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公开(公告)号：US10571407B2
公开(公告)日：2020-02-25
申请号：US16400644
申请日：2019-05-01
Applicant: KLA-Tencor Corporation
Inventor： Stefano Palomba , Pavel Kolchin , Mikhail Haurylau , Robert M. Danen , David W. Shortt
Abstract: Systems and methods for determining information for defects on a wafer are provided. One system includes an illumination subsystem configured to direct light having one or more illumination wavelengths to a wafer. The one or more illumination wavelengths are selected to cause fluorescence from one or more materials on the wafer without causing fluorescence from one or more other materials on the wafer. The system also includes a detection subsystem configured to detect only the fluorescence from the one or more materials or to detect non-fluorescent light from the wafer without detecting the fluorescence from the one or more materials. In addition, the system includes a computer subsystem configured to determine information for defects on the wafer using output generated by the detection subsystem responsive to the detected fluorescence or the detected non-fluorescent light.
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公开(公告)号：US10416088B2
公开(公告)日：2019-09-17
申请号：US15784187
申请日：2017-10-16
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy , Saibal Banerjee
Abstract: Methods and systems for determining one or more characteristics for defects detected on a specimen are provided. One system includes one or more computer subsystems configured for identifying a first defect that was detected on a specimen by an inspection system with a first mode but was not detected with one or more other modes. The computer subsystem(s) are also configured for acquiring, from the storage medium, one or more images generated with the one or more other modes at a location on the specimen corresponding to the first defect. In addition, the computer subsystem(s) are configured for determining one or more characteristics of the acquired one or more images and determining one or more characteristics of the first defect based on the one or more characteristics of the acquired one or more images.
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公开(公告)号：US10267748B2
公开(公告)日：2019-04-23
申请号：US15782820
申请日：2017-10-12
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Sarath Shekkizhar , Prasanti Uppaluri
Abstract: Methods and systems for training an inspection-related algorithm are provided. One system includes one or more computer subsystems configured for performing an initial training of an inspection-related algorithm with a labeled set of defects thereby generating an initial version of the inspection-related algorithm and applying the initial version of the inspection-related algorithm to an unlabeled set of defects. The computer subsystem(s) are also configured for altering the labeled set of defects based on results of the applying. The computer subsystem(s) may then iteratively re-train the inspection-related algorithm and alter the labeled set of defects until one or more differences between results produced by a most recent version and a previous version of the algorithm meet one or more criteria. When the one or more differences meet the one or more criteria, the most recent version of the inspection-related algorithm is outputted as the trained algorithm.
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公开(公告)号：US10267746B2
公开(公告)日：2019-04-23
申请号：US14918394
申请日：2015-10-20
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy , Ajay Gupta , Thanh Huy Ha
IPC: G01N21/88 , G01N23/00 , G01N21/95 , G03F7/20 , G01N21/956
Abstract: Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.
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公开(公告)号：US10215713B2
公开(公告)日：2019-02-26
申请号：US15626123
申请日：2017-06-18
Applicant: KLA-Tencor Corporation
Inventor： Pavel Kolchin , Mikhail Haurylau , Junwei Wei , Dan Kapp , Robert Danen , Grace Chen
IPC: G01N21/00 , G01N21/95 , G01N21/956 , G01N21/47 , G01N21/88
Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).
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Patent Agency Ranking
公开(公告)号：US10186026B2
公开(公告)日：2019-01-22
申请号：US15353210
申请日：2016-11-16
Applicant: KLA-Tencor Corporation
Inventor： Laurent Karsenti , Kris Bhaskar , John Raymond Jordan, III , Sankar Venkataraman , Yair Carmon
Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes a generative model. The generative model includes a non-linear network configured for mapping blocks of pixels of an input feature map volume into labels. The labels are indicative of one or more defect-related characteristics of the blocks. The system inputs a single test image into the generative model, which determines features of blocks of pixels in the single test image and determines labels for the blocks based on the mapping. The system detects defects on the specimen based on the determined labels.
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77.发明授权公开(公告)号：US10127652B2
公开(公告)日：2018-11-13
申请号：US14612192
申请日：2015-02-02
Applicant: KLA-Tencor Corporation
Inventor： Lisheng Gao , Avijit K. Ray-Chaudhuri , Raghav Babulnath , Kenong Wu
Abstract: Systems and methods for classifying defects detected on a wafer are provided. One method includes detecting defects on a wafer based on output generated for the wafer by an inspection system. The method also includes determining one or more attributes for at least one of the defects based on portions of a standard reference image corresponding to the at least one of the defects. The method further includes classifying the at least one of the defects based at least in part on the one or more determined attributes.
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公开(公告)号：US09996942B2
公开(公告)日：2018-06-12
申请号：US15073617
申请日：2016-03-17
Applicant: KLA-Tencor Corporation
Inventor： Santosh Bhattacharyya , Pavan Kumar , Lisheng Gao , Thirupurasundari Jayaraman , Raghav Babulnath , Srikanth Kandukuri , Gangadharan Sivaraman , Karthikeyan Subramanian , Raghavan Konuru , Rahul Lakhawat
CPC classification number: G06T7/33 , G06T2207/10061 , G06T2207/30148
Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.
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公开(公告)号：US09880107B2
公开(公告)日：2018-01-30
申请号：US13900465
申请日：2013-05-22
Applicant: KLA-Tencor Corporation
Inventor： Lu Chen , Jason Kirkwood , Mohan Mahadevan , James A. Smith , Lisheng Gao , Junqing (Jenny) Huang , Tao Luo , Richard Wallingford
CPC classification number: G01N21/9501 , G01N2021/887 , H01L22/12
Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.
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公开(公告)号：US09816939B2
公开(公告)日：2017-11-14
申请号：US14803872
申请日：2015-07-20
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy , Saibal Banerjee
CPC classification number: G01N21/8851 , G01N21/9501 , G01N2021/8887 , H01J37/222 , H01J37/26 , H01J37/28 , H01J2237/22 , H01J2237/221 , H01J2237/26 , H01J2237/2817
Abstract: Methods and systems for determining one or more characteristics for defects detected on a specimen are provided. One system includes one or more computer subsystems configured for identifying a first defect that was detected on a specimen by an inspection system with a first mode but was not detected with one or more other modes. The computer subsystem(s) are also configured for acquiring, from the storage medium, one or more images generated with the one or more other modes at a location on the specimen corresponding to the first defect. In addition, the computer subsystem(s) are configured for determining one or more characteristics of the acquired one or more images and determining one or more characteristics of the first defect based on the one or more characteristics of the acquired one or more images.
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