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164 条记录 (耗时 0.021 秒)

    LED DEVICE WITH IMPROVED THERMAL PERFORMANCE
    81.
    发明申请
    LED DEVICE WITH IMPROVED THERMAL PERFORMANCE 有权
    具有改进的热性能的LED器件

    公开(公告)号：US20150140703A1

    公开(公告)日：2015-05-21

    申请号：US14603423

    申请日：2015-01-23

    申请人： TSMC Solid State Lighting Ltd.

    发明人： Hsing-Kuo Hsia ,  Chih-Kuang Yu ,  Gordon Kuo ,  Chyi Shyuan Chern

    IPC分类号： H01L33/64 ,  H01L33/54 ,  H01L33/58 ,  H01L25/075

    CPC分类号： H01L33/64 ,  H01L25/075 ,  H01L33/54 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.

    摘要翻译： 一种装置包括其中具有多个开口的晶片。 对于每个开口，LED器件以这样的方式耦合到导电载体和晶片，使得每个耦合的LED器件和导电载体的一部分至少部分地填充开口。 制造LED器件的方法包括在晶片中形成多个开口。 该方法还包括将发光二极管（LED）器件耦合到导电载体上。 具有导电载体的LED装置至少部分地填充每个开口。

    LIGHT SOURCE MODULE AND ELECTRONIC DEVICE
    82.
    发明申请
    LIGHT SOURCE MODULE AND ELECTRONIC DEVICE 有权
    光源模块和电子设备

    公开(公告)号：US20140332830A1

    公开(公告)日：2014-11-13

    申请号：US14177232

    申请日：2014-02-11

    申请人： HTC Corporation

    发明人： Fu-Cheng Fan ,  Chih-Jen Hu

    IPC分类号： H01L33/50 ,  H01L27/15

    CPC分类号： G02B6/005 ,  G02B6/001 ,  G09G5/10 ,  H01L25/075 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/502 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light source module and an electronic device are provided. The light source module includes a light guiding plate, at least one light-emitting element and a quantum dot element. The light guiding plate has a light incident surface and a light emitting surface. The at least one light-emitting element is disposed on the light incident surface to provide a first light beam, and includes yttrium aluminum garnet (YAG). The quantum dot element is disposed on the light emitting surface of the light guiding plate, and is configured to transfer part of the first light into a first monochromatic light. White light can be obtained by mixing by the first light and the first monochromatic light.

    摘要翻译： 提供了光源模块和电子设备。 光源模块包括导光板，至少一个发光元件和量子点元件。 导光板具有光入射面和发光面。 所述至少一个发光元件设置在所述光入射面上以提供第一光束，并且包括钇铝石榴石（YAG）。 量子点元件设置在导光板的发光表面上，并且被配置为将第一光的一部分转移到第一单色光中。 通过第一光和第一单色光的混合可以获得白光。

    SUBMOUNT WITH CAVITIES AND THROUGH VIAS FOR LED PACKAGING
    84.
    发明申请
    SUBMOUNT WITH CAVITIES AND THROUGH VIAS FOR LED PACKAGING 有权
    配有CAVITIES和通过VIED包装的VIAS

    公开(公告)号：US20140110728A1

    公开(公告)日：2014-04-24

    申请号：US14122929

    申请日：2012-06-01

    申请人： Shi-Wei Lee ,  Rong Zhang

    发明人： Shi-Wei Lee ,  Rong Zhang

    IPC分类号： H01L33/62 ,  H01L25/075

    CPC分类号： H01L33/62 ,  H01L24/16 ,  H01L25/075 ,  H01L33/502 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

    摘要： A wafer having a plurality of light-emitting diode (LED) submounts and a method for fabricating an LED submount are provided. Each of the plurality of LED submounts of the wafer includes: a substrate (201), including through vias (203a); an LED die (208) mounted in a cavity (204) on a first side of the substrate (201) and connected to the through vias (203a); a redistribution layer (205a) attached to a second side of the substrate (201) connected to the LED die (208) through the through vias (203a). The method includes providing a wafer as a substrate (201); providing a cavity (204) in the substrate (201) on a first side of the substrate (201); providing through vias (203a) in the substrate (201), providing a redistribution layer (205a) on the second side of the substrate (201), and mounting an LED (208) in the cavity (204), wherein the LED die (208) is connected to the redistribution layer (205a) through the through vias (203a).

    摘要翻译： 提供具有多个发光二极管（LED）底座的晶片和制造LED基座的方法。 晶片的多个LED基座中的每一个包括：包括通孔（203a）的衬底（201）; 安装在基板（201）的第一侧上的空腔（204）中并连接到通孔（203a）的LED管芯（208）; 通过通孔（203a）连接到连接到LED管芯（208）的衬底（201）的第二侧的再分布层（205a）。 该方法包括提供晶片作为衬底（201）; 在衬底（201）的第一侧上在衬底（201）中提供腔（204）; 通过所述衬底（201）中的通孔（203a）提供，在所述衬底（201）的第二侧上提供再分配层（205a），以及将LED（208）安装在所述空腔（204）中，其中所述LED管芯 208）通过通孔（203a）连接到再分配层（205a）。

    LIGHT EMITTING STRUCTURE AND LIGHTING UNITS THEREOF
    85.
    发明申请
    LIGHT EMITTING STRUCTURE AND LIGHTING UNITS THEREOF 审中-公开
    发光结构及其照明单位

    公开(公告)号：US20140063807A1

    公开(公告)日：2014-03-06

    申请号：US13666169

    申请日：2012-11-01

    申请人： Yi-Sho Liang

    发明人： Yi-Sho Liang

    IPC分类号： F21V21/00

    CPC分类号： G09F9/33 ,  H01L25/075 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A lighting unit includes a base and light emitting elements. At least a pin is disposed at the top of the base, and the light emitting units are provided on and electrically connected to the pin. At least a conductive hole is formed at a location in the base corresponding to the pin for communicating with the top and the bottom of the base. Also, a plurality of the lighting units are integrally arranged to form a light emitting structure.

