公开(公告)号：US20180088056A1

公开(公告)日：2018-03-29

申请号：US15430817

申请日：2017-02-13

Applicant: KLA-Tencor Corporation

Inventor： David Shortt ,  Steven Lange ,  Junwei Wei ,  Daniel Kapp ,  Charles Amsden

IPC: G01N21/88 ,  G01N1/28 ,  G01N1/44 ,  G01N21/95

CPC classification number: G01N21/8851 ,  G01N1/286 ,  G01N1/44 ,  G01N21/8806 ,  G01N21/9501

Abstract: Methods and systems for accurately locating buried defects previously detected by an inspection system are described herein. A physical mark is made on the surface of a wafer near a buried defect detected by an inspection system. In addition, the inspection system accurately measures the distance between the detected defect and the physical mark in at least two dimensions. The wafer, an indication of the nominal location of the mark, and an indication of the distance between the detected defect and the mark are transferred to a material removal tool. The material removal tool (e.g., a focused ion beam (FIB) machining tool) removes material from the surface of the wafer above the buried defect until the buried defect is made visible to an electron-beam based measurement system. The electron-beam based measurement system is subsequently employed to further analyze the defect.

公开(公告)号：US10215713B2

公开(公告)日：2019-02-26

申请号：US15626123

申请日：2017-06-18

Applicant: KLA-Tencor Corporation

Inventor： Pavel Kolchin ,  Mikhail Haurylau ,  Junwei Wei ,  Dan Kapp ,  Robert Danen ,  Grace Chen

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/956 ,  G01N21/47 ,  G01N21/88

Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).

公开(公告)号：US10082470B2

公开(公告)日：2018-09-25

申请号：US15430817

申请日：2017-02-13

Applicant: KLA-Tencor Corporation

Inventor： David Shortt ,  Steven Lange ,  Junwei Wei ,  Daniel Kapp ,  Charles Amsden

IPC: G01N1/44 ,  G01N21/95 ,  G01N21/88 ,  G01N1/28

CPC classification number: G01N21/8851 ,  G01N1/286 ,  G01N1/44 ,  G01N21/8806 ,  G01N21/9501 ,  G01N21/9506 ,  G01N21/956 ,  G01N2021/888

Abstract: Methods and systems for accurately locating buried defects previously detected by an inspection system are described herein. A physical mark is made on the surface of a wafer near a buried defect detected by an inspection system. In addition, the inspection system accurately measures the distance between the detected defect and the physical mark in at least two dimensions. The wafer, an indication of the nominal location of the mark, and an indication of the distance between the detected defect and the mark are transferred to a material removal tool. The material removal tool (e.g., a focused ion beam (FIB) machining tool) removes material from the surface of the wafer above the buried defect until the buried defect is made visible to an electron-beam based measurement system. The electron-beam based measurement system is subsequently employed to further analyze the defect.

公开(公告)号：US20170292918A1

公开(公告)日：2017-10-12

申请号：US15626123

申请日：2017-06-18

Applicant: KLA-Tencor Corporation

Inventor： Pavel Kolchin ,  Mikhail Haurylau ,  Junwei Wei ,  Dan Kapp ,  Robert Danen ,  Grace Chen

IPC: G01N21/95 ,  G01N21/47 ,  G01N21/88 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8887 ,  G01N2201/0668

Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).

公开(公告)号：US09709510B2

公开(公告)日：2017-07-18

申请号：US14749564

申请日：2015-06-24

Applicant: KLA-Tencor Corporation

Inventor： Pavel Kolchin ,  Mikhail Haurylau ,  Junwei Wei ,  Dan Kapp ,  Robert Danen ,  Grace Chen

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/956 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8887 ,  G01N2201/0668

Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).

公开(公告)号：US20150377797A1

公开(公告)日：2015-12-31

申请号：US14749564

申请日：2015-06-24

Applicant: KLA-Tencor Corporation

Inventor： Pavel Kolchin ,  Mikhail Haurylau ,  Junwei Wei ,  Dan Kapp ,  Robert Danen ,  Grace Chen

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8887 ,  G01N2201/0668

Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).

Abstract translation: 提供了用于在晶片检查期间确定位于收集孔中的光学元件的配置的方法和系统。 一个系统包括检测器，其被配置为当光学元件具有不同的配置从而为不同的配置生成不同的图像时，检测来自晶片的光，其通过包括一组收集孔的光学元件。 该系统还包括配置用于从两个或多个不同图像构建附加图像的计算机子系统，并且用于生成附加图像中的任何一个的两个或多个不同图像不仅包括生成的不同图像 用于集合中的单个收集孔。 计算机子系统还被配置为基于不同的图像和附加图像来选择用于光学元件的不同或附加配置之一。