Abstract:
A process is disclosed for forming on an aluminum substrate a colored design or pattern. The process comprises printing on the aluminum surface a masking agent or a resist before a first film forming step and then removing the printed agent before a second anodizing step, thereby different colors or shades being produced on a imaged portion and a non-imaged portion of the substrate.
Abstract:
A METHOD IS DISCLOSED FOR PRODUCING DEFECT-FREE ULTRATHIN ANODIC OXIDE FILMS OF LESS THAN APPROXIMATELY 50 A. THICKNESS. ILLUSTRATIVELY, A THIN INSULATING FILM IS FORMED ON A NIOBIUM SUBSTRATE. A RESIDUALL OXIDE HAVING A THICKNESS OF ABOUT 30 A. IS NORMALLY PRESENT ON THE NIOBIUM SUBSTRATE. THE RESIDUAL OXIDE FILM IS REMOVED PRIOR TO ANODIZING, LEAVING MORE UNIFORM NIOBIUM SUBSTRATE. BY ANODIZING UNDER CONTROLLED CONDITIONS ANY DESIRED OXIDE DIMENSION LESS THAN APPROXIMATELY 50 A. MAY BE ACHIEVED BY THE PRACTICE OF THIS DISCLOSURE. THE METHOD COMPRISES ANODIZING THE NIOBIUM SUBSTRATE IN A SUITABLE ELECTROLYTE WITH AN APPLIED POTENTIAL UP TO APPOXIMATELY 1 VOLT, AND SUBSEQUENTLY REMOVING THE RESULTANT OXIDE BY ETCHING WITH A SUITABLE ETCHANT, E.G., HF, AND HF+HNO3, THE ANODIZING-ETCHING STEPS ARE PREFERABLY REPEATED TO REMOVE SURFACE CAVITIES AND GROWTHS FOR OBTAINING A SURFACE ON THE NIOBIUM SUBSTRATE WITH DESIRED UNIFORMITY. ILLUSTRATIVELY, THE FINAL ANODIZATION OF THE NIOBIUM SURFACE IS ACHIEVED BY CONNECTING THE TWO ELECTRODES OF THE ELECTROLYTIC CELL (THE NIOBIUM SURFACE AND THE CATHODE) THROUGH A CONSTANT CURRENT SOURCE TO ACHIEVE THE DESIRED FINAL THICKNESS OF THE ANODIC FILM. ALTERNATIVELY, THE ELECTRODES MAY BE CONNECTED TO EACH OTHER THROUGH A RESISTOR FOR CONTROLLING THE RATE OF ANODIC FILM GROWTH.
Abstract:
EQUIPMENT WHICH IS INTENDED FOR USE IN CHEMICAL PLANT AND WHICH IS MADE OF TITANIUM, ZIRCONIUM, NIOBIUM, TANTALUM OR ANY ALLOY OF ONE OR MORE OF THESE METALS, IS EXPOSED TO AN ANODIC TREATMENT TO REMOVE HEAVY METALS FROM THE SURFACES TO BE EXPOSED TO CHEMICALS TO THUS PROTECT THE SURFACES AGAINST EMBRITTLEMENT CAUSED BY HYDROGEN WHICH IS EITHER PRESENT IN THE ENVIRONMENT TO WHICH THE EQUIPMENT IS EXPOSED OR IS FORMED AS A RESULT OF CORROSIVE ACTION AT THE SURFACE OF THE METAL.
Abstract:
A METHOD OF COATING STEEL SHEET SURFACES WITH DOUBLE COATING FILMS HAVING A HIGH CORROSION RESISTANCE. EACH STEEL SHEET IS AT FIRST COATED WITH A FIRST FILM MAINLY CONSISTING OF HYDROOUS CHROMIUM OXIDES BY ELECTROLYTIC TREATMENTS WITH CHROMIC ACID. AN ALUMINUM FILM IS COATED ON THE FIRST FILM BY VACUUM EVAPORATION.
Abstract:
METHOD OF FORMING A FILM OF METHACRYLONITRILE ALONE OR A COPOLYMER FILM OF METHACRYLONITRILE AND ANOTHER VINYL POLYMER ON AN OBJECT SURFACE THROUGH ELECTROLYTIC POLYMERIZATION WITH THE OBJECT TAKEN AS ONE OF THE ELECTRODES.
