公开(公告)号：US07223638B2

公开(公告)日：2007-05-29

申请号：US10846722

申请日：2004-05-13

Applicant: Robert Starkston

Inventor： Robert Starkston

IPC: H01L21/00

CPC classification number: H01L24/10 ,  H01L23/04 ,  H01L23/3675 ,  H01L23/3735 ,  H01L24/13 ,  H01L24/32 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/163 ,  H01L2924/166 ,  H01L2924/19041 ,  H01L2924/00

Abstract: A thermally conductive member is placed adjacent a microelectronic die with a thermal interface material between the microelectronic die and a wetting layer formed on a surface of the thermally conductive member. The thermal interface material is heated to cause reflow thereof. The first portion of the thermal interface material is directed by the wetting layer into a first cavity formed in the thermally conductive member. The thermal interface material is then allowed to cool and solidify.

Abstract translation: 将导热构件放置在微电子管芯附近，在微电子管芯和形成在导热构件的表面上的润湿层之间具有热界面材料。 热界面材料被加热以引起其回流。 热界面材料的第一部分由润湿层引导到形成在导热构件中的第一空腔中。 然后将热界面材料冷却并固化。

公开(公告)号：US20050263878A1

公开(公告)日：2005-12-01

申请号：US11139960

申请日：2005-05-27

Applicant: Curtis Potter

Inventor： Curtis Potter

IPC: H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/12

CPC classification number: B81C1/00269 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A cold welded hermetic micro or nano package sealed in an inert atmosphere with optional force maintenence means for ensuring permanent closure. A package cap 410 coated with precursor weld material is sealed to a package base 405 containing integral device 445 then cold welded with an external force mechanism to compress and flow cold seal preform material 435 creating a hermetic peripheral seal in an inert or vacuum atmosphere. Arrays of devices can be sealed with individual caps or arrays of caps which are interconnected.

Abstract translation: 密封在惰性气氛中的冷焊密封微型或纳米封装，具有可选的维持力，用于确保永久性封闭。 涂覆有前体焊接材料的封装盖410被密封到包含整体设备445的封装基座405，然后用外力机构冷焊，以压缩和流动冷密封预制件材料435，以在惰性或真空气氛中产生密封的周边密封。 装置的阵列可以用互连的单个盖子或盖子阵列密封。

公开(公告)号：US20050242419A1

公开(公告)日：2005-11-03

申请号：US10837261

申请日：2004-04-30

Applicant: Joel Philliber

Inventor： Joel Philliber

IPC: H01L23/02 ,  H01L23/10

CPC classification number: H01L23/10 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/163 ,  Y10S257/924 ,  Y10S438/902 ,  Y10S438/975

Abstract: A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method is disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. The cap is attached to the device chip using single phase metal alloy to achieve sealed cavity over the circuit element. The single phase metal alloy allows the cap to be diffusion bonded to the device chip at a higher diffusivity thus allowing diffusion at a lower temperature, lower pressure, shorter period, or a combination of these.

Abstract translation: 公开了一种制造包括密封腔的装置的方法和体现该方法的装置。 为了制造该装置，制造了包括衬底和衬底上的至少一个电路元件的器件芯片。 此外，还制造了一个帽子。 使用单相金属合金将盖连接到器件芯片，以实现电路元件上的密封腔。 单相金属合金允许盖以更高的扩散率扩散接合到器件芯片，从而允许在较低温度，较低压力，较短周期或这些的组合下扩散。

公开(公告)号：US20050104204A1

公开(公告)日：2005-05-19

申请号：US10951868

申请日：2004-09-29

Applicant: Takashi Kawakubo ,  Takaaki Yasumoto ,  Kazuhiko Itaya

Inventor： Takashi Kawakubo ,  Takaaki Yasumoto ,  Kazuhiko Itaya

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/60 ,  H01L23/055 ,  H01L23/14 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H03H3/02 ,  H03H9/02 ,  H03H9/10 ,  H03H9/17 ,  H01L23/34

CPC classification number: B81C1/00301 ,  B81B2207/096 ,  H01L21/486 ,  H01L23/055 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/15313 ,  H01L2924/163 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H03H9/0547 ,  H03H9/105 ,  H01L2924/00014

Abstract: A wafer-level package comprises: a first substrate; an electric element provided on the first substrate; a second substrate; an internal electrode pad; a well; and an external electrode pad. The second substrate is opposed to the first substrate with a predetermined gap therebetween. The electric element is provided between the first and second substrates. The internal electrode pad extends onto a first surface of one of the first and the second substrates. The inner electrode pad is connected to the electric element. The well penetrates the one of the first and the second substrates to the internal electrode. The external electrode pad is provided on a second surface of the one of the first and the second substrates and extends onto an inner wall of the well and being connected with the internal electrode pad.

