公开(公告)号：US06929464B2

公开(公告)日：2005-08-16

申请号：US10390618

申请日：2003-03-19

申请人： Tadao Suzuki

发明人： Tadao Suzuki

IPC分类号： B29C33/10 ,  B29C45/34 ,  B29C45/40

CPC分类号： B29C33/10 ,  B29C45/34 ,  B29C45/401 ,  Y10S425/812

摘要： An ejector pin of an injection mold includes a sleeve, a valve structure, and a biasing member. The sleeve has a passage hole and an enlarged hollow portion, which communicate with each other via a stepped portion engaged therebetween. The valve structure has a valve portion and a collar portion, which are disposed in the sleeve. The collar portion of the valve structure is biased by the biasing member such as a spring and stopped by the stepped portion. Gaps interposed between the valve structure and the sleeve serve as a gas passageway through which gas in a molding cavity is exhausted by a vacuum pump.

摘要翻译： 注射模具的顶针包括套筒，阀结构和偏置构件。 套筒具有通过孔和扩大的中空部分，其通过在它们之间接合的阶梯部分相互连通。 阀结构具有设置在套筒中的阀部分和套环部分。 阀结构的凸缘部分被诸如弹簧的偏置构件偏压，并被台阶部分阻止。 夹在阀结构和套筒之间的间隙用作气体通道，模制腔中的气体通过气体通道被真空泵排出。

公开(公告)号：US20050173832A1

公开(公告)日：2005-08-11

申请号：US11099495

申请日：2005-04-06

申请人： Paul Puniello ,  Robert Wilson

发明人： Paul Puniello ,  Robert Wilson

IPC分类号： B29C45/14 ,  B29C45/34

CPC分类号： B29C45/14819 ,  B29C45/34 ,  B29L2031/545 ,  Y10S425/812

摘要： The present invention is directed to an apparatus and method for venting trapped air and gasses in a mold. The mold and method comprise or use at least one pin formed from multiple pin sections. When assembled, the pin sections provide space on the interior of the pin through which trapped air and gasses can escape from the mold. The present invention may also be used to assist in ejecting an object from the mold. The pins can have circular or non-circular cross-sections and also may have dimple-forming projections to conform to a golf ball dimple pattern.

摘要翻译： 本发明涉及一种将被捕获的空气和气体排放在模具中的装置和方法。 模具和方法包括或使用由多个销部分形成的至少一个销。 当组装时，销部分在销的内部提供空间，通过该空间，被捕获的空气和气体可以从模具中逸出。 本发明还可以用于帮助从模具中弹出物体。 销可以具有圆形或非圆形横截面，并且还可以具有凹坑形成突起以符合高尔夫球凹坑图案。

公开(公告)号：US06896834B2

公开(公告)日：2005-05-24

申请号：US09950094

申请日：2001-09-10

申请人： Bradford P. Packer ,  Roy E. Bronson ,  Russell Montgomery ,  Roger D. Holstein

发明人： Bradford P. Packer ,  Roy E. Bronson ,  Russell Montgomery ,  Roger D. Holstein

IPC分类号： B29C37/00 ,  B29C37/02 ,  B29C39/10 ,  B29C45/14 ,  B29C45/26 ,  B29C45/34

CPC分类号： B29C45/14 ,  B29C37/0032 ,  B29C37/0067 ,  B29C37/02 ,  B29C39/10 ,  B29C45/14065 ,  B29C45/2669 ,  B29C45/34 ,  B29C2045/0077 ,  B29C2045/0079 ,  B29C2045/14131 ,  B29K2063/00 ,  B29K2105/0005 ,  B29K2995/0015 ,  Y10T428/24612 ,  Y10T428/31511

摘要： A method of forming ablative insulation coatings on aerospace structures and articles produced thereby. The method includes forming a mold having a cavity configured to complementarily receive at least a portion of the structure and directly molding the ablative coating to a surface of the structure by introducing a prepared ablative mixture, such as an epoxy resin, into the mold. The process may desirably include curing at atmospheric pressures to reduce the expense and equipment required in carrying out the process. The method of applying the ablative coating further includes features such as varying the thickness of the ablative coating from one portion of the component to another. Control of the thickness may be effected through use of spacers embedded into the ablative coating and formed of the same or similar material previously cured prior to placement in the mold.

