公开(公告)号：US20110233755A1

公开(公告)日：2011-09-29

申请号：US13072012

申请日：2011-03-25

申请人： Dong-Han Kim ,  Sung-Woo Park ,  Jin-Woo Park ,  So-Young Lim ,  Jung-Hwan Kim ,  Kwang-Jin Bae ,  Pa-Lan Lee

发明人： Dong-Han Kim ,  Sung-Woo Park ,  Jin-Woo Park ,  So-Young Lim ,  Jung-Hwan Kim ,  Kwang-Jin Bae ,  Pa-Lan Lee

IPC分类号： H01L23/48

CPC分类号： H01L25/105 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/05171 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/73277 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor housing package may be provided. The semiconductor housing package may include a mold layer, a housing chip, a redistribution structure, and a housing node. The mold layer may surround and partially expose the housing chip. The redistribution structure may be electrically connected to the housing chip and may be disposed on the mold layer. The housing node may be in contact with the redistribution structures. The semiconductor housing package may be disposed on a semiconductor base package and may constitute a semiconductor package structure along with the semiconductor base package. The semiconductor package structure may be disposed on a processor-based system.

摘要翻译： 可以提供半导体外壳封装。 半导体外壳封装可以包括模具层，壳体芯片，再分布结构和壳体节点。 模具层可围绕并部分地暴露外壳芯片。 再分布结构可以电连接到壳体芯片并且可以设置在模具层上。 壳体节点可以与再分布结构接触。 半导体外壳封装可以设置在半导体基底封装上，并且可以与半导体基底封装构成半导体封装结构。 半导体封装结构可以设置在基于处理器的系统上。

公开(公告)号：US20110147378A1

公开(公告)日：2011-06-23

申请号：US12935804

申请日：2009-04-01

申请人： Sang-Ryul Lee ,  Kyu-Young Kim ,  Jae-Myung Chin ,  Dong-Han Kim ,  Si-Young Choi ,  Sung-Ho Choi

发明人： Sang-Ryul Lee ,  Kyu-Young Kim ,  Jae-Myung Chin ,  Dong-Han Kim ,  Si-Young Choi ,  Sung-Ho Choi

IPC分类号： H05B6/64

CPC分类号： H05B6/708

摘要： A microwave oven includes a cavity having a cooking chamber; a magnetron oscillating microwave radiation used for cooking food in the cooking chamber; and a plurality of radiation openings through which the microwave radiation is radiated into the cooking chamber, each of the radiation openings having a length in a direction where the microwave radiation is guided by a waveguide, the length being greater or less than λ/4.

摘要翻译： 微波炉包括具有烹饪室的空腔; 用于在烹饪室中烹饪食物的磁控管振荡微波辐射; 以及多个辐射开口，微波辐射通过该辐射开口辐射到烹饪室中，每个辐射开口具有在微波辐射被波导引导的方向上的长度，该长度大于或小于λ/ 4。

公开(公告)号：US07895458B2

公开(公告)日：2011-02-22

申请号：US11843758

申请日：2007-08-23

申请人： Dong Han Kim

发明人： Dong Han Kim

IPC分类号： G06F1/00

CPC分类号： G06F1/3203 ,  G06F1/3287 ,  Y02D10/171 ,  Y02D50/20

摘要： A power control apparatus including an active block in which power is always maintained in an on state and an N number of power management units having a hierarchical structure where N is a natural number greater than or equal to 1. Each of the power management units controls power of at least one power domain block Power of a first power management unit of the N number of the power management units is controlled by the active block, and power of an Nth power management unit of the N number of the power management units is controlled by an (N−1)th power management unit.

摘要翻译： 一种功率控制装置，其包括功率始终保持在接通状态的有源块和N个具有分级结构的功率管理单元，其中N是大于或等于1的自然数。每个功率管理单元控制 至少一个功率域块的功率N个功率管理单元的第一功率管理单元的功率由活动块控制，并且控制N个功率管理单元的第N个功率管理单元的功率 由第（N-1）个电源管理单元。

公开(公告)号：US20110006056A1

公开(公告)日：2011-01-13

申请号：US12744861

申请日：2008-11-20

申请人： Sung-Ho Choi ,  Kyu-Young Kim ,  Jae-Myung Chin ,  Sang-Ryul Lee ,  Dong-Han Kim ,  Si-Young Choi

发明人： Sung-Ho Choi ,  Kyu-Young Kim ,  Jae-Myung Chin ,  Sang-Ryul Lee ,  Dong-Han Kim ,  Si-Young Choi

IPC分类号： H05B6/64

CPC分类号： H05B6/642 ,  H05B6/6485

摘要： A microwave oven is provided. A barrier member prevents airflow provided by a fan assembly from being introduced again to the fan assembly. A separation member divides the airflow provided by the fan assembly to cool a first component and a second component. Thus, the components are efficiently cooled.

