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    Cooling hood for supporting printed circuit boards during burn-in
    81.
    发明授权
    Cooling hood for supporting printed circuit boards during burn-in 失效
    用于支持打印过程中打印的电路板的冷却盖

    公开(公告)号：US3697815A

    公开(公告)日：1972-10-10

    申请号：US3697815D

    申请日：1971-08-23

    Applicant: AEROTRONIC ASSOCIATES INC

    Inventor： GRANT JOHN ,  LONGLEY MINER R

    IPC: H05K7/20

    CPC classification number: H05K7/20009

    Abstract: Apparatus for burn-in of printed circuit boards, particularly a hood with electrical connections, supporting the printed circuit boards or trays in superposed, staggered relationship, and angularly disposed from the horizontal, so that the semiconductors under test are exposed outwardly in ambient air and the power-dissipating load resistors are exposed inwardly. Heat shields below the individual boards reduces thermal interaction between trays. The heat from the load resistors rises vertically with entrained air through the top of the hood. Since the boards are staggered, and angularly disposed, fresh ambient air is enhancingly entrained at each level with the result that each board is thermally isolated from the other.

    Abstract translation: 用于老化印刷电路板的设备，特别是具有电连接的罩，以重叠，交错的关系支撑印刷电路板或托盘，并且与水平方向成角度地设置，使得被测试的半导体在环境中向外暴露 空气和功率耗散负载电阻向内暴露。 单个板下面的隔热板减少了托盘之间的热交互。 来自负载电阻的热量通过引擎盖的顶部带有夹带的空气垂直地上升。 由于板是交错的并且角度地布置，所以新鲜的环境空气在每一级被增强地夹带，结果是每个板与另一个板热隔离。

    TRANSCEIVER HANDLE HEAT DISSIPATION AIRFLOW CHANNELING SYSTEM
    84.
    发明公开
    TRANSCEIVER HANDLE HEAT DISSIPATION AIRFLOW CHANNELING SYSTEM 审中-公开

    公开(公告)号：US20240237266A1

    公开(公告)日：2024-07-11

    申请号：US18094008

    申请日：2023-01-06

    Applicant: Dell Products L.P.

    Inventor： Shree Rathinasamy ,  Victor Teeter

    IPC: H05K7/20

    CPC classification number: H05K7/20009 ,  H05K7/2039

    Abstract: A transceiver handle heat dissipation airflow channeling system includes a transceiver device having a transceiver device chassis, at least one heat producing component that is housed in the transceiver device chassis, and a transceiver device handle that extends from the transceiver device chassis and that defines an airflow channel along its length. The transceiver device handle receives airflow at an airflow channel entrance defined by the transceiver device handle, directs the airflow through the airflow channel, and dissipates heat generated by the heat producing component(s) using the airflow directed through the airflow channel. For example, the airflow may be directed through the airflow channel and adjacent the heat producing component(s) in the transceiver device chassis, adjacent a heat dissipation device that is integrated with the transceiver device chassis, or adjacent a heat dissipation device that extends from a transceiver device port to which the transceiver device is connected.

    SOLID-STATE CIRCUIT BREAKER WITH A VENTILATION SYSTEM THAT USES MULTI-LAYERED COVERS TO VENTILATE FOR COOLING
    88.
    发明公开
    SOLID-STATE CIRCUIT BREAKER WITH A VENTILATION SYSTEM THAT USES MULTI-LAYERED COVERS TO VENTILATE FOR COOLING 审中-公开

    公开(公告)号：US20240049419A1

    公开(公告)日：2024-02-08

    申请号：US17817387

    申请日：2022-08-04

    Applicant: Siemens Industry, Inc.

    Inventor： Solomon R. Titus

    IPC: H05K7/20 ,  H05K5/03 ,  H05K5/02

    CPC classification number: H05K7/20009 ,  H05K5/03 ,  H05K5/0213

    Abstract: A solid-state circuit breaker or a residential circuit breaker includes a base housing semiconductors, electronics and advanced software algorithms. The base has a first profile area. It further includes a ventilation system for cooling the solid-state circuit breaker. The ventilation system includes a main cover configured to be mounted on the base by covering the first profile area of the base. The main cover has a second profile area such that the second profile area has an array of holes built-in the main cover. The ventilation system further includes an outer cover configured to be mounted on the main cover by covering the second profile area of the main cover to form an assembly of multi-layered covers. The outer cover has a third profile area such that the third profile area has an array of ribs built-in the outer cover.

    ELECTRONIC ASSEMBLY WITH GLIDE SURFACES AND RELATED METHODS
    89.
    发明公开
    ELECTRONIC ASSEMBLY WITH GLIDE SURFACES AND RELATED METHODS 审中-公开

    公开(公告)号：US20230389218A1

    公开(公告)日：2023-11-30

    申请号：US17804112

    申请日：2022-05-26

    Applicant: EAGLE TECHNOLOGY, LLC

    Inventor： CLARKE O. FOWLER ,  LAWRENCE LUDWIG, III

    IPC: H05K7/18 ,  H05K7/20

    CPC classification number: H05K7/18 ,  H05K7/20009

    Abstract: An electronic assembly includes a chassis having electronic module mounting positions. The electronic assembly also includes a respective electronic module received in each electronic module mounting position and having a module cooling gas passageway. Each electronic module has a module glide surface. The electronic assembly includes a respective sealing retainer coupled between the chassis and each electronic module. The sealing retainer has a cooling gas passageway aligned with a chassis cooling gas passageway and the module cooling gas passageway. The sealing retainer includes a retainer body having a retainer glide surface, and a gas sealing gasket carried by the retainer body. The module glide surface and the retainer glide surface have respective cooperating features so that the respective electronic module is maintained in spaced relation from the sealing gasket as the respective electronic module is slidably inserted into a seated position.

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