公开(公告)号：US20050218010A1

公开(公告)日：2005-10-06

申请号：US11123274

申请日：2005-05-05

申请人： Zhihong Wang ,  You Wang ,  Daxin Mao ,  Renhe Jia ,  Stan Tsai ,  Yongqi Hu ,  Yuan Tian ,  Liang-Yuh Chen

发明人： Zhihong Wang ,  You Wang ,  Daxin Mao ,  Renhe Jia ,  Stan Tsai ,  Yongqi Hu ,  Yuan Tian ,  Liang-Yuh Chen

IPC分类号： B23H3/08 ,  B23H5/08 ,  C09G1/02 ,  C25F3/02 ,  H01L21/321 ,  H01L21/768

CPC分类号： C25F3/02 ,  B23H5/08 ,  C09G1/02 ,  H01L21/32125 ,  H01L21/7684

摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除 导电材料层。

公开(公告)号：US20050072689A1

公开(公告)日：2005-04-07

申请号：US10961499

申请日：2003-03-06

申请人： Reimar Spohr ,  Yu Apel ,  Yuri Korchev ,  Zuzanna Siwy ,  Masaru Yoshida

发明人： Reimar Spohr ,  Yu Apel ,  Yuri Korchev ,  Zuzanna Siwy ,  Masaru Yoshida

IPC分类号： B01D67/00 ,  C25F3/02 ,  H01L21/00

CPC分类号： C25F3/02 ,  B01D67/003 ,  B01D67/0032 ,  B01D2325/26

摘要： In an electrolytic cell a membrane consisting of dielectric material such as an organic polymer, which separates two chambers of the electrolytic cell from each other is produced using an etching solution which is provided in one of the chambers, contains active etching ions, while the other chamber contains a solution, which does not have an etching action. An electrical field is generated through the membrane. The etching progresses along ion tracks in the membrane and first produces one funnel-shaped pore per ion track. Immediately prior to the breakthrough, the ions, which do not have an etching action, begin to penetrate the still existent thin layer with fine pores—the active layer—and displace the ions with an etching action. An intensified electric current, driven by the adjacent field, is established and the etching process at the bottom of the pore shifts sideways according to the concentration of etching ions still present. The process is stopped by deactivating the field and flushing the membrane.

摘要翻译： 在电解槽中，使用设置在其中一个室中的蚀刻溶液来制造由诸如有机聚合物的电介质材料构成的膜，其将电解槽的两个室彼此分开，其中包含活性蚀刻离子，而另一个 室含有不具有蚀刻作用的溶液。 通过膜产生电场。 蚀刻沿膜中的离子轨道进行，并且首先在离子轨道上产生一个漏斗形孔。 在突破之前，不具有蚀刻作用的离子开始穿透具有细孔的仍然存在的薄层 - 活性层 - 并且用蚀刻作用置换离子。 建立由相邻场驱动的强化电流，并且孔底部的蚀刻工艺根据仍然存在的蚀刻离子的浓度向侧面移动。 通过停用场并冲洗膜来停止该过程。

公开(公告)号：US6103095A

公开(公告)日：2000-08-15

申请号：US32433

申请日：1998-02-27

申请人： Kishore K. Chakravorty

发明人： Kishore K. Chakravorty

IPC分类号： C25F3/02 ,  C25F3/14 ,  H01J9/02 ,  H01J9/14 ,  H01L21/3063 ,  B23H3/00 ,  B23H5/00 ,  C25F3/00 ,  C25F7/00 ,  H05K3/07

CPC分类号： H01J9/022 ,  C25F3/14

摘要： A method for selectively wet etching material during the formation of a field emission display device. In one embodiment, the selective wet etching method comprises immersing, in a fluid bath, a structure having a conductive row layer and a resistor layer. The structure further includes a pad area. In this embodiment, the fluid bath includes an organic-acid etchant. The present embodiment then applies a potential to the structure such that exposed regions of the resistor layer are selectively wet etched without significantly etching the conductive row layer or the pad area. In so doing, the present embodiment etches selected materials without requiring the use of highly toxic and hazardous conventional etchants.

