设备可以以最小的功耗实现基板的粘合和分离，从而提高了操作效率。 此外，粘合卡盘可以克服由剩余静电引起的显示面板上的斑点产生的问题。 此外，由于粘合卡盘几乎没有电不稳定性的问题，因此可以表现出高的稳定性和效率，并且可以以较低的成本制造。

    Substrate supporting apparatus
    3.
    发明授权
    Substrate supporting apparatus 有权
    基板支撑装置

    公开(公告)号：US08087652B2

    公开(公告)日：2012-01-03

    申请号：US12188453

    申请日：2008-08-08

    申请人： Suk Min Son

    发明人： Suk Min Son

    IPC分类号： B23P19/00

    CPC分类号： H01L21/68742 ,  H01L21/68778 ,  Y10S269/903

    摘要： A substrate supporting apparatus includes first and second shafts spaced by a distance that corresponds to or exceeds a width of a substrate, and at least one wire to support the substrate. The wire has ends coupled to respective ones of the first and second shafts. The wire is raised and lowered to place a substrate onto a lower electrode in a substrate processing chamber and to remove the substrate when processing is completed.

    摘要翻译： 基板支撑装置包括间隔一定距离的第一和第二轴，该距离对应于或超过基板的宽度，以及至少一根支撑基板的线。 电线具有连接到第一和第二轴中的相应端的端部。 线被升高和降低以将衬底放置在衬底处理室中的下电极上，并且当处理完成时移除衬底。

    ADHESIVE CHUCK, AND APPARATUS AND METHOD FOR ASSEMBLING SUBSTRATES USING THE SAME
    4.
    发明申请
    ADHESIVE CHUCK, AND APPARATUS AND METHOD FOR ASSEMBLING SUBSTRATES USING THE SAME 失效
    胶粘剂，以及使用其组装基材的装置和方法

    公开(公告)号：US20110187063A1

    公开(公告)日：2011-08-04

    申请号：US13035007

    申请日：2011-02-25

    申请人： Seok-Hee SHIM

    发明人： Seok-Hee SHIM

    IPC分类号： B23B31/02

    CPC分类号： H01L21/6831 ,  H01L21/67092 ,  H01L21/6875 ,  Y10S29/90 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/53265 ,  Y10T279/34

    摘要： An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an to operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.

    摘要翻译： 公开了一种粘合卡盘，以及用于组装使用其的基板的装置和方法。 该装置包括腔室，腔室内的第一粘合卡盘，并且具有多个粘合突起，以通过分子间吸引力粘附到从外部输送到腔室中的第一基底;以及驱动单元，用于将第一基底粘附到 第一粘合剂卡盘和彼此朝向彼此压缩和组装的第二基板。 该设备可以以最小的功耗实现基板的粘合和分离，从而提高了操作效率。 此外，粘合卡盘可以克服由剩余静电引起的显示面板上的斑点产生的问题。 此外，由于粘合卡盘几乎没有电不稳定性的问题，因此可以表现出高的稳定性和效率，并且可以以较低的成本制造。

    Substrate processing apparatus having electrode member
    7.
    发明授权
    Substrate processing apparatus having electrode member 失效
    具有电极部件的基板处理装置

    公开(公告)号：US08623173B2

    公开(公告)日：2014-01-07

    申请号：US12146790

    申请日：2008-06-26

    申请人： Hyoung-Kyu Son

    发明人： Hyoung-Kyu Son

    IPC分类号： C23C16/00 ,  H01L21/306 ,  F25B21/02

    CPC分类号： H01L21/67109

    摘要： An electrode member for generating plasma includes an electrode plate and a cooling unit having a plurality of thermoelectric modules that are thermally in contact with the electrode plate. The thermoelectric modules may regulate the temperature of the electrode plate based on the Peltier effect.

    摘要翻译： 用于产生等离子体的电极构件包括电极板和具有与电极板热接触的多个热电模块的冷却单元。 热电模块可以基于珀尔帖效应来调节电极板的温度。

    Substrate bonding apparatus
    8.
    发明授权
    Substrate bonding apparatus 失效
    基板接合装置

    公开(公告)号：US08245751B2

    公开(公告)日：2012-08-21

    申请号：US12260529

    申请日：2008-10-29

    申请人： Jae Seok Hwang

    发明人： Jae Seok Hwang

    IPC分类号： B32B37/10

    CPC分类号： B32B37/1018 ,  B32B37/0046 ,  B32B2457/20 ,  G02F1/1303 ,  G02F1/1339 ,  Y10T156/1126 ,  Y10T156/15 ,  Y10T156/17 ,  Y10T156/1928

    摘要： A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.

    摘要翻译： 提供了一种基板接合装置和方法。 基板接合装置可以包括具有与固定在其一侧的基板相对的接收表面的板，位于板的接收表面和基板之间的多个夹紧构件，以及将基板与基板分离的基板分离装置 夹紧构件。 基板分离装置包括用于推动基板以将基板与夹紧构件分离的推动器以及安装在基板的接收表面上的基板，该基板具有安装在其中的推动器的安装空间。 推动器通过位于安装空间一端的入口和出口突出出基板，以对基板加压。