    摘要翻译： 照明单元包括基座和发光元件。 至少一个销布置在基座的顶部，并且发光单元设置在销上并与其电连接。 至少导电孔形成在与销相对应的基座中的与基座的顶部和底部连通的位置处。 此外，多个照明单元一体地布置以形成发光结构。

    LIGHT EMITTING DEVICE
    86.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号：US20130148344A1

    公开(公告)日：2013-06-13

    申请号：US13670421

    申请日：2012-11-06

    申请人： Po-Jen Su ,  Yun-Li Li ,  Yi-Ju Shih ,  Cheng-Yen Chen ,  Gwo-Jiun Sheu

    发明人： Po-Jen Su ,  Yun-Li Li ,  Yi-Ju Shih ,  Cheng-Yen Chen ,  Gwo-Jiun Sheu

    IPC分类号： F21V9/00

    CPC分类号： H01L25/075 ,  H01L33/62 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light emitting device including an insulating substrate, a plurality of light emitting diode (LED) chips and a patterned conductive layer is provided. The insulating substrate has an upper surface. The LED chips are disposed on the insulating substrate and located on the upper surface. The dominant wavelengths of the LED chips are in a wavelength range of a specific color light and the dominant wavelengths of at least two of the LED chips are different. The patterned conductive layer is disposed between the insulating substrate and LED chips, and electrically connected to the LEDs chip.

    摘要翻译： 提供了包括绝缘基板，多个发光二极管（LED）芯片和图案化导电层的发光器件。 绝缘基板具有上表面。 LED芯片设置在绝缘基板上并位于上表面。 LED芯片的主要波长在特定颜色的光的波长范围内，并且至少两个LED芯片的主要波长是不同的。 图案化导电层设置在绝缘基板和LED芯片之间，并且电连接到LED芯片。

    Retrofit LED Lamp with Warm-White, More Particularly Flame-Like White Light
    88.
    发明申请
    Retrofit LED Lamp with Warm-White, More Particularly Flame-Like White Light 有权
    改装LED灯具暖白，更特别火焰般的白光

    公开(公告)号：US20120242245A1

    公开(公告)日：2012-09-27

    申请号：US13511558

    申请日：2010-11-29

    申请人： Peter Pachler

    发明人： Peter Pachler

    IPC分类号： H05B37/00 ,  H01J1/54

    CPC分类号： H01L25/075 ,  F21K9/23 ,  F21Y2101/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The invention relates to an LED lamp for warm white light having an LED module consisting of at least one colour-converted blue or UV LED, and at least one monochromatic LED, preferably a red LED, in the case of which the mixed spectrum produces white light with a colour temperature CCT of between 1500K and 2400K, preferably 1700K and 2100K at room temperature, and between 1800K and 2400K, preferably 2100K and 2300K at a stationary operating temperature of, for example, between 70° C. and 80° C. of the LED lamp.

    摘要翻译： 本发明涉及一种用于暖白光的LED灯，其具有由至少一个变色蓝色或UV LED组成的LED模块，以及至少一个单色LED，优选红色LED，在混合光谱产生白色 在室温下，在例如在70℃至80℃的固定工作温度下，色温CCT为1500K至2400K之间，优选为1700K和2100K，而在1800K至2400K之间，优选为2100K和2300K的光。 的LED灯。

    Foldable LED light recycling cavity
    89.
    发明授权
    Foldable LED light recycling cavity 有权
    可折叠LED灯回收腔

    公开(公告)号：US08197102B2

    公开(公告)日：2012-06-12

    申请号：US13200896

    申请日：2011-10-03

    申请人： William R. Livesay ,  Scott M. Zimmerman ,  Richard L. Ross

    发明人： William R. Livesay ,  Scott M. Zimmerman ,  Richard L. Ross

    IPC分类号： F21V7/00

    CPC分类号： H01L25/075 ,  H01L33/483 ,  H01L2924/0002 ,  H01L2924/00

    摘要： LEDs are mounted onto a flat, thermally conductive, substrate, which is folded to form a light recycling cavity. A planar substrate is first coated with a metal layer, which is patterned to electrically connect the LEDs and to form bonding pads for wirebonds to connect the LEDs to external circuitry. The LEDs are mounted on the substrate. The substrate is then scribed on the backside to form the folds. The LED dies are then attached onto the metal islands (pads) defined on the substrate and wirebonds are used to connect the top side of the LED to adjacent patterned metal islands (pads) on the substrate. The substrate is then folded into a light recycling cavity where the LEDs are facing the inside of the cavity.

    摘要翻译： LED被安装在平坦的导热基板上，该基板被折叠以形成光循环腔。 平面基板首先涂覆有金属层，其被图案化以电连接LED并且形成用于引线键合的接合焊盘，以将LED连接到外部电路。 LED安装在基板上。 然后在背面刻划底物以形成折痕。 然后将LED管芯附着在限定在衬底上的金属岛（焊盘）上，并且引线键用于将LED的顶侧连接到衬底上相邻的图案化金属岛（焊盘）。 然后将衬底折叠成光再循环腔，其中LED面向空腔的内部。