摘要翻译： 提供微波炉。 阻挡构件防止由风扇组件提供的气流再次被引入风扇组件。 分离构件分隔由风扇组件提供的气流以冷却第一部件和第二部件。 因此，组件被有效地冷却。

公开(公告)号：US07855895B2

公开(公告)日：2010-12-21

申请号：US12607288

申请日：2009-10-28

申请人： Dong-Han Kim ,  Young-Hoon Ro

发明人： Dong-Han Kim ,  Young-Hoon Ro

IPC分类号： H05K7/10

CPC分类号： G06K19/077 ,  G06K19/07743 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H05K1/0286 ,  H01L2924/00014

摘要： A smart card is provided including a body with a cavity, an IC chip inserted into the cavity, and a universal PCB on which the IC chip can be mounted and electrically contacted regardless of its size, type and bonding structure. The universal PCB comprises groups of contact pads suitable for contacting IC chips of different sizes and designs.

摘要翻译： 提供了一种智能卡，包括具有空腔的主体，插入到空腔中的IC芯片，以及通用PCB，IC芯片可以安装在该通用PCB上，而不管其大小，类型和结合结构如何。 通用PCB包括适于接触不同尺寸和设计的IC芯片的接触焊盘组。

公开(公告)号：US20100187686A1

公开(公告)日：2010-07-29

申请号：US12750915

申请日：2010-03-31

申请人： Na-rae SHIN ,  Dong-han KIM

发明人： Na-rae SHIN ,  Dong-han KIM

IPC分类号： H01L23/498 ,  H01L23/544

CPC分类号： H01L23/4985 ,  H01L23/544 ,  H01L24/50 ,  H01L24/86 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014

摘要： A semiconductor package comprising alignment members is provided. The semiconductor package includes a semiconductor die, first connection terminals disposed on a first surface of the semiconductor die, and a tape substrate including a substrate portion, and second connection terminals disposed on the substrate portion and disposed corresponding to the first connection terminals. The semiconductor package further includes a first alignment member disposed on the first surface of the semiconductor die, and a second alignment member disposed on the substrate portion of the tape substrate and disposed corresponding to the first alignment member.

摘要翻译： 提供了包括对准构件的半导体封装。 半导体封装包括半导体管芯，设置在半导体管芯的第一表面上的第一连接端子和包括基板部分的带基板，以及设置在基板部分上并对应于第一连接端子设置的第二连接端子。 半导体封装还包括设置在半导体管芯的第一表面上的第一对准部件和设置在带基板的基板部分上并对应于第一对准部件设置的第二对准部件。

公开(公告)号：US07732933B2

公开(公告)日：2010-06-08

申请号：US11971848

申请日：2008-01-09

申请人： Ye-Chung Chung ,  Dong-Han Kim ,  Sa-Yoon Kang

发明人： Ye-Chung Chung ,  Dong-Han Kim ,  Sa-Yoon Kang

IPC分类号： H01L29/40

CPC分类号： H01L23/49838 ,  H01L21/4839 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/17 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and input pads formed in the central area of the active surface. The input pads may be connected to wiring patterns of a TAB tape passing over the connection area.

摘要翻译： 具有包括周边区域和中心区域的活性表面的半导体芯片具有形成在周边区域的一部分上的连接区域。 半导体芯片包括形成在有源表面的周边区域中的输出焊盘和形成在有源表面的中心区域中的输入焊盘。 输入焊盘可以连接到通过连接区域的TAB磁带的布线图案。