摘要翻译： 一种在航空航天结构上形成烧蚀绝缘涂层的方法和由此制造的制品。 该方法包括形成模具，其具有构造成互补地接纳结构的至少一部分并且通过将制备的烧蚀性混合物（例如环氧树脂）引入到模具中而将烧蚀涂层直接模制到结构的表面的模具。 该方法可以理想地包括在大气压下固化以减少进行该方法所需的费用和设备。 施加烧蚀涂层的方法还包括诸如将组分的一部分改变为烧蚀涂层的厚度的特征。 厚度的控制可以通过使用嵌入到烧蚀涂层中的间隔件来实现，并且由放置在模具中之前预先固化的相同或相似的材料形成。

公开(公告)号：US20050106784A1

公开(公告)日：2005-05-19

申请号：US10494423

申请日：2002-10-15

申请人： Dingwei Xia

发明人： Dingwei Xia

IPC分类号： B29C45/14 ,  B29C45/34 ,  H01L21/56 ,  H01L21/48 ,  B29C31/00

CPC分类号： B29C45/14065 ,  B29C45/14655 ,  B29C45/34 ,  B29C2045/14155 ,  H01L21/565 ,  H01L2224/16225

摘要： Specifications of a flip chip package and mold compound for a package are provided to a mold flow simulator and locations of void formation in the package during molding, identified. Subsequently, a substrate (124) for the package is designed with vias (206) at the locations of void formation. During molding, air pockets at the locations of void formation escape through the vias (206) and vents (116) in the lower cavity bar (110), as mold compound flows between the die and the substrate (124) and forces the air out. In addition, the lower cavity bar (110) has a down set central location (114), which allows air to pass from the vias (206) to the vents (116). In addition, as the diameter of a via (206) is between 20-30 microns, more area on the lower surface of the substrate (124) is available for terminals arranged in an array.

摘要翻译： 用于封装的倒装芯片封装和模具化合物的规格被提供给模具流模拟器，并且在模制期间在封装中形成空隙的位置。 随后，用于封装的衬底（124）在空隙形成的位置处设有通孔（206）。 在模制期间，当模具化合物在模具和衬底（124）之间流动时，空隙形成位置处的气穴通过下腔体棒（110）中的通孔（206）和通气口（116）逸出并迫使空气流出 。 此外，下腔体杆110具有下降的中心位置（114），其允许空气从通孔（206）通过通气口（116）。 此外，由于通孔（206）的直径在20-30微米之间，所以基板（124）的下表面上的更多面积可用于排列成阵列的端子。

公开(公告)号：US20050048158A1

公开(公告)日：2005-03-03

申请号：US10895378

申请日：2004-07-21

申请人： Toshiyuki Ebina

发明人： Toshiyuki Ebina

IPC分类号： B29C45/37 ,  B29C45/26 ,  B29C45/34 ,  B29C45/43 ,  B29D17/00 ,  B29L17/00 ,  G11B7/26 ,  B29C33/42 ,  B29D11/00

CPC分类号： B29C45/263 ,  B29C45/43 ,  B29C2045/2659 ,  B29C2045/2667 ,  B29D17/005 ,  Y10S425/81

摘要： To form a disk substrate 42 having a no information area at low cost and without failure, a mold 12 is provided for forming a disk substrate 42 having a no information area 44. A cavity 32 of the mold 12 has a surface 50 corresponding to the no information area 44 and made of a mirror-surfaced plate 22. A cylindrical member (sleeve 35) is inserted in an inner hole 38 of the mirror-surfaced plate 22. An annular projection 33 is provided on the end surface of the cylindrical member adjacent to the cavity.

