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公开(公告)号：US10690589B2
公开(公告)日：2020-06-23
申请号：US16043764
申请日：2018-07-24
Applicant: KLA-Tencor Corporation
Inventor： Ilya Bezel , Kenneth P. Gross , John Szilagyi
Abstract: A broadband radiation source is disclosed. The system may include a plasma containment vessel configured to receive laser radiation from a pump source to sustain a plasma within gas flowed through the plasma containment vessel. The plasma containment vessel may be further configured to transmit at least a portion of broadband radiation emitted by the plasma. The system may also include a recirculation gas loop fluidically coupled to the plasma containment vessel. The recirculation gas loop may be configured to transport heated gas from an outlet of the plasma containment vessel, and further configured to transport cooled gas to an inlet of the plasma containment vessel.
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公开(公告)号：US10684563B2
公开(公告)日：2020-06-16
申请号：US15761830
申请日：2018-02-19
Applicant: KLA-TENCOR CORPORATION
Inventor： Amnon Manassen , Andrew Hill , Nadav Gutman , Yossi Simon , Alexander Novikov , Eugene Maslovsky
Abstract: Metrology systems and methods are provided, which derive metrology target position on the wafer and possibly the target focus position during the movement of the wafer on the system's stage. The positioning data is derived before the target arrives its position (on-the-fly), sparing the time required in the prior art for the acquisition stage and increasing the throughput of the systems and methods. The collection channel may be split to provide for an additional moving-imaging channel comprising at least one TDI (time delay and integration) sensor with an associated analysis unit configured to derive wafer surface information, positioning and/or focusing information of the metrology targets with respect to the objective lens, during wafer positioning movements towards the metrology targets. Additional focusing-during-movement module and possibly feedbacking derived position and/or focus information to the stage may enhance the accuracy of the stopping of the stage.
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公开(公告)号：US10670537B2
公开(公告)日：2020-06-02
申请号：US16357025
申请日：2019-03-18
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , J. K. Leong , Michael Kirk
Abstract: A inspection system includes an illumination source to generate an illumination beam, focusing elements to direct the illumination beam to a sample, a detector, collection elements configured to direct radiation emanating from the sample to the detector, a detection mode control device to image the sample in two or more detection modes such that the detector generates two or more collection signals based on the two or more detection modes, and a controller. Radiation emanating from the sample includes at least radiation specularly reflected by the sample and radiation scattered by the sample. The controller determines defect scattering characteristics associated with radiation scattered by defects on the sample based on the two or more collection signals. The controller also classifies the one or more particles according to a set of predetermined defect classifications based on the one or more defect scattering characteristics.
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公开(公告)号：US10670536B2
公开(公告)日：2020-06-02
申请号：US16364098
申请日：2019-03-25
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Saravanan Paramasivam , Ankit Jain , Prasanti Uppaluri , Raghavan Konuru
IPC: G01N21/88 , G01N21/95 , G01N21/956
Abstract: Methods and systems for selecting a mode for inspection of a specimen are provided. One method includes determining how separable defects of interest (DOIs) and nuisances detected on a specimen are in one or more modes of an inspection subsystem. The separability of the modes for the Dais and nuisances is used to select a subset of the modes for inspection of other specimens of the same type. Other characteristics of the performance of the modes may be used in combination with the separability to select the modes. The subset of modes selected based on the separability may also be an initial subset of modes for which additional analysis is performed to determine the final subset of the modes.
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65.发明申请公开(公告)号：US20200159129A1
公开(公告)日：2020-05-21
申请号：US16491963
申请日：2019-08-05
Applicant: KLA-TENCOR CORPORATION
Inventor： Amnon Manassen , Yuri Paskover , Eran Amit
Abstract: Scatterometry overlay (SCOL) measurement methods, systems and targets are provided to enable efficient SCOL metrology with in-die targets. Methods comprise generating a signal matrix by: illuminating a SCOL target at multiple values of at least one illumination parameter, and at multiple spot locations on the target, wherein the illumination is at a NA (numerical aperture)>⅓ yielding a spot diameter
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Patent Agency Ranking
公开(公告)号：US10648793B2
公开(公告)日：2020-05-12
申请号：US14710462
申请日：2015-05-12
Applicant: KLA-Tencor Corporation
Inventor： Leonid Poslavsky , Liequan Lee
Abstract: A library expansion system, method, and computer program product for metrology are provided. In use, processing within a first multi-dimensional library is performed by a metrology system. During the processing within the first multi-dimensional library, a second multi-dimensional library is identified. The processing is then transitioned to the second multi-dimensional library. Further, processing within the second multi-dimensional library is performed by the metrology system.
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公开(公告)号：US10605744B2
公开(公告)日：2020-03-31
申请号：US15865130
申请日：2018-01-08
Applicant: KLA-Tencor Corporation
Inventor： Lu Chen , Jason Kirkwood , Mohan Mahadevan , James A. Smith , Lisheng Gao , Junqing (Jenny) Huang , Tao Luo , Richard Wallingford
Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.
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公开(公告)号：US10599951B2
公开(公告)日：2020-03-24
申请号：US16364140
申请日：2019-03-25
Applicant: KLA-Tencor Corporation
Inventor： Kris Bhaskar , Laurent Karsenti , Brad Ries , Lena Nicolaides , Richard (Seng Wee) Yeoh , Stephen Hiebert
IPC: G06K9/62
Abstract: Methods and systems for training a neural network for defect detection in low resolution images are provided. One system includes an inspection tool that includes high and low resolution imaging subsystems and one or more components that include a high resolution neural network and a low resolution neural network. Computer subsystem(s) of the system are configured for generating a training set of defect images. At least one of the defect images is generated synthetically by the high resolution neural network using an image generated by the high resolution imaging subsystem. The computer subsystem(s) are also configured for training the low resolution neural network using the training set of defect images as input. In addition, the computer subsystem(s) are configured for detecting defects on another specimen by inputting the images generated for the other specimen by the low resolution imaging subsystem into the trained low resolution neural network.
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公开(公告)号：US20200090969A1
公开(公告)日：2020-03-19
申请号：US16189497
申请日：2018-11-13
Applicant: KLA-Tencor Corporation
Inventor： Jason Kirkwood , Jan Lauber
Abstract: A system for defect detection and analysis is provided. The system may include an inspection sub-system and a controller including a memory and one or more processors. The inspection sub-system may include an illumination source and one or more detectors configured to acquire control patch images of defects of a control specimen along one or more detector channels. The one or more processors may be configured to train a defect classifier using the control patch images and known parameters associated with the defects of the control specimen. The inspection sub-system may be further configured to acquire patch images of identified defects on an additional specimen. The one or more processors may be configured to determine parameters of the identified defects using the defect classifier.
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公开(公告)号：US20200080943A1
公开(公告)日：2020-03-12
申请号：US16147558
申请日：2018-09-28
Applicant: KLA-Tencor Corporation
Inventor： Yu Zheng
Abstract: A light attenuating device includes a housing, a first filter, a first motor configured to move the first filter, and a pneumatic actuator configured to move the first filter to either be in contact with the housing or to not be in contact with the housing. The filter includes multiple slit openings that vary in width such that the amount of light that passes through the multiple slit openings varies as the first filter is moved. The light attenuating device may also include a second filter and a second motor configured to move the second filter. A method of light attenuation is also disclosed that includes adjusting the position of a filter such that a portion of the filter is irradiated by a radiating beam, and while maintaining the irradiation of the portion of the filter, moving the filter to be in contact with a thermally conductive object.
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