摘要翻译： 一种用于在形成场发射显示装置期间选择性湿蚀刻材料的方法。 在一个实施例中，选择性湿蚀刻方法包括在流体槽中浸渍具有导电行层和电阻层的结构。 该结构还包括垫区域。 在该实施例中，流体浴包括有机酸蚀刻剂。 本实施例然后对结构施加电位，使得电阻层的暴露区域被选择性地湿蚀刻，而不显着蚀刻导电行层或焊盘区域。 在这样做时，本实施例蚀刻所选择的材料，而不需要使用高毒性和危险的常规蚀刻剂。

公开(公告)号：US6095160A

公开(公告)日：2000-08-01

申请号：US055734

申请日：1998-04-06

申请人： Xi Chu

发明人： Xi Chu

IPC分类号： G11B5/84 ,  C25F3/02

CPC分类号： G11B5/8404

摘要： A method for cleaning the surface of magnetic disks prior to the deposition of a metal layer on the magnetic disk. The method includes the steps of first, placing a magnetic disk into a magnetron assisted DC plasma chamber. The plasma chamber includes a vacuum chamber, one or more targets, one or more magnets, a noble gas source, a target power supply, and a DC bias power supply. Next, a noble gas, for example argon, is introduced into the vacuum chamber via the noble gas source, and a DC glow discharge is generated in the vacuum chamber by supplying power to the one or more targets using the target power supply. Finally, the magnetic disk is etched when a negative voltage is applied to the magnetic disk using the DC bias power supply.

摘要翻译： 一种在将金属层沉积在磁盘上之前清洁磁盘表面的方法。 该方法包括以下步骤：首先将磁盘放置在磁控管辅助DC等离子体室中。 等离子体室包括真空室，一个或多个靶，一个或多个磁体，惰性气体源，目标电源和DC偏压电源。 接下来，通过惰性气体源将惰性气体，例如氩气引入真空室中，并且通过使用目标电源向一个或多个靶子供电，在真空室中产生DC辉光放电。 最后，当使用DC偏置电源向磁盘施加负电压时，磁盘被蚀刻。

公开(公告)号：US5834140A

公开(公告)日：1998-11-10

申请号：US715104

申请日：1996-09-18

申请人： Adam M. Wolski ,  Michel Streel ,  Akitoshi Suzuki ,  Hideo Otsuka

发明人： Adam M. Wolski ,  Michel Streel ,  Akitoshi Suzuki ,  Hideo Otsuka

IPC分类号： C25D1/04 ,  C25F3/02 ,  H05K1/09 ,  H05K3/00

CPC分类号： C25D1/04 ,  H05K1/09 ,  H05K2201/0355 ,  Y10S428/935 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/1291 ,  Y10T428/12993

摘要： The present invention is an electrodeposited copper foil characterised in that roughening treatment is performed on a matte side of an untreated copper foil wherein the surface roughness R.sub.z of the matte side of the untreated copper foil is the same as or less than the surface roughness R.sub.z of the shiny side of this untreated copper foil. The electrodeposited copper foil is made by electrodepositing copper onto a drum from an electrolyte which contains 0.05 to 5 ppm 3-mercapto 1-propanesulfonate; at least one organic compound selected from 0.1 to 15 ppm of a polysaccharide which is a carbohydrate such as starches, celluloses and vegetable rubbers, and 0.3 to 35 ppm of a low molecular weight glue having a weight average molecular weight of 10,000 or less; and 10 to 60 ppm of a chloride ion. The copper foil may be used in making a printed circuit board or as a component of a secondary battery cell.

摘要翻译： 本发明是一种电沉积铜箔，其特征在于，在未处理铜箔的无光泽面上进行粗糙化处理，其中未处理铜箔的无光泽面的表面粗糙度Rz与表面粗糙度Rz相同或小于 这个未经处理的铜箔的光泽面。 电沉积铜箔通过从含有0.05-5ppm 3-巯基1-丙磺酸盐的电解质将铜电沉积到鼓上制成， 至少一种选自0.1至15ppm的多糖，其为碳水化合物如淀粉，纤维素和植物橡胶，和0.3至35ppm的重均分子量为10,000或更小的低分子量胶; 和10〜60ppm的氯离子。 铜箔可用于制造印刷电路板或二次电池单元的组件。