摘要翻译： 为了以低成本且无故障地形成无信息区的盘基片42，提供了用于形成无信息区域44的盘基片42的模具12.模具12的空腔32具有对应于 没有信息区域44并由镜面板22制成。圆柱形构件（套筒35）插入在镜面板22的内孔38中。环形突起33设置在圆柱形构件的端面上 邻近腔。

公开(公告)号：US06855286B2

公开(公告)日：2005-02-15

申请号：US10298926

申请日：2002-11-19

申请人： Yasuhisa Osawa ,  Makoto Sato

发明人： Yasuhisa Osawa ,  Makoto Sato

IPC分类号： F16J15/10 ,  B29C45/00 ,  B29C45/26 ,  B29C45/34 ,  B29K19/00 ,  B29K21/00 ,  B29L31/26 ,  F16J15/20

CPC分类号： B29C45/2616 ,  B29C45/0025 ,  B29C45/2628 ,  B29C45/34 ,  B29C2045/0044 ,  Y10S425/042

摘要： In an injection mold comprising a cavity and a gate for feeding a molding material into the cavity, the molding material fed from the gate into the cavity is divided into two streams that flow through the cavity and then meet at a confluent point so that the molding material portions are joined together along a joint plane. Two air vent gates are spaced apart from the confluent point so as to provide a larger area of the joint plane. Articles having a good outer appearance and improved strength at the material joint can be consistently manufactured to a high precision.

摘要翻译： 在包括用于将成型材料进料到空腔中的空腔和浇口的注射模具中，从浇口进入空腔的成型材料被分成两股流，该流体流过空腔，然后在汇合点处相遇，使得模制 材料部分沿着接合平面连接在一起。 两个排气门与汇合点间隔开，以便提供接合平面的较大面积。 可以一致地制造具有良好的外观和材料接合处的强度的制品。

公开(公告)号：US6019918A

公开(公告)日：2000-02-01

申请号：US784986

申请日：1997-01-17

申请人： Milko G. Guergov

发明人： Milko G. Guergov

IPC分类号： B29C33/10 ,  B29C45/17 ,  B29C45/34 ,  B29C45/76 ,  B29C45/77 ,  B29C45/00

CPC分类号： B29C33/10 ,  B29C45/1703 ,  B29C45/1704 ,  B29C45/34 ,  B29C45/76 ,  B29C45/7693 ,  B29C45/77 ,  B29C2045/173 ,  B29C2945/76006 ,  B29C2945/76193 ,  B29C2945/76254 ,  B29C2945/76381 ,  B29C2945/76498 ,  B29C2945/76595 ,  B29C2945/76665 ,  Y10T428/1352

摘要： A method is provided for gas-assisted injection molding for forming a hollow product. The mold cavity is prepressurized with fluid prior to injecting the molten material into the mold cavity, and the molten material is injected into the mold cavity against the pressurized fluid to establish a resultant internal counterpressure within the molten material. A pressurized assist-gas is injected into the molten material to form a gas bubble within the molten material. The injection of molten material into the cavity is then controlled in a manner to maintain the internal counterpressure at desired levels to overcome stress forces and to control formation and movement of the bubble within the melt.

公开(公告)号：US6007317A

公开(公告)日：1999-12-28

申请号：US34499

申请日：1998-03-04

申请人： Leonard E. Mess

发明人： Leonard E. Mess

IPC分类号： B29C45/14 ,  B29C45/34 ,  H01L21/56 ,  B29C45/02

CPC分类号： H01L21/565 ,  B29C45/14655 ,  B29C45/34 ,  H01L24/97 ,  B29C2045/14098 ,  B29C2045/14934 ,  B29C45/14221 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10S425/812

摘要： A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.

