High performance power device
    67.
    发明授权
    High performance power device 有权
    高性能电源设备

    公开(公告)号:US07742307B2

    公开(公告)日:2010-06-22

    申请号:US12015918

    申请日:2008-01-17

    IPC分类号: H05K7/20 B32B3/26

    摘要: A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane. Optionally, a conductive via can be formed in portions of the signal carrying layer not occupied by the insert of PG, where the conductive via operably couples a first side of the signal carrying layer to a second side of the signal carrying layer.

    摘要翻译: 提供印刷电路板(PCB)组件。 PCB组件适于安装至少一个发热电气装置,并提供集成的散热能力以散发由电气装置产生的热量。 PCB组件具有顶表面和底表面,并且包括信号载体层和热解石墨(PG)的插入物。 设置在顶表面和底表面之间的信号载体层包括导热和导电的材料(例如铝,铜和银中的至少一种及其合金),并且具有至少一部分位于 在第一架飞机上 PG的插入件设置在信号承载层的第一平面的至少一部分内,与信号载体层热接触,并且被构造和布置成在第一平面中具有最大的导电性。 可选地,可以在信号承载层的不被PG插入件占据的部分中形成导电通孔,其中导电通孔可操作地将信号承载层的第一侧耦合到信号承载层的第二侧。