公开(公告)号：US20040209111A1

公开(公告)日：2004-10-21

申请号：US10842473

申请日：2004-05-11

申请人： TAIYO YUDEN CO., LED.

发明人： Kazuyoshi Kobayashi ,  Kenji Ikeda ,  Masayuki Fujimoto

IPC分类号： C25D005/10 ,  B32B015/00

CPC分类号： H01F41/301 ,  B82Y25/00 ,  B82Y40/00 ,  H01F10/007 ,  H01F10/132 ,  H01F10/138 ,  H01F10/3227 ,  H01F41/183 ,  H05K9/0084 ,  Y10T428/12493 ,  Y10T428/12535 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/3183 ,  Y10T428/32

摘要： There are provided a magnetic thin film utilizing a granular film and having excellent high frequency characteristics and a method of manufacturing the same, and a multilayered magnetic film and magnetic components and electronic equipment utilizing the same. A nonreactive sputtering is performed so that there is no oxidation of a magnetic metal, and a saturation magnetization is increased to increase a resonant frequency of permeability. Also, a multi-target simultaneous sputtering is combined with the nonreactive sputtering so that in a granular structure including magnetic grains and an insulating layer a size of the magnetic grains and a thickness of the insulating layer are optimized thereby ensuring a proper magnitude for a crystalline magnetic anisotropy within the grains and excellent soft magnetic properties. Further, the optimization of the thickness of the insulating layer has the effect of improving a resistivity, decreasing an eddy current and improving an exchange interaction between the magnetic grains.

公开(公告)号：US20040186008A1

公开(公告)日：2004-09-23

申请号：US10477172

申请日：2004-05-06

发明人： Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto

IPC分类号： B01J031/00 ,  C25D005/10

CPC分类号： H01L21/76843 ,  C23C18/166 ,  C23C18/1806 ,  C23C18/1831 ,  C23C18/36 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76874

摘要： The present invention provides a catalyst-imparting treatment solution and an electroless plating method that can form a protective film of a phosphorus-containing alloy to protect the surface of copper inter-connects of an electronic device without forming voids in the copper inter-connects. The catalyst-imparting treatment solution, for use in a catalyst-imparting pretreatment before carrying out electroless plating of at least part of an electronic device having an embedded copper-interconnect structure using a hypophosphite as a reducing agent, includes at least one complex compound of a noble metal of Group IB or Group VIII of the Periodic Table.

摘要翻译： 本发明提供一种能够形成含磷合金保护膜的催化剂赋予处理溶液和化学镀方法，以保护电子器件的铜互连表面，而不会在铜互连中形成空隙。 在使用次磷酸盐作为还原剂的具有嵌入铜互连结构的电子器件的至少一部分进行无电解电镀之前，用于催化剂赋予预处理的催化剂赋予处理液包含至少一种配位化合物 IB族元素的贵金属或元素周期表第八族。

公开(公告)号：US20040099535A1

公开(公告)日：2004-05-27

申请号：US10275504

申请日：2003-06-09

发明人： Mattias Schweinsberg ,  Bernd Mayer ,  Frank Wiechmann

IPC分类号： C25D005/10

CPC分类号： C25D13/22 ,  C25D9/04

摘要： Use of a layer on an electrically conductive surface as a corrosion protection layer and/or as a primer for an organic coating, which may be obtained in a stage (a), in which a layer of at least one inorganic compound of at least one metal A having a weight per unit area of 0.01 to 10 g/m2 is deposited electrochemically on the said surface from a solution containing the metal A in dissolved form, wherein the metal A is a different metal from the main component of the electrically conductive surface and wherein the inorganic compound contains less than 20 wt. % phosphate ions; process for producing a coating comprising at least two layers, at least one layer of an organic polymer being applied to the layer deposited in stage a); metal component comprising a coating comprising at least two layers obtainable in this manner.

