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    Circuitized substrate with conductive polymer and seed material adhesion layer
    52.
    发明授权
    Circuitized substrate with conductive polymer and seed material adhesion layer 失效
    导电聚合物和种子材料粘附层的电路基板

    公开(公告)号：US07332212B2

    公开(公告)日：2008-02-19

    申请号：US11242841

    申请日：2005-10-05

    Applicant: Elizabeth Foster ,  Gregory Kevern ,  Anita Sargent

    Inventor： Elizabeth Foster ,  Gregory Kevern ,  Anita Sargent

    IPC: B32B3/00 ,  H05K1/02

    CPC classification number: H01L23/49894 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/034 ,  H05K3/181 ,  H05K3/188 ,  H05K2201/015 ,  H05K2201/0329 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2924/00

    Abstract: A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product is thus able to provide extremely narrow conductive circuitry for subsequent connections, e.g., to a semiconductor chip. Electroless plating is the preferred plating method with the dielectric immersed in a solution of conductive monomers, e.g., pyrrole monomer, the solution also possibly containing a seed material such as palladium-tin.

    Abstract translation: 使用诸如聚四氟乙烯等聚合物作为电介质层和聚合物的促进粘附层的层叠芯片载体的电路化基板的制造方法，可靠地将导电层附着在电镀层上 。 因此，所得到的产品能够为后续连接提供极窄的导电电路，例如提供给半导体芯片。 无电镀是将电介质浸入导电单体例如吡咯单体的溶液中的优选电镀方法，该溶液也可能含有种子材料如钯 - 锡。

    Fusion bonded assembly with attached leads
    54.
    发明授权
    Fusion bonded assembly with attached leads 失效
    熔接组装与附接导线

    公开(公告)号：US07297875B2

    公开(公告)日：2007-11-20

    申请号：US10833711

    申请日：2004-04-27

    Applicant: Philip J. Lauriello

    Inventor： Philip J. Lauriello

    IPC: H05K1/03

    CPC classification number: H05K3/4092 ,  H05K3/328 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/1034 ,  Y10T29/49126

    Abstract: A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers are then fusion bonded to each other such that the plurality of substrate layers form signal processing modules with leads that extend from an interior of the modules into the gap areas. The individual modules may then be separated by milling the substrate layers to de-panel the modules.

    Abstract translation: 信号处理模块可以由多个复合衬底层制造，每个衬底层包括多个单独的处理模块的元件。 当衬底层以堆叠布置融合时，这些层的表面被选择性地金属化以形成信号处理元件。 在接合之前，将衬底层研磨以形成位于处理模块之间的区域的间隙。 在接合之前，引线定位成使得它们从所述金属化表面上的信号耦合点延伸到间隙区域中。 然后将衬底层彼此熔合，使得多个衬底层形成具有从模块内部延伸到间隙区域中的引线的信号处理模块。 然后可以通过研磨衬底层来分离各个模块以使模块脱模。

    Method for modificating fluoropolymers and their application
    55.
    发明申请
    Method for modificating fluoropolymers and their application 审中-公开
    氟聚合物改性方法及其应用

    公开(公告)号：US20070158020A1

    公开(公告)日：2007-07-12

    申请号：US11326407

    申请日：2006-01-06

    Applicant: Chen-Yuan Tu ,  Ying-Ling Liu ,  Kueir-Rarn Lee ,  Juin-Yih Lai

    Inventor： Chen-Yuan Tu ,  Ying-Ling Liu ,  Kueir-Rarn Lee ,  Juin-Yih Lai

    IPC: B32B37/00

    CPC classification number: B32B38/0008 ,  B32B15/08 ,  B32B15/20 ,  B32B27/16 ,  B32B27/28 ,  B32B27/304 ,  B32B27/308 ,  B32B27/322 ,  B32B2311/00 ,  B32B2327/12 ,  B32B2457/08 ,  H05K1/034 ,  H05K3/022 ,  H05K3/381 ,  H05K2201/015 ,  H05K2203/087 ,  H05K2203/095

    Abstract: The present invention discloses a method for modificating a fluoropolymer. First, a fluoropolymer is provided, and then a hydrogen plasma treatment is performed on the fluoropolymer, so that C—H group is introduced to the surface of the fluoropolymer to form an intermediate. Next, an ozone treatment is performed on the intermediate, wherein the C—H group serves as ozone accessible site to form peroxide, and a first modified fluoropolymer is then formed. Finally, a grafting polymerization is initiated from the peroxide of the first modified fluoropolymer in the presence of a composition comprising at least one functional monomer, so as to form a second modified fluoropolymer. Furthermore, this invention also discloses methods for fabricating metal-clad laminates.

    Abstract translation: 本发明公开了一种改性含氟聚合物的方法。 首先，提供含氟聚合物，然后对含氟聚合物进行氢等离子体处理，从而将C-H基引入含氟聚合物的表面以形成中间体。 接下来，对中间体进行臭氧处理，其中C-H基团作为臭氧可及位点形成过氧化物，然后形成第一改性含氟聚合物。 最后，在包含至少一种官能单体的组合物的存在下，从第一改性含氟聚合物的过氧化物引发接枝聚合，以形成第二改性含氟聚合物。 此外，本发明还公开了制造覆金属层压板的方法。

    Methods and compositions for dielectric materials
    59.
    发明申请
    Methods and compositions for dielectric materials 审中-公开
    介电材料的方法和组成

    公开(公告)号：US20060210806A1

    公开(公告)日：2006-09-21

    申请号：US11334947

    申请日：2006-01-19

    Applicant: Kevin Nelson

    Inventor： Kevin Nelson

    IPC: B32B27/00 ,  B27J5/00

    CPC classification number: H01B3/445 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2203/1131 ,  Y10T428/31544

    Abstract: The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9, or a dissipation factor of less than 0.0009, or a material having a dielectric constant of more than 1.0 and less than 1.9, and a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately −200° C., operate in wide range of atmospheric conditions and pressures, such as a high atmosphere, low vacuum such as found in outer space as well as at sea level or below sea level, and is used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices.

    Abstract translation: 本发明包括介电材料的方法和组合物。 本发明的电介质材料包括具有大于1.0且小于1.9的介电常数或小于0.0009的介电常数的材料或介电常数大于1.0且小于1.9的材料和耗散 因子小于0.0009。 其他特征包括能够承受大范围的温度，从大约+ 260℃的高温到约-200℃的低温，在大范围的大气条件和压力下工作，例如高气氛 ，诸如在外层空间以及海平面或海平面以下的低真空，并且用于制造可以单独使用或与其他材料组合使用的复合结构体，并且可以用于电子部件或装置 。

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