公开(公告)号：US5879599A

公开(公告)日：1999-03-09

申请号：US676803

申请日：1996-07-08

申请人： Michio Inoue ,  Keisuke Ihara

发明人： Michio Inoue ,  Keisuke Ihara

IPC分类号： B29C45/14 ,  B29C45/34 ,  B29C33/10 ,  B29C33/12 ,  B29C70/70

CPC分类号： B29C45/34 ,  B29C45/14065 ,  B29C45/14819 ,  B29L2031/54

摘要： A method of molding a golf ball including the steps of;standing support pins in a cavity of a golf ball molding die composed of lower and upper dies having a mating surface,supporting a core of the golf ball by the support pins such that the core is positioned at the center of the cavity,reducing the pressure in the cavity to a degree of 400 to 1.times.10.sup.-3 Torr by a vacuum pump operably coupled to a vent pin clearance formed between a vent pin and the inner wall of a vent pin hole in which the vent pin is inserted and a support pin clearance formed between the support pin and the inner wall of a support pin hole in which the support pin is inserted, the vent pin clearance and the support pin clearance being formed in the range of from 5 .mu.m to 25 .mu.m at the top portions of the vent pin hole and the support pin hole, andinjection molding a golf ball-forming material to fill the space and curing the material.

摘要翻译： 一种成型高尔夫球的方法，包括以下步骤： 由具有配合表面的下模具和上模具组成的高尔夫球成型模具的空腔中的支撑销，支撑销支撑高尔夫球的芯部，使得芯部位于空腔的中心，从而降低压力 通过可操作地联接到通气针间隙的真空泵至400至1×10 -3乇的程度，所述通气针间隙形成在排气销和排气针孔的内壁之间，其中排气销插入其中，并且支撑销间隙 形成在支撑销和插入支撑销的支撑销孔的内壁之间，排气销间隙和支撑销间隙形成在5〜25μm的范围内，在顶部 通气针孔和支撑销孔，以及注射成型高尔夫球形成材料以填充空间并固化材料。

公开(公告)号：US5834035A

公开(公告)日：1998-11-10

申请号：US770724

申请日：1996-12-18

申请人： Michio Osada ,  Yoshihisa Kawamoto ,  Makoto Matsuo ,  Koichi Araki

发明人： Michio Osada ,  Yoshihisa Kawamoto ,  Makoto Matsuo ,  Koichi Araki

IPC分类号： B29C45/02 ,  B29C45/14 ,  B29C45/34 ,  B29L31/34 ,  H01L21/00 ,  H01L21/56 ,  B29C45/63

CPC分类号： H01L21/67126 ,  B29C45/14655 ,  B29C45/34 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10S425/228 ,  Y10S425/812

摘要： In an apparatus for molding resin to seal electronic parts, an internal die space defined at least by pots, cull portions, resin passages and cavities when an upper mold section and a lower mold section are closed, is cut off or sealed from the exterior atmosphere. Thereupon the die space is evacuated using a first evacuation by a vacuum source and a second or instantaneous evacuation by an instantaneous evacuation mechanism. The vacuum source for the first evacuation may be an active vacuum pump, while the instantaneous evacuation mechanism may be a vacuum tank that has been previously pumped down, for example. Using this apparatus, it is possible to quickly improve the degree of vacuum in the internal die space by efficiently and reliably discharging air, moisture and gas from the internal die space to the exterior due to a synergistic action of the evacuation and the instantaneous evacuation. Consequently, the formation of voids in resin molded members is prevented.

摘要翻译： 在用于模制密封电子部件的树脂的设备中，当上部模具部分和下部模具部分闭合时，至少由盆，剔除部分，树脂通道和空腔限定的内部模具空间被切断或从外部空气密封 。 于是，使用真空源进行的第一次抽空和通过瞬时抽空机构进行的第二次或即时排空将模具空间抽真空。 用于第一抽空的真空源可以是主动式真空泵，而瞬时抽空机构可以是例如先前已被泵送的真空罐。 利用这种装置，由于排气和瞬时抽空的协同作用，能够通过有效且可靠地将空气，湿气和气体从内部空间排出到外部，从而快速提高内部空间的真空度。 因此，防止在树脂模制件中形成空隙。