Method of determining adhesion quality and apparatus embodying the method
    2.
    发明申请
    Method of determining adhesion quality and apparatus embodying the method 失效
    确定粘附质量的方法和体现该方法的设备

    公开(公告)号:US20060170309A1

    公开(公告)日:2006-08-03

    申请号:US11049116

    申请日:2005-01-31

    Applicant: Joel Philliber

    Inventor: Joel Philliber

    CPC classification number: H03H3/02 H03H9/02094 H03H9/173 Y10T29/42

    Abstract: A method of determining adhesion quality and apparatus embodying the method are disclosed. The apparatus includes a substrate, a seed layer, and a resonator. The substrate defines a cavity and has a doped portion proximal to the cavity. The seed layer is disposed above the cavity. The resonator includes a bottom electrode on the seed layer, a piezoelectric portion on the bottom electrode, and a top electrode on the piezoelectric portion. To test the quality of adhesion of the seed layer to the substrate, one or more electrical property is measured between the doped portion and the bottom electrode and compared to a threshold value.

    Abstract translation: 公开了一种确定附着质量的方法和体现该方法的装置。 该装置包括衬底,种子层和谐振器。 衬底限定空腔并且具有靠近空腔的掺杂部分。 种子层设置在空腔上方。 谐振器包括种子层上的底部电极,底部电极上的压电部分和压电部分上的顶部电极。 为了测试种子层与基底的粘附质量,在掺杂部分和底部电极之间测量一个或多个电性能,并将其与阈值进行比较。

    Micromachined transducers and method of fabrication
    3.
    发明授权
    Micromachined transducers and method of fabrication 有权
    微机械传感器和制造方法

    公开(公告)号:US08329053B2

    公开(公告)日:2012-12-11

    申请号:US12623768

    申请日:2009-11-23

    CPC classification number: B81C1/00904 B81B2201/0271 H01L41/0805

    Abstract: In accordance with an illustrative embodiment, a method of fabricating a transducer is described. The method comprises providing a transducer over a first surface of a substrate, wherein the substrate comprises a thickness. The method further comprises patterning a mask over a second surface. The mask comprises an opening for forming a scribe etch. The method comprises etching through the opening in the mask and into but not through the thickness of the substrate to provide the scribe etch.

    Abstract translation: 根据说明性实施例,描述了一种制造换能器的方法。 该方法包括在衬底的第一表面上提供换能器,其中衬底包括厚度。 该方法还包括在第二表面上图案化掩模。 掩模包括用于形成刻划蚀刻的开口。 该方法包括通过掩模中的开口蚀刻而不是通过衬底的厚度,以提供刻划蚀刻。

    Micromachined horn
    4.
    发明授权
    Micromachined horn 有权
    微加工喇叭

    公开(公告)号:US08231795B2

    公开(公告)日:2012-07-31

    申请号:US12434092

    申请日:2009-05-01

    CPC classification number: H04R1/30 H01L27/20 H04R17/005 H04R2201/003 Y10T29/42

    Abstract: An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.

    Abstract translation: 声学装置包括通过基板的相对的第二表面的干蚀刻工艺形成在基板的第一表面上的换能器和形成在基板中的声喇叭。 声喇叭被定位成放大来自换能器的声波并且限定非线性横截面轮廓。

    Multi-frequency acoustic array
    5.
    发明申请
    Multi-frequency acoustic array 有权
    多声道阵列

    公开(公告)号:US20100327695A1

    公开(公告)日:2010-12-30

    申请号:US12494847

    申请日:2009-06-30

    CPC classification number: B06B1/0611 B06B1/0622

    Abstract: An apparatus comprises a substrate and transducers disposed over the substrate, each of the transducers comprising a different resonance frequency. A transducer device comprises circuitry configured to transmit signals, or to receive signals, or both. The transducer device also comprises a transducer block comprising a plurality of piezoelectric ultrasonic transducers (PMUT), wherein each of the PMUTs; and an interconnect configured to provide signals from the transducer block to the circuitry and to provide signals from the circuitry to the transducer block.

    Abstract translation: 一种装置包括衬底和设置在衬底上的换能器,每个换能器包括不同的共振频率。 换能器装置包括被配置为传输信号或接收信号或两者的电路。 换能器装置还包括一个包括多个压电超声波换能器(PMUT)的换能器块,其中每个PMUT; 以及被配置为将信号从所述换能器块提供给所述电路并且将所述电路的信号提供给所述换能器块的互连。

    MICROMACHINED HORN
    6.
    发明申请

    公开(公告)号:US20100278368A1

    公开(公告)日:2010-11-04

    申请号:US12434092

    申请日:2009-05-01

    CPC classification number: H04R1/30 H01L27/20 H04R17/005 H04R2201/003 Y10T29/42

    Abstract: An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.

    Abstract translation: 声学装置包括通过基板的相对的第二表面的干蚀刻工艺形成在基板的第一表面上的换能器和形成在基板中的声喇叭。 声喇叭被定位成放大来自换能器的声波并且限定非线性横截面轮廓。

    MICROMACHINED HORN
    8.
    发明申请

    公开(公告)号:US20120269372A1

    公开(公告)日:2012-10-25

    申请号:US13536917

    申请日:2012-06-28

    CPC classification number: H04R1/30 H01L27/20 H04R17/005 H04R2201/003 Y10T29/42

    Abstract: An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.

    Abstract translation: 声学装置包括通过基板的相对的第二表面的干蚀刻工艺形成在基板的第一表面上的换能器和形成在基板中的声喇叭。 声喇叭被定位成放大来自换能器的声波并且限定非线性横截面轮廓。

    Method of Determining Adhesion Quality
    10.
    发明申请
    Method of Determining Adhesion Quality 失效
    确定粘附质量的方法

    公开(公告)号:US20080000060A1

    公开(公告)日:2008-01-03

    申请号:US11855086

    申请日:2007-09-13

    Applicant: Joel Philliber

    Inventor: Joel Philliber

    CPC classification number: H03H3/02 H03H9/02094 H03H9/173 Y10T29/42

    Abstract: A method of determining adhesion quality and apparatus embodying the method are disclosed. The apparatus includes a substrate, a seed layer, and a resonator. The substrate defines a cavity and has a doped portion proximal to the cavity. The seed layer is disposed above the cavity. The resonator includes a bottom electrode on the seed layer, a piezoelectric portion on the bottom electrode, and a top electrode on the piezoelectric portion. To test the quality of adhesion of the seed layer to the substrate, one or more electrical property is measured between the doped portion and the bottom electrode and compared to a threshold value.

    Abstract translation: 公开了一种确定附着质量的方法和体现该方法的装置。 该装置包括衬底,种子层和谐振器。 衬底限定空腔并且具有靠近空腔的掺杂部分。 种子层设置在空腔上方。 谐振器包括种子层上的底部电极,底部电极上的压电部分和压电部分上的顶部电极。 为了测试种子层与基底的粘附质量,在掺杂部分和底部电极之间测量一个或多个电性能,并将其与阈值进行比较。

Patent Agency Ranking