摘要翻译： 在导电表面上使用层作为腐蚀保护层和/或用作有机涂层的底漆，其可以在阶段（a）中获得，其中至少一种至少一种无机化合物的层 每单位面积重量为0.01〜10g / m 2的金属A在电解液中从含有溶解形式的金属A的溶液在所述表面上沉积，其中金属A是与主要成分不同的金属 导电表面，其中无机化合物含有小于20wt。 ％磷酸盐离子; 用于生产包含至少两个层的涂层的方法，至少一层有机聚合物施加到在阶段a）中沉积的层; 金属组分包含包含以这种方式可获得的至少两层的涂层。

公开(公告)号：US20040084319A1

公开(公告)日：2004-05-06

申请号：US10677548

申请日：2003-10-01

申请人： University of Southern California

发明人： Adam L. Cohen

IPC分类号： C25D005/02 ,  C25D005/10

CPC分类号： C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US20040050907A1

公开(公告)日：2004-03-18

申请号：US10438799

申请日：2003-05-15

发明人： Brian J. Dracup ,  William J. Arbegast

IPC分类号： B23K020/12 ,  C25D005/10 ,  B32B015/00

CPC分类号： B23K20/1255 ,  B23K20/1265 ,  Y10T428/12493

摘要： The present invention provides an improved method and apparatus for joining aluminum allow panels (eg. 2090-T83 aluminum lithium alloy). The method preliminarily positions two panels and skin panels next to each other so that a stringer panel overlaps a skin panel. A friction stir weld pin tool penetrates through one panel and at least partially into another panel. The panel material around the pin tool is frictionally heated, plasticized and joined until the faying surface is substantially consumed. In another embodiment, a tee-shaped structure is formed using friction stir welding to join three panels together. A projecting part of one panel (center, vertical) provides material that becomes a contoured corner panel below two side, horizontal panels after friction stir welding is completed

摘要翻译： 本发明提供一种用于连接铝允许面板（例如2090-T83铝锂合金）的改进方法和装置。 该方法预先将两个面板和皮肤面板彼此相邻放置，使得桁条面板与皮肤面板重叠。 摩擦搅拌焊接销工具穿过一个面板并且至少部分地穿透到另一个面板中。 销钉工具周围的面板材料被摩擦加热，塑化和连接，直到接合面基本消耗。 在另一个实施例中，使用摩擦搅拌焊接形成T形结构，以将三个面板连接在一起。 一个面板（中心，垂直）的突出部分提供成为两面下方轮廓的角板的材料，摩擦搅拌焊接完成后的水平面板

公开(公告)号：US20040013899A1

公开(公告)日：2004-01-22

申请号：US10445708

申请日：2003-05-27

发明人： Yoshiyuki Abe

IPC分类号： C25D005/10

CPC分类号： C23C14/086 ,  C23C14/3414 ,  Y10S428/917 ,  Y10S428/918 ,  Y10T428/12771 ,  Y10T428/12826

摘要： The target for the transparent conductive thin film having indium oxide as its major component and containing tungsten and/or molybdenum, obtained by forming a body of indium oxide powder, and tungsten oxide power and/or molybdenum oxide powder and then heating or sintering the formed body such that the thin film after sputtering has indium oxide as the main component and contains tungsten and/or molybdenum with an atomic ratio (WnullMo)/In of 0.0040 to 0.0470, whereby a transparent conductive thin film having excellent surface smoothness and low specific resistance of 6.0null10null4 nullnullcm or less, and whose surface smoothness and specific resistance properties do not change even when heated at 170null C. is provided.

摘要翻译： 以铟氧化物为主要成分并含有钨和/或钼的透明导电性薄膜的目标物，通过形成氧化铟粉体，氧化钨粉末和/或氧化钼粉末，然后加热或烧结所形成的 使得溅射后的薄膜具有氧化铟作为主要成分并且含有原子比（W + Mo）/ In为0.0040〜0.0470的钨和/或钼，由此具有优异的表面平滑度和低的透明导电薄膜 提供6.0×10 -4Ω·cm以下的电阻率，即使在170℃下加热时，其表面平滑性和耐电阻性也不变化。

