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    Method for electrochemical fabrication
    51.
    发明授权
    Method for electrochemical fabrication 有权
    电化学制造方法

    公开(公告)号：US07351321B2

    公开(公告)日：2008-04-01

    申请号：US10677548

    申请日：2003-10-01

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: C25D5/02 ,  C25D5/48 ,  C25D5/52

    CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Method for maskless fabrication of self-aligned structures comprising a metal oxide
    52.
    发明申请
    Method for maskless fabrication of self-aligned structures comprising a metal oxide 审中-公开
    用于无掩模地制造包括金属氧化物的自对准结构的方法

    公开(公告)号：US20060073687A1

    公开(公告)日：2006-04-06

    申请号：US10540709

    申请日：2003-12-03

    Applicant: Rudolf Vullers ,  Bokke Feenstra

    Inventor： Rudolf Vullers ,  Bokke Feenstra

    IPC: H01L21/20

    CPC classification number: B81C1/00119 ,  B81B2203/0338 ,  B81C2201/032 ,  B81C2203/058

    Abstract: The present invention describes a method for fabricating micro-devices comprising aluminumoxide structures without the need for an extra lithographical processing step. So, no extra mask is needed. It appears that under certain circumstances, aluminumoxide walls arise in the etching process, just above sloped walls of underlying metal structures. The fact that the walls of the metal structures are sloped, is essential here. Using the method according to the invention, aluminumoxide structures can be fabricated that are aligned exactly above the sloped walls of the metal structure. These aligned aluminumoxide structures can be used as walls in for example microfluidic channels, electrowetting displays, electrophoretic displays or field emitting displays.

    Abstract translation: 本发明描述了一种用于制造包含氧化铝结构的微器件的方法，而不需要额外的光刻处理步骤。 所以，不需要额外的面具。 似乎在某些情况下，氧化铝壁出现在蚀刻过程中，恰好在下面的金属结构的倾斜壁之上。 金属结构的墙壁倾斜的事实在这里是必不可少的。 使用根据本发明的方法，可以制造正好在金属结构的倾斜壁上方对准的氧化铝结构。 这些排列的二氧化铝结构可用作例如微流体通道，电润湿显示器，电泳显示器或场发射显示器中的壁。

    Method for manufacturing metal microstructure
    53.
    发明申请
    Method for manufacturing metal microstructure 失效
    制造金属微观结构的方法

    公开(公告)号：US20040248421A1

    公开(公告)日：2004-12-09

    申请号：US10492918

    申请日：2004-04-16

    Inventor： Jun Yorita ,  Yoshihiro Hirata ,  Tsuyoshi Haga

    IPC: H01L021/302 ,  H01L021/461

    CPC classification number: B81C99/0085 ,  B81C2201/032 ,  C25D1/003 ,  H01L21/4821 ,  H05K3/202 ,  H05K3/205

    Abstract: A method of manufacturing a metal microstructure by using a resin mold. In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold can be set and the high-precision metal microstructure can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure according to the present invention includes the steps of: fixing on a conductive substrate the resin mold having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure having the resin mold; exposing the layered structure having the resin mold to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer existing at the vacant portion of the resin mold; and filling with a metal the vacant portion of the layered structure having the resin mold by electroforming.

    Abstract translation: 通过使用树脂模具制造金属微结构的方法。 为了提供一种可以设定对树脂模具造成较小损害的温和制造条件并且通过均匀电铸可以大量生产高精度金属微结构的方法，根据本发明的金属组织的制造方法 本发明包括以下步骤：通过插入具有由电子束，紫外线或可见光辐照的化学组成改变的光敏聚合物，将具有穿透厚度方向的空白部分的树脂模具固定在导电基板上，以形成 具有树脂模具的层状结构; 将具有树脂模具的层状结构暴露于电子束，紫外线辐射或可见光辐射; 去除存在于树脂模具的空缺部分的曝光的光敏聚合物; 并通过电铸将金属填充到具有树脂模具的层状结构的空
    间部分。

    Method for electrochemical fabrication
    55.
    发明授权
    Method for electrochemical fabrication 有权
    电化学制造方法

    公开(公告)号：US06475369B1

    公开(公告)日：2002-11-05

    申请号：US09487408

    申请日：2000-01-18

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: C25D502

    CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    Abstract: An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

