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    Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
    1.
    发明授权
    Determining a configuration for an optical element positioned in a collection aperture during wafer inspection 有权

    公开(公告)号：US10215713B2

    公开(公告)日：2019-02-26

    申请号：US15626123

    申请日：2017-06-18

    Applicant: KLA-Tencor Corporation

    Inventor： Pavel Kolchin ,  Mikhail Haurylau ,  Junwei Wei ,  Dan Kapp ,  Robert Danen ,  Grace Chen

    IPC: G01N21/00 ,  G01N21/95 ,  G01N21/956 ,  G01N21/47 ,  G01N21/88

    Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).

    Ultra-high sensitivity hybrid inspection with full wafer coverage capability
    2.
    发明授权
    Ultra-high sensitivity hybrid inspection with full wafer coverage capability 有权

    公开(公告)号：US10545099B1

    公开(公告)日：2020-01-28

    申请号：US16272905

    申请日：2019-02-11

    Applicant: KLA-TENCOR CORPORATION

    Inventor： Grace Chen ,  Lawrence Muray

    IPC: G01N21/956 ,  G01N21/95 ,  G03F7/20 ,  H01J37/20 ,  H01J37/28

    Abstract: Disclosed are apparatus and methods for detecting defects on a semiconductor sample. An optical inspector is first used to inspect a semiconductor sample with an aggressively predefined threshold selected to detect candidate defect and nuisance sites at corresponding locations across the sample. A high-resolution distributed probe inspector includes an array of miniature probes that are moved relative to the sample to scan and obtain a high-resolution image of each site to detect and separate the candidate defect sites from the nuisance sites. A higher-resolution probe is then used to obtain a higher-resolution image of each candidate site to obtain a high-resolution image of each site to separate real defects that adversely impact operation of any devices on the sample from the candidate defects.

    Determining a Configuration for an Optical Element Positioned in a Collection Aperture During Wafer Inspection
    5.
    发明申请
    Determining a Configuration for an Optical Element Positioned in a Collection Aperture During Wafer Inspection 有权
    确定晶片检测期间定位在收集孔中的光学元件的配置

    公开(公告)号：US20150377797A1

    公开(公告)日：2015-12-31

    申请号：US14749564

    申请日：2015-06-24

    Applicant: KLA-Tencor Corporation

    Inventor： Pavel Kolchin ,  Mikhail Haurylau ,  Junwei Wei ,  Dan Kapp ,  Robert Danen ,  Grace Chen

    IPC: G01N21/95 ,  G01N21/88

    CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8887 ,  G01N2201/0668

    Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).

    Abstract translation: 提供了用于在晶片检查期间确定位于收集孔中的光学元件的配置的方法和系统。 一个系统包括检测器，其被配置为当光学元件具有不同的配置从而为不同的配置生成不同的图像时，检测来自晶片的光，其通过包括一组收集孔的光学元件。 该系统还包括配置用于从两个或多个不同图像构建附加图像的计算机子系统，并且用于生成附加图像中的任何一个的两个或多个不同图像不仅包括生成的不同图像 用于集合中的单个收集孔。 计算机子系统还被配置为基于不同的图像和附加图像来选择用于光学元件的不同或附加配置之一。

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