公开(公告)号：US07675989B2

公开(公告)日：2010-03-09

申请号：US11303484

申请日：2005-12-16

申请人： Jae-Young Ahn ,  Yong-Soo Cho ,  Dong-Han Kim

发明人： Jae-Young Ahn ,  Yong-Soo Cho ,  Dong-Han Kim

IPC分类号： H04B7/02

CPC分类号： H04L27/2657 ,  H04B7/0851 ,  H04L27/2675

摘要： An apparatus for estimating an antenna weight vector in an Orthogonal Frequency Division Multiple Access System (OFDMA) having a smart antenna. The apparatus includes receiving and storing training symbols in the time domain transmitted to estimate an antenna weight vector during a training symbol transmission interval; estimating carrier frequency offsets using training symbols in the frequency domain that are obtained by performing a Fast Fourier Transformation (FFT) algorithm with respect to the training symbols received during the training symbol transmission interval; compensating the stored training symbols in the time domain based on the estimated carrier frequency offsets; and estimating an antenna weight vector using training symbols in the frequency domain that are obtained by applying an FFT algorithm with respect to the training symbols in the time domain derived by compensating the carrier frequency offsets during the training symbol transmission interval.

摘要翻译： 一种用于估计具有智能天线的正交频分多址系统（OFDMA）中的天线权重向量的装置。 所述装置包括在训练符号传输间隔期间在所发送的时域中接收和存储训练符号以估计天线权重向量; 使用通过针对在训练符号传输间隔期间接收到的训练符号执行快速傅里叶变换（FFT）算法获得的频域中的训练符号来估计载波频率偏移; 基于估计的载波频率偏移补偿在时域中存储的训练符号; 以及使用通过在训练符号发送间隔期间通过补偿载波频率偏移导出的时域中的训练符号应用FFT算法获得的频域中的训练符号来估计天线权重向量。

公开(公告)号：US07626263B2

公开(公告)日：2009-12-01

申请号：US11966272

申请日：2007-12-28

申请人： Dong-Han Kim

发明人： Dong-Han Kim

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49572 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H05K1/111 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

摘要： Provided is a semiconductor device. The semiconductor device includes a first bump column on an active surface of the semiconductor device and including a plurality of first bumps spaced a first distance from an edge of the semiconductor device, a second bump column on the active surface and including a plurality of second bumps spaced a second distance that is greater than the first distance from the edge of the semiconductor device, and a third bump column on the active surface, and including a plurality of third bumps spaced a third distance that is greater than the second distance from the edge of the semiconductor device. The second bumps and the third bumps are sequentially alternated at least twice between the first bumps.

摘要翻译： 提供一种半导体器件。 半导体器件包括在半导体器件的有效表面上的第一凸点柱，并且包括与半导体器件的边缘间隔开第一距离的多个第一凸起，在活性表面上的第二凸起柱，并且包括多个第二凸起 间隔开第二距离，该第二距离大于距离半导体器件的边缘的第一距离，以及在所述有源表面上的第三凸起柱，并且包括多个第三凸起，所述第三凸起间隔开第三距离，所述第三凸起大于距所述边缘的所述第二距离 的半导体器件。 第二凸块和第三凸块在第一凸块之间依次交替地至少两次。

公开(公告)号：US20090102297A1

公开(公告)日：2009-04-23

申请号：US12255848

申请日：2008-10-22

申请人： Kwang Yong LEE ,  Dong Han Kim

发明人： Kwang Yong LEE ,  Dong Han Kim

IPC分类号： H02K15/14

CPC分类号： F04D29/40

摘要： Disclosed herein is a blower motor assembly for a vehicle. The blower motor assembly comprises an armature assembly, a motor body, a magnet, an upper case, and a lower case. The armature assembly comprises a rotatable armature shaft with an armature. The motor body is an open cylinder that houses the armature assembly. The magnet is installed between the motor body and the armature assembly. The upper case has a through-hole which permits the armature shaft to projects outward through. The lower case is coupled to the upper case. The motor body is installed in an internal space defined by the coupled upper and lower cases. The motor body is fixed in a correspondingly-shaped hollow portion defined by a wall of a motor body fixing portion formed in the lower case. The magnet is fixed to a magnet fixing portion formed in the lower case.

摘要翻译： 这里公开了一种用于车辆的鼓风机马达组件。 鼓风机马达组件包括电枢组件，马达主体，磁体，上壳体和下壳体。 电枢组件包括具有电枢的可旋转电枢轴。 电机主体是容纳电枢组件的开放式气缸。 磁体安装在电机主体和电枢组件之间。 上壳体具有允许电枢轴向外突出的通孔。 下壳体联接到上壳体。 电动机体安装在由上下壳体限定的内部空间中。 马达主体固定在形成在下壳体中的电动机主体固定部分的壁限定的相应形状的中空部分中。 磁体固定在形成在下壳体中的磁铁固定部分。