    Abstract translation: 一种电镀方法包括形成层，所述层的形成包括：a）使基底与第一制品接触，所述第一制品包括以支持物的形式设置的支撑体和适形掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述衬底上，所述第一图案对应于所述适形掩模图案的所述补体; 以及c）从所述基底中去除所述第一制品。 该方法还可以包括以下一个或多个：（1）选择性地沉积或非选择性地沉积一种或多种附加材料以完成层的形成，（2）在每次沉积之后或在所有沉积之后平坦化沉积的材料，以及/ 或（3）形成与先前形成的层相邻的层，以从多个附着层建立结构。 还公开了电镀制品和电镀装置。

    Stamper-forming electrode material, stamper-forming thin film, and method of manufacturing optical disk
    56.
    发明申请
    Stamper-forming electrode material, stamper-forming thin film, and method of manufacturing optical disk 失效
    压模形成用电极材料，压模成形薄膜及其制造方法

    公开(公告)号：US20020150840A1

    公开(公告)日：2002-10-17

    申请号：US10061273

    申请日：2002-02-04

    Applicant: PIONEER CORPORATION

    Inventor： Masahiro Katsumura ,  Tetsuya Iida ,  Nobuhiro Oda ,  Takashi Ueno

    IPC: C25D005/54 ,  C25D005/56

    CPC classification number: C25D1/10 ,  B81C99/009 ,  B81C2201/0128 ,  B81C2201/032

    Abstract: A stamper-forming electrode material contains Cu as its main ingredient and at least one other element, preferably Ag and/or Ti. It is preferred that the Ag content be 10.0 wt % or less and that the Ti content be 5.0 wt % or less. A stamper-forming thin film is made of this stamper-forming electrode material, whereby its corrosion resistance is improved to suppress damage to itself, and a high-quality stamper can hence be formed.

    Abstract translation: 压模形成电极材料包含Cu作为其主要成分和至少一种其它元素，优选Ag和/或Ti。 Ag含量优选为10.0重量％以下，Ti含量为5.0重量％以下。 压模形成薄膜由该压模形成用电极材料制成，由此其耐腐蚀性得到改善以抑制其自身的损坏，因此可以形成高质量的压模。

    Formation of microstructures using a preformed photoresist sheet
    59.
    发明授权
    Formation of microstructures using a preformed photoresist sheet 失效
    使用预成型光致抗蚀剂片材形成微结构

    公开(公告)号：US5378583A

    公开(公告)日：1995-01-03

    申请号：US66988

    申请日：1993-05-24

    Applicant: Henry Guckel ,  Todd R. Christenson ,  Kenneth Skrobis

    Inventor： Henry Guckel ,  Todd R. Christenson ,  Kenneth Skrobis

    IPC: G03F7/027 ,  B81B1/00 ,  B81C1/00 ,  G03F7/00 ,  G03F7/20 ,  G03F7/26 ,  G03F7/30 ,  G03F7/38 ,  G03F7/40 ,  H01L21/027 ,  H05K3/18 ,  G03C5/00

    CPC classification number: G03F7/38 ,  B81C1/0038 ,  G03F7/00 ,  G03F7/0035 ,  B81C2201/0128 ,  B81C2201/0159 ,  B81C2201/019 ,  B81C2201/032 ,  Y10S430/168 ,  Y10T428/31504

    Abstract: In the formation of microstructures, a preformed sheet of photoresist, such as polymethylmethacrylate (PMMA), which is strain free, may be milled down before or after adherence to a substrate to a desired thickness. The photoresist is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the photoresist material which has been rendered susceptible to the developer. Micrometal structures may be formed by electroplating metal into the areas from which the photoresist has been removed. The photoresist itself may form useful microstructures, and can be removed from the substrate by utilizing a release layer between the substrate and the preformed sheet which can be removed by a remover which does not affect the photoresist. Multiple layers of patterned photoresist can be built up to allow complex three dimensional microstructures to be formed.

    Abstract translation: 在微结构的形成中，可以在将粘附到基底上之前或之后将预成型的光致抗蚀剂片材（例如无甲基丙烯酸甲酯（PMMA））磨碎到期望的厚度。 光致抗蚀剂通过掩模通过掩模曝光到例如X射线的辐射而被图案化，并且使用显影剂显影以除去已经对显影剂易感的光致抗蚀剂材料。 微米结构可以通过将金属电镀到已经除去光致抗蚀剂的区域中而形成。 光致抗蚀剂本身可以形成有用的微结构，并且可以通过利用基材和预成型片材之间的剥离层从基材上除去，该剥离层可以通过不影响光致抗蚀剂的去除剂去除。 可以构建多层图案化的光致抗蚀剂，以形成复杂的三维微结构。

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