Abstract:
A method for adjusting the electrical resistance of thin-film metallic resistors by anodization is disclosed. The method includes the steps of: (1) supplying an electrolyte between a thin-film resistor and a cathode spaced therefrom; (2) applying a measuring voltage across the resistor for a period of time sufficient to determine the resistance of the resistor; (3) removing the measuring voltage, and if the resistance is below a desired value, passing an anodizing direct current between the resistor and the cathode for a time sufficient to anodize a surface of the resistor and thereby increase its resistance, the magnitude of the anodizing current and period of time being selected so as to produce an increase in resistance by an increment proportional to the difference between the desired value and the measured value of the resistance; (4) repeating step (2); and (5) terminating the anodizing of the resistor when the measured electrical resistance reaches a desired value.
Abstract:
In preparation of superconducting electrical conductors specifically niobium tin alloy, the reaction between niobium and tin is considerably accelerated if the niobium contains about 2,500 parts per million of oxygen before it is coated with tin. This concentration of oxygen does not have a harmful effect on the tape or its critical current density and the time for processing the tape may thus be considerably reduced.
Abstract:
A method for the preparation of an electrocatalyst which comprises (a) electrodepositing less than a complete monomolecular layer of material on a substrate utilizing cathodic polarization of short duration, and (b) oxidizing the electrodeposit and the substrate utilizing anodic polarization, also of short duration is described. The deposited material preferably is a metal or metal oxide having useful catalytic and/or electrical properties, e.g., platinum or gold. The substrate preferably is a metal or metal oxide such as tantalum oxide, tungsten oxide, or a sodium tungsten bronze, NaxWO3. The substrate is treated in an electrolyte containing a very dilute solution of the material to be deposited and/or in the presence of a counterelectrode containing this material. Several repetitions of these method steps, i.e., reversing the polarity such that the deposition and oxidation steps alternate, results in the complete or partial integration of minute portions of electrodeposited material in the substrate material. This method is useful for providing or improving catalytic activity in a substrate. The products produced by the method are useful in electrochemical devices.
Abstract:
Thin-film resistors and other devices are precision adjusted by a regular, geometric progression of steps. Each step of a binary step anodization pattern for adjusting a resistor to a nominal resistance value is designed to decrease by one-half the percentage deviation in resistance from the nominal value at the end of the preceding step. Successive binary step decreases in the percentage resistance deviation are attained by a series of binary step decreases in the product of anodizing current and anodizing time for each step. The resultant, decreasing rate adjustment pattern tends to render negligible any chance of substantially overshooting the desired nominal value while permitting rapid attainment of the nominal value. A general purpose, process control computer is equipped with a series of tapes or other program devices storing anodizing current and anodizing time information for carrying out successive steps of the subject anodizing technique. Such information is that which has been derived for given sets of conditions and resistor codes, incorporating various regular, geometric progression anodizing patterns and linear approximations, such as a linear approximation of a binary step pattern. Each resistor is anodized in successive steps, after each of which steps a resistance measurement is made and the anodizing current and anodizing time for the next step are determined. Anodization is terminated when the tolerance zone about the nominal resistance value is entered.
Abstract:
IN ANODIZING OR ELECTROPLATING OF ANODIZABLE METALS SUCH AS ALUMINUM AND ALUMINUM BASE ALLOYS, EMPLOYING ELECTROLYTES WHICH CONTAIN METAL SALTS, DEPLETION OF THE METAL ION CONTENT OF THE ELECTROLYTE BY MIGRATION OF METAL IONS TO THE OPPOSITE ELECTRODE IS PREVENT BY THE USE OF A NONPOLORIZING AUXILIARY ELECTROLYTE, SUCH AS A MINERAL ACID, TO SURROUND THE OPPOSITE ELECTRODE, IN A CELL HAVING TWO COMPARTMENTS HOLDING THE RESPECTIVE ELECTROLYTES, THE ELECTROLYTES BEING SEPARATED IN THE CELL BY MEANS OF A CATIONIC PERM-SELECTIVE MEMBRANE. THE METHOD AND APPARATUS ARE ADAPTED FOR THE FORMATION OF HARD INTEGRALLY COLORED ANODIC COATINGS ON ALUMINUM, AND ALSO FOR CHROMIUM PLATING.