Abstract translation: 晶片级封装包括：第一衬底; 设置在所述第一基板上的电气元件; 第二基板; 内部电极焊盘; 一口井; 和外部电极焊盘。 第二基板与其间具有预定间隙的第一基板相对。 电元件设置在第一和第二基板之间。 内部电极焊盘延伸到第一和第二衬底之一的第一表面上。 内部电极焊盘连接到电气元件。 井将第一和第二基板中的一个穿透到内部电极。 外部电极焊盘设置在第一和第二基板之一的第二表面上并且延伸到阱的内壁并与内部电极焊盘连接。

公开(公告)号：US06888238B1

公开(公告)日：2005-05-03

申请号：US10616858

申请日：2003-07-09

Applicant: Yuan Li

Inventor： Yuan Li

IPC: H01L23/04 ,  H01L23/367 ,  H01L23/34

CPC classification number: H01L23/04 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A semiconductor package includes a chip carrier to receive a semiconductor with a dimension generally greater than 22 mm. The chip carrier has a first coefficient of thermal expansion that is larger than the coefficient of thermal expansion of the semiconductor. A heat spreader having parallel channels on opposite sides is attached to the chip carrier along the channels. The heat spreader has a second coefficient of thermal expansion that is smaller than or equal to the coefficient of thermal expansion of the chip carrier. The interplay between the heat spreader and the chip carrier can effectively reduce package warpage and maintain coplanarity within the specification.

Abstract translation: 半导体封装包括用于接收尺寸通常大于22mm的半导体的芯片载体。 芯片载体具有比半导体的热膨胀系数大的第一热膨胀系数。 在相对侧上具有平行通道的散热器沿着通道连接到芯片载体。 散热器具有小于或等于芯片载体的热膨胀系数的第二热膨胀系数。 散热器和芯片载体之间的相互作用可有效降低封装翘曲并保持规格内的共面性。

公开(公告)号：US20040244952A1

公开(公告)日：2004-12-09

申请号：US10883493

申请日：2004-07-01

Applicant: INTEL CORPORATION

Inventor： Sabina Houle ,  Ashay Dani

IPC: F28F013/18

CPC classification number: H01L23/36 ,  H01L23/10 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/16315

Abstract: An integrated heat spreader is presented. The heat spreader is constructed and arranged to be adhesively affixed, with a sealant, to at least a portion of a component, such as a substrate. The heat spreader includes a body portion, a lip portion substantially vertically oriented and integrally formed with the body portion, and a step portion integrally formed with the lip portion. As such, adhesion of the heat spreader to the sealant is increased, and failure due to shear stresses at the heat spreader bonding surface is prevented.

Abstract translation: 介绍了一个集成散热器。 散热器被构造和布置成通过密封剂粘合地固定到诸如基底的部件的至少一部分上。 散热器包括主体部分，基本上垂直定向并与主体部分一体形成的唇部，以及与唇部一体形成的台阶部。 因此，散热器对密封剂的粘附性增加，并且防止了在散热器接合表面处的剪切应力导致的故障。

公开(公告)号：US06627966B2

公开(公告)日：2003-09-30

申请号：US09853592

申请日：2001-05-14

Applicant: Seung Gyo Jeong ,  Ji Hwan Shin

Inventor： Seung Gyo Jeong ,  Ji Hwan Shin

IPC: H03H942

CPC classification number: H01L23/10 ,  C04B37/026 ,  C04B37/028 ,  C04B2237/12 ,  C04B2237/408 ,  C04B2237/74 ,  H01L21/50 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/163 ,  H01L2924/16315 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: In a method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter, when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer filter or a SAW filter, a first sealing is carried out between a ceramic main body and a metal case so as to protect the chip component, and then, a second sealing is carried out also between the metal case and the ceramic main body again, so that the shielding effect against external electromagnetic fields would be superior, and so that costs are reduced and so that a workability improvement can be realized, and so that the sealing can be made more secure. The first sealing is carried out on a step that is formed on the top of the ceramic main body to bond the metal case thereupon. The second sealing is carried out on the top of the ceramic main body to bond the metal case on the ceramic main body.