公开(公告)号：US5804052A

公开(公告)日：1998-09-08

申请号：US750314

申请日：1996-11-26

申请人： Reinhard Schneider

发明人： Reinhard Schneider

IPC分类号： C25D5/22 ,  C25D5/00 ,  C25D7/00 ,  C25F3/02 ,  C25F7/00 ,  H01L21/3063 ,  H05K3/07 ,  H05K3/24 ,  C25D5/02

CPC分类号： H05K3/07 ,  C25D21/00 ,  C25D7/0657 ,  C25F3/02 ,  C25F7/00 ,  H05K3/241 ,  Y10S204/07

摘要： The invention relates to a method for continuous uniform electrolytic metallizing or etching of metal surfaces, and to a device suitable for carrying out this method. The invention is particularly suitable for treating printed circuit boards and conductive films in installations through which the metal surface being treated passes horizontally. In order to avoid metal coatings of differing thicknesses being deposited on narrow and wide conductor strips in printed circuit boards, according to the present invention operation is with movable, preferably rotating roller-shaped intermediate electrodes, which roll without short circuit at a very close effective distance above the metal surface being treated, or which contact the surface in a wiping manner. These intermediate electrodes are not electrically connected to the source of bath current, thus serving as bipolar electrodes, and are located between the surface being treated and a suitable counter-electrode.

摘要翻译： PCT No.PCT / DE95 / 00706 Sec。 371日期1996年11月26日 102（e）日期1996年11月26日PCT提交1995年5月26日PCT公布。 WO95 / 33086 PCT出版物 日期1995年12月7日本发明涉及金属表面的连续均匀电解金属化或蚀刻的方法以及适用于实施该方法的装置。 本发明特别适用于处理经过水平处理的金属表面的设备中的印刷电路板和导电膜。 为了避免不同厚度的金属涂层沉积在印刷电路板的狭窄和宽的导体条上，根据本发明，操作是可移动的，优选旋转的辊状中间电极，它们以非常接近的有效的方式滚动而没有短路 在正在处理的金属表面之上的距离，或者以擦拭方式接触表面。 这些中间电极不与电流源电连接，因此用作双极电极，并且位于待处理的表面和合适的对电极之间。

公开(公告)号：US5792333A

公开(公告)日：1998-08-11

申请号：US874760

申请日：1997-06-13

申请人： Ryoichi Oguro ,  Tadao Nakaoka ,  Kazuyuki Inoue ,  Kazuhiro Hoshino

发明人： Ryoichi Oguro ,  Tadao Nakaoka ,  Kazuyuki Inoue ,  Kazuhiro Hoshino

IPC分类号： C25D1/04 ,  C23F11/00 ,  C25D3/38 ,  C25D5/18 ,  C25D5/48 ,  C25F3/02 ,  H05K3/38

CPC分类号： C25D5/48 ,  C25D3/38 ,  C25D5/18 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723

摘要： A method of surface-roughening a copper foil by subjecting at least one side of the copper foil to electro-plating using an alternating current, wherein a sulfuric acid bath or a sulfuric acid-copper sulfate bath is used as an electrolyte.

摘要翻译： 通过使用铜箔的至少一面使用交流电进行电镀，其中使用硫酸浴或硫酸 - 硫酸铜浴作为电解液，对铜箔进行表面粗糙化的方法。

公开(公告)号：US5702586A

公开(公告)日：1997-12-30

申请号：US266770

申请日：1994-06-28

申请人： Pehr E. Pehrsson ,  Michael L. Marchywka

发明人： Pehr E. Pehrsson ,  Michael L. Marchywka

IPC分类号： C30B29/04 ,  C25F3/00 ,  C25F3/02 ,  C25F3/16

CPC分类号： C25F3/02

摘要： Process of smoothing or polishing a diamond surface to reduce asperities reon to a level as low as about 20 nm from the horizontal by implanting the diamond surface with ions to form a non-diamond carbon damage layer on or below the diamond surface below the disparity depth and dissolving the non-diamond carbon by submerging the non-diamond carbon in a liquid having sufficient electric field to dissolve the non-diamond carbon.

