摘要:
A grinder including a motor, a switch operated ON and OFF in accordance with an operation of a switch lever to control a rotation of an output shaft of the motor, a spindle that rotates in accordance with the rotation of the output shaft to rotate a disk-shaped grinding wheel and a brake mechanism controllable with respect to a brake plate that integrally rotates with the output shaft, in a housing, the brake plate includes fins.
摘要:
A power tool includes a housing. A motor is housed in the housing. A platen is driven by the motor. The housing includes a first housing part, a second housing part and a third housing part. The housing defines a battery receptacle portion configured to receive a removable battery pack which powers the motor. Each of the first housing part, the second housing part and the third housing part form part of the battery receptacle portion.
摘要:
A cutting tool mechanism 11 for providing a cutting, abrading or grinding action is disclosed. The mechanism 11 has an inner circular part 17 having teeth 19 extending radially outwardly, a surrounding circular part 25 having inner teeth 27 extending radially inwardly. The circular parts 17 and 25 co-operate by engagement their teeth 19 and 27. Rotation of one circular part causes the other to move constrained by the engagement of the teeth in an orbital, oscillatory or impact motion. An input coupling 81 is provided for transmission of rotary motion, and an output coupling 37 is provided to transmit said orbital, oscillatory or impact motion to a blade 13. In further embodiments, the surrounding circular part 25 can be provided with outwardly extending teeth and surrounded by a further outer circular part with inwardly extending teeth, to cooperate with the outwardly extending teeth, to provide more complex orbital, oscillatory or impact motion.
摘要:
A polishing apparatus and a polishing method capable of detecting whether a polishing tool has been brought into contact with a substrate, such as a wafer, and further capable of detecting a position of the polishing tool are disclosed. The polishing apparatus includes a substrate holder configured to hold a substrate, a pressing member configured to press a polishing tool against a surface of the substrate, an actuator configured to apply a pressing force to the pressing member, a motor-drive moving device configured to move the pressing member along the surface of the substrate, and a monitoring device configured to emit an alarm if a motor current supplied to the motor-drive moving device is smaller than a threshold value.
摘要:
A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the drive rotary union, and receiving the flow of fluid from the drive rotary union through a second conduit in a sealed-up state; a carrier attached to an end part of the driven rotary union to adsorb/detach a wafer using a fluid pressure provided through a third conduit connected through the second conduit; and a filter filtering pollution material in the fluid flowing in and out of the third conduit on the periphery of the carrier to prevent the pollution material from escaping external to the carrier, the pollution material generated from rotation of the drive rotary union and driven rotary unions.
摘要:
A head for an orbital abrading machine comprising a housing, a shroud including inner and outer portions, defining a chamber between the inner and outer portions, a drive means for driving an abrading pad, the drive means at least partially enclosed by the housing and the shroud, wherein the drive means produces an exhaust which is directly vented into the chamber without leaving the head, and wherein the chamber includes at least one opening for directing the exhaust toward the abrading pad for cooling the pad with the exhaust.
摘要:
A floor treatment apparatus includes a frame, a housing which is rotatable with respect to the frame according to a main axis, at least three head pulleys which are rotatable with respect to the housing according to respective head axes which are regularly spaced around, and which are parallel to, the main axis, a motor supported by the frame, a drive pulley which is drivable by the motor, a main belt tensioning pulley and a main belt which is slung around the drive pulley, the head pulleys and the main belt tensioning pulley. Further an auxiliary pulley is coaxially connected to the main belt tensioning pulley. A fixed pulley is connected to the frame. An auxiliary belt is slung around the auxiliary pulley and the fixed pulley for rotating the housing with respect to the frame.
摘要:
A floor treatment apparatus includes a frame, a housing which is rotatable with respect to the frame according to a main axis, at least three head pulleys which are rotatable with respect to the housing according to respective head axes which are regularly spaced around, and which are parallel to, the main axis, a motor supported by the frame and a main belt drivable by the motor and being slung around the drive pulley and the driven head pulleys. Furthermore, the main belt is slung around a first auxiliary pulley and a second auxiliary pulley. The second auxiliary pulley is driven by the first auxiliary pulley. An auxiliary belt is slung around a fixed pulley connected to the frame and around the second auxiliary pulley for rotating the housing with respect to the frame.