Abstract translation: 在用于密封SAW（表面声波）滤波器的陶瓷封装的方法和装置中，当制造诸如SAW双工器滤波器或SAW滤波器的环境敏感的SAW滤波器的陶瓷封装时，首先密封在 陶瓷主体和金属壳体，以保护芯片部件，然后再次在金属壳体和陶瓷主体之间进行第二密封，使得对外部电磁场的屏蔽效果将优异， 并且因此降低成本，并且可以实现可操作性的提高，并且能够使密封更可靠。 第一密封是在形成在陶瓷主体的顶部上的步骤上进行的，以将金属壳体接合在其上。 在陶瓷主体的顶部进行第二次密封，将金属壳体接合在陶瓷主体上。

公开(公告)号：US20030131975A1

公开(公告)日：2003-07-17

申请号：US10042182

申请日：2002-01-11

Inventor： Sabina Houle ,  Ashay Dani

IPC: F28F013/18 ,  F28F019/02 ,  F28F007/00

CPC classification number: H01L23/36 ,  H01L23/10 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/16315

Abstract: An integrated heat spreader is presented. The heat spreader is constructed and arranged to be adhesively affixed, with a sealant, to at least a portion of a component, such as a substrate. The heat spreader includes a body portion, a lip portion substantially vertically oriented and integrally formed with the body portion, and a step portion integrally formed with the lip portion. As such, adhesion of the heat spreader to the sealant is increased, and failure due to shear stresses at the heat spreader bonding surface is prevented.

Abstract translation: 介绍了一个集成散热器。 散热器被构造和布置成通过密封剂粘合地固定到诸如基底的部件的至少一部分上。 散热器包括主体部分，基本上垂直定向并与主体部分一体形成的唇部，以及与唇部一体形成的台阶部。 因此，散热器对密封剂的粘附性增加，并且防止了在散热器接合表面处的剪切应力导致的故障。

公开(公告)号：US20020062904A1

公开(公告)日：2002-05-30

申请号：US09853592

申请日：2001-05-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO.,LTD.

Inventor： Seung Gyo Jeong ,  Ji Hwan Shin

IPC: C03B029/00

CPC classification number: H01L23/10 ,  C04B37/026 ,  C04B37/028 ,  C04B2237/12 ,  C04B2237/408 ,  C04B2237/74 ,  H01L21/50 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/163 ,  H01L2924/16315 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter are disclosed, in which when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer filter or a SAW filter, a first sealing is carried out between a ceramic main body and a metal case so as to protect the chip component, and then, a second sealing is carried out also between the metal case and the ceramic main body again, so that the shielding effect against external electromagnetic fields would be superior, that a cost curtail and a workability improvement can be realized, and that the sealing can be made sure. The first sealing is carried out on a step which is formed on the top of the ceramic main body to bond the metal case thereupon. The second sealing is carried out on the top of the ceramic main body to bond the metal case on the ceramic main body.

Abstract translation: 公开了一种用于密封SAW（表面声波）滤波器的陶瓷封装的方法和装置，其中当制造诸如SAW双工器滤波器或SAW滤波器的环境敏感的SAW滤波器的陶瓷封装时，第一密封是 在陶瓷主体和金属壳体之间进行，以保护芯片部件，然后再次在金属壳体和陶瓷主体之间进行第二密封，使得对外部电磁场的屏蔽效应 优点在于可以实现成本缩减和可加工性改进，并且可以确保密封。 第一密封是在形成在陶瓷主体的顶部上的步骤上进行的，以将金属壳体接合在其上。 在陶瓷主体的顶部进行第二次密封，将金属壳体接合在陶瓷主体上。

公开(公告)号：US5950073A

公开(公告)日：1999-09-07

申请号：US932568

申请日：1997-09-19

Applicant: Michael J. Griffin, IV ,  Lovell B. Wiggins

Inventor： Michael J. Griffin, IV ,  Lovell B. Wiggins

IPC: H01L23/10 ,  H05K3/34 ,  H01L21/44

CPC classification number: H01L23/10 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/16152 ,  H01L2924/163 ,  H05K3/341

Abstract: A semiconductor package structure that includes placing self-adjusting stand-offs between the substrate and sealband of the cap, such that the gap between the cap and the chip can be controlled, thereby improving the thermal and fatigue performance of the overall package. The height of the stand-off is varied by controlling the application (i.e., the temperature and the timing) of the heat that is used by the soldering process normally used in the generation of solder joints. The control of the soldering procedure is calibrated to optimize the amount of the stand-off which is dissolved, melted and spalled until the optimum height of the stand-off is reached.

Abstract translation: 一种半导体封装结构，其包括在衬底和盖的密封带之间放置自调节支架，从而可以控制帽和芯片之间的间隙，从而提高整体封装的热疲劳性能。 通过控制通常用于焊接接头的焊接工艺使用的热量的应用（即，温度和时间）来改变支架的高度。 校准焊接程序的控制以优化待溶解，熔化和剥落的支架的量，直到达到最佳的间隔高度。