Semiconductor light emitting device having patterns
    57.
    发明授权
    Semiconductor light emitting device having patterns 有权
    具有图案的半导体发光器件

    公开(公告)号:US09099628B2

    公开(公告)日:2015-08-04

    申请号:US14109075

    申请日:2013-12-17

    Applicant: ROHM CO., LTD.

    Inventor: Yohei Ito

    Abstract: A semiconductor light emitting device includes a substrate structure; a semiconductor layer disposed on the substrate structure, the semiconductor layer including a light emitting layer; and an electrode formed on a surface of the semiconductor layer, wherein a relatively coarse uneven portion and a relatively fine uneven portion are formed by a frost process on a surface of the semiconductor layer at a side of the electrode.

    Abstract translation: 半导体发光器件包括衬底结构; 设置在所述衬底结构上的半导体层,所述半导体层包括发光层; 以及形成在所述半导体层的表面上的电极,其中,在所述电极侧的所述半导体层的表面上通过霜冻法形成相对粗糙的凹凸部和相对微细的凹凸部。

    Method of forming a non-polar/semi-polar semiconductor template layer on unevenly patterned substrate
    58.
    发明授权
    Method of forming a non-polar/semi-polar semiconductor template layer on unevenly patterned substrate 有权
    在不均匀图案化的衬底上形成非极性/半极性半导体模板层的方法

    公开(公告)号:US09099609B2

    公开(公告)日:2015-08-04

    申请号:US13392410

    申请日:2010-08-27

    CPC classification number: H01L33/20 H01L33/0062 H01L33/16

    Abstract: Provided are a high-quality non-polar/semi-polar semiconductor device with reduced defect density and improved internal quantum efficiency and light extraction efficiency, and a manufacturing method thereof. The manufacturing method is a method for manufacturing a semiconductor device, in which a template layer and a semiconductor device structure are formed on a sapphire substrate having a crystal plane for growing a non-polar or semi-polar nitride semiconductor layer. The sapphire substrate is etched to form uneven patterns, and the template layer including a nitride semiconductor layer and a GaN layer is formed on the sapphire substrate in which the uneven patterns are formed.

    Abstract translation: 提供了一种具有降低的缺陷密度和提高的内部量子效率和光提取效率的高品质非极性/半极性半导体器件及其制造方法。 制造方法是制造半导体器件的方法,其中在具有用于生长非极性或半极性氮化物半导体层的晶面的蓝宝石衬底上形成模板层和半导体器件结构。 蚀刻蓝宝石衬底以形成不均匀图案,并且在形成有不均匀图案的蓝宝石衬底上形成包括氮化物半导体层和GaN层的模板层。

    Optoelectronic device and method for manufacturing the same
    59.
    发明授权
    Optoelectronic device and method for manufacturing the same 有权
    光电子器件及其制造方法

    公开(公告)号:US09093605B2

    公开(公告)日:2015-07-28

    申请号:US13937510

    申请日:2013-07-09

    Abstract: An optoelectronic device comprises: a substrate having a first surface and a normal direction perpendicular to the first surface; a first semiconductor formed on the first surface of the substrate, comprising a plurality of hollow components formed in the first semiconductor layer; a first protection layer formed on a sidewall and a bottom wall of the plurality of the hollow components, and the bottom wall comprises a portion of the first surface; and a buffer layer formed on the first semiconductor layer wherein the buffer layer comprises a first surface and a second surface opposite to the first surface.

    Abstract translation: 光电子器件包括:具有垂直于第一表面的第一表面和法线方向的衬底; 形成在所述基板的第一表面上的第一半导体,包括形成在所述第一半导体层中的多个中空部件; 形成在所述多个所述中空部件的侧壁和底壁上的第一保护层,所述底壁包括所述第一表面的一部分; 以及形成在所述第一半导体层上的缓冲层,其中所述缓冲层包括第一表面和与所述第一表面相对的第二表面。

    Method of manufacturing a light emitting diode
    60.
    发明授权
    Method of manufacturing a light emitting diode 有权
    制造发光二极管的方法

    公开(公告)号:US09070839B2

    公开(公告)日:2015-06-30

    申请号:US13984348

    申请日:2012-02-08

    Applicant: Tao Wang

    Inventor: Tao Wang

    Abstract: A method (100) of making a semiconductor device, for example a light emitting diode. The method (100) includes providing (105) a semiconductor wafer, and providing (110) a protective layer over the semiconductor wafer. Preferably the protective layer comprises indium-tin oxide. Processing steps are performed on the wafer and the protective layer is arranged to protect the wafer during the processing steps. The processing steps may include forming a mask layer (115) over the protective layer, which is used for etching through the protective layer and into the semiconductor wafer, removing the mask layer, or etching filling materials (150) provided over the selectively etched semiconductor wafer.

    Abstract translation: 制造半导体器件(例如发光二极管)的方法(100)。 方法(100)包括提供(105)半导体晶片,并且在半导体晶片上提供(110)保护层。 优选地,保护层包括氧化铟锡。 在晶片上执行处理步骤,并且保护层被布置成在处理步骤期间保护晶片。 处理步骤可以包括在保护层上形成掩模层(115),该掩模层用于蚀刻通过保护层并进入半导体晶片,去除掩模层,或蚀刻设置在选择性蚀刻半导体上的填充材料(150) 晶圆。

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