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公开(公告)号:US20140180093A1
公开(公告)日:2014-06-26
申请号:US14191553
申请日:2014-02-27
Applicant: Butterfly Network, Inc.
Inventor: Jonathan M. Rothberg , Nevada J. Sanchez , Gregory L. Charvat , Tyler S. Ralston
IPC: A61B8/08
CPC classification number: G01S7/52017 , A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B17/320068 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078 , G01S7/52019 , G01S7/52023
Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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公开(公告)号:US10782269B2
公开(公告)日:2020-09-22
申请号:US16109703
申请日:2018-08-22
Applicant: Butterfly Network, Inc.
Inventor: Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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公开(公告)号:US20200289094A1
公开(公告)日:2020-09-17
申请号:US16889944
申请日:2020-06-02
Applicant: Butterfly Network, Inc.
Inventor: Matthew de Jonge , Robert Schneider , David Elgena , Alex Rothberg , Jonathan M. Rothberg , Michal Sofka , Tomer Gafner , Karl Thiele , Abraham Neben
IPC: A61B8/00 , G06K9/00 , G06K9/62 , G06K9/46 , A61B8/08 , A61B8/06 , G06T7/70 , G06T19/00 , A61B8/02 , G06T7/00 , G06T11/60 , G06K9/66
Abstract: Aspects of the technology described herein relate to techniques for guiding an operator to use an ultrasound device. Thereby, operators with little or no experience operating ultrasound devices may capture medically relevant ultrasound images and/or interpret the contents of the obtained ultrasound images. For example, some of the techniques disclosed herein may be used to identify a particular anatomical view of a subject to image with an ultrasound device, guide an operator of the ultrasound device to capture an ultrasound image of the subject that contains the particular anatomical view, and/or analyze the captured ultrasound image to identify medical information about the subject.
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公开(公告)号:US20200269280A1
公开(公告)日:2020-08-27
申请号:US15930403
申请日:2020-05-12
Applicant: Butterfly Network, Inc.
Inventor: Jonathan M. Rothberg , Keith G. Fife , Gerard Schmid
IPC: B06B1/06 , B06B1/02 , H01L41/253 , H01L41/332 , H01L41/313 , A61B8/00
Abstract: Ultrasound devices including piezoelectric micromachined ultrasonic transducers (PMUTs) are described. Frequency tunable PMUT arrays are provided. The PMUTs may be formed on the same substrate or a different substrate than an integrated circuit substrate. The PMUTs may be formed in a variety of ways and from various suitable piezoelectric materials.
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公开(公告)号:US10707201B2
公开(公告)日:2020-07-07
申请号:US16197438
申请日:2018-11-21
Applicant: Butterfly Network, Inc.
Inventor: Jonathan M. Rothberg , Keith G. Fife , Nevada J. Sanchez , Susan A. Alie
IPC: B81B3/00 , B81B7/00 , H01L21/56 , H01L21/8238 , H01L23/522 , H01L23/528 , H01L27/06 , B06B1/02 , H01L27/092 , B81C1/00 , H01L21/3213 , H01L21/768 , A61B8/00
Abstract: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
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公开(公告)号:US10702242B2
公开(公告)日:2020-07-07
申请号:US15626771
申请日:2017-06-19
Applicant: Butterfly Network, Inc.
Inventor: Matthew de Jonge , Robert Schneider , David Elgena , Alex Rothberg , Jonathan M. Rothberg , Michal Sofka , Tomer Gafner , Karl Thiele , Abraham Neben
IPC: A61B8/00 , G06K9/00 , G06K9/62 , G06K9/46 , A61B8/08 , A61B8/06 , G06T7/70 , G06T19/00 , A61B8/02 , G06T7/00 , G06T11/60 , G06K9/66 , A61B90/00 , A61B34/20
Abstract: Aspects of the technology described herein relate to techniques for guiding an operator to use an ultrasound device. Thereby, operators with little or no experience operating ultrasound devices may capture medically relevant ultrasound images and/or interpret the contents of the obtained ultrasound images. For example, some of the techniques disclosed herein may be used to identify a particular anatomical view of a subject to image with an ultrasound device, guide an operator of the ultrasound device to capture an ultrasound image of the subject that contains the particular anatomical view, and/or analyze the captured ultrasound image to identify medical information about the subject.
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公开(公告)号:US10672974B2
公开(公告)日:2020-06-02
申请号:US16158999
申请日:2018-10-12
Applicant: Butterfly Network, Inc.
Inventor: Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Jaime Scott Zahorian
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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公开(公告)号:US20190261957A1
公开(公告)日:2019-08-29
申请号:US16285573
申请日:2019-02-26
Applicant: Butterfly Network, Inc.
Inventor: Maxim Zaslavsky , Matthew de Jonge , Tomer Gafner , Eamon Duffy , Jonathan M. Rothberg
IPC: A61B8/00 , G06T19/00 , G06F3/0482
Abstract: Aspects of the technology described herein relate to ultrasound data collection using tele-medicine. An instructor electronic device may generate for display an instructor augmented reality interface and receive, on the instructor augmented reality interface, an instruction for moving an ultrasound imaging device. The instructor augmented reality interface may include a video showing the ultrasound imaging device and a superposition of arrows on the video, where each of the arrows corresponds to a possible instruction for moving the ultrasound imaging device. A user electronic device may receive, from the instructor electronic device, an instruction for moving an ultrasound imaging device, and generate for display, on a user augmented reality interface shown on the user electronic device, the instruction for moving the ultrasound imaging device. The user augmented reality interface may include the video showing the ultrasound imaging device and an arrow superimposed on the video that corresponds to the instruction.
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公开(公告)号:US10247708B2
公开(公告)日:2019-04-02
申请号:US15178025
申请日:2016-06-09
Applicant: Butterfly Network, Inc.
Inventor: Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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公开(公告)号:US20180070917A1
公开(公告)日:2018-03-15
申请号:US15263868
申请日:2016-09-13
Applicant: Butterfly Network, Inc.
CPC classification number: A61B8/12 , A61B8/4245 , A61B8/445 , A61B8/4472 , A61B8/4477 , A61B8/4494 , A61B8/5207 , A61N7/022
Abstract: An ingestible ultrasound device includes an electronic circuit assembly, including a plurality of ultrasonic transducers and control circuitry configured to control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals; and an encapsulating medium that encapsulates the electronic circuit assembly.
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