摘要翻译： 通过用离子注入金刚石表面以在金刚石表面上或下方在视差深度之下或之下形成非金刚石碳损伤层，使平滑或抛光金刚石表面以将其中的凹凸减少到距水平约20nm的水平的过程 并通过将非金刚石碳浸没在具有足够电场的液体中来溶解非金刚石碳以溶解非金刚石碳。

公开(公告)号：US5641391A

公开(公告)日：1997-06-24

申请号：US440949

申请日：1995-05-15

申请人： Ian W. Hunter ,  Serge R. Lafontaine ,  John D. Madden

发明人： Ian W. Hunter ,  Serge R. Lafontaine ,  John D. Madden

IPC分类号： C25D5/02 ,  C25F3/02 ,  C25D5/00 ,  C25D5/08 ,  C25D7/06 ,  C25F3/00

CPC分类号： C25D5/02 ,  C25D1/003 ,  C25D5/026 ,  C25D5/04 ,  C25F3/02 ,  Y10S977/856 ,  Y10S977/857 ,  Y10S977/888 ,  Y10S977/89

摘要： Embodiments of the present invention provide a new method for producing a three dimensional object, particularly suited to microfabrication applications. The method includes the steps of providing a substrate with a conducting interface, an electrode having a feature or features that are small relative to the substrate, and a solution. The solution has a reactant that will either etch the substrate or deposit a selected material in an electrochemical reaction. The electrode feature is placed close to but spaced from the interface. A current is passed between the electrode and the interface, through the solution, inducing a localized electrochemical reaction at the interface, resulting in either the deposition of material or the etching of the substrate. Relatively moving the electrode and the substrate along a selected trajectory, including motion normal to the interface, enables the fabrication of a three dimensional object. In an alternative embodiment, current is passed through an orifice placed close to but spaced from the substrate surface, and may be accompanied by forced convection through the orifice. The method provides the potential to fabricate using many materials, including metals, alloys, polymers and semiconductors in three dimensional forms and with sub-micrometer spatial resolution.

摘要翻译： 本发明的实施例提供了一种特别适用于微细加工应用的三维物体的制造方法。 该方法包括以下步骤：提供具有导电界面的基底，具有相对于基底的特征或特征的电极以及溶液。 该溶液具有将蚀刻底物或在电化学反应中沉积所选择的材料的反应物。 电极特征靠近界面放置。 在电极和界面之间通过溶液通过电流，在界面处引起局部电化学反应，导致材料的沉积或衬底的蚀刻。 沿着选定的轨迹（包括垂直于界面的运动）使电极和衬底相对移动，能够制造三维物体。 在替代实施例中，电流通过靠近但与衬底表面间隔开的孔，并且可伴随着通过孔的强制对流。 该方法提供使用许多材料（包括金属，合金，聚合物和半导体）以三维形式和亚微米空间分辨率来制造的潜力。

公开(公告)号：US5624626A

公开(公告)日：1997-04-29

申请号：US475358

申请日：1995-06-07

申请人： Thomas J. Walz ,  Issak S. Rossovsky

发明人： Thomas J. Walz ,  Issak S. Rossovsky

IPC分类号： C04B41/53 ,  C04B41/91 ,  C25F1/00 ,  C25F3/02 ,  B06B1/02

CPC分类号： C04B41/009 ,  C04B41/5384 ,  C04B41/91 ,  C25F1/00 ,  C25F3/02

摘要： The present invention provides a method for treating a ceramic body to provide a wettable surface on the ceramic body. According to the present invention, a ceramic body is immersed in an alkaline hydroxide solution. The ceramic body is connected to form the anode and a suitable metal is connected to form the cathode of an electrolytic cell. A difference in electrical potential is imposed across the electrolytic cell which is sufficient to remove portions of the ceramic body to provide a pitted surface on the ceramic body which is wettable.

摘要翻译： 本发明提供一种处理陶瓷体以在陶瓷体上提供可润湿表面的方法。 根据本发明，将陶瓷体浸渍在碱性氢氧化物溶液中。 陶瓷体连接形成阳极，连接合适的金属，形成电解槽的阴极。 在电解池上施加电位差，其足以去除陶瓷体的部分，以在陶瓷体上提供可润湿的凹坑表面。