公开(公告)号：US20020182433A1

公开(公告)日：2002-12-05

申请号：US09838228

申请日：2001-04-20

发明人： Yasuhiro Endo

IPC分类号： B21C037/00 ,  C25D003/38 ,  C25D005/10

CPC分类号： H05K3/384 ,  C25D3/58 ,  C25D5/10 ,  C25D5/16 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12438

摘要： A roughening-treated copper foil, comprising (A) a copper foil, (B) a composite metal layer, which is formed on a bonding surface of the copper foil and comprises (I) copper, (II) at least one metal selected from the group consisting of tungsten and molybdenum and (III) at least one metal selected from the group consisting of nickel, cobalt, iron and zinc, and (C) a roughened layer comprising copper, which is formed on the composite metal layer.

摘要翻译： 一种粗糙处理的铜箔，其包含（A）铜箔，（B）复合金属层，其形成在铜箔的接合表面上，并且包含（I）铜，（II）至少一种选自 由钨和钼组成的组和（III）选自镍，钴，铁和锌中的至少一种金属，和（C）包含铜的粗糙层，其形成在复合金属层上。

公开(公告)号：US20020102431A1

公开(公告)日：2002-08-01

申请号：US09985945

申请日：2001-11-06

发明人： Adrianus Jacobus Wittebrood ,  Jacques Hubert Olga Joseph Wijenberg

IPC分类号： B32B015/20 ,  B23K035/12 ,  C25D005/10

CPC分类号： B23K1/19 ,  B23K1/008 ,  B23K35/0238 ,  B23K2103/10 ,  E04C2002/3433 ,  E04C2002/3455 ,  E04C2002/3466 ,  E04C2002/3472 ,  Y10S428/926 ,  Y10S428/935 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/1275 ,  Y10T428/12764 ,  Y10T428/12771 ,  Y10T428/12778 ,  Y10T428/12792 ,  Y10T428/12944

摘要： Disclosed is a method of manufacturing an assembly of components joined by brazing, comprising the steps of: (i) forming the components of which at least one is made from a multi-layered brazing sheet product, the multi-layered brazing sheet product comprising a core sheet (a) having on at least one surface of the core sheet an aluminium clad layer (b), the aluminium clad layer being made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, a layer (c) comprising nickel on the outer surface of the aluminium clad layer, and a layer (d) comprising zinc or tin as a bonding layer between the outer surface of the aluminium clad layer and the layer comprising nickel; (ii) forming at least one other component of a metal dissimilar to the core sheet of the multi-layered brazing sheet product and selected from the group consisting of titanium, plated titanium, coated titanium, bronze, brass, stainless steel, plated stainless steel, coated stainless steel, low-carbon steel, plated low-carbon steel, coated low-carbon steel, high-strength steel, coated high-strength steel, and plated high-strength steel; (iii) assembling the respective components into an assembly such that the layer (c) comprising nickel of the multi-layered brazing sheet product faces in part or in whole the at least one other component of a metal dissimilar to the core sheet of the multi-layered brazing sheet product; (iv) brazing the assembly under a vacuum or in an inert atmosphere in the absence of a brazing-flux at elevated temperature for a period long enough for melting and spreading of the aluminium clad layer and all layers exterior thereto; (v) cooling the brazed assembly. The invention further relates to an assembly manufactured using the method of this invention.

摘要翻译： 公开了一种制造通过钎焊连接的部件的组件的方法，包括以下步骤：（i）形成至少一个由多层钎焊片材制成的部件，所述多层钎焊片制品包括 芯板（a）在芯板的至少一个表面上具有铝包层（b），所述铝包层由铝合金制成，所述铝合金包含2至18重量％的量的硅， 在包铝层的外表面上包含镍的层（c）和包含锌或锡的层（d）作为在铝包层的外表面和包含镍的层之间的结合层; （ii）形成与多层钎焊片制品的芯片不同的金属的至少一种其它成分，选自钛，镀钛，镀钛，青铜，黄铜，不锈钢，镀不锈钢 ，涂层不锈钢，低碳钢，镀低碳钢，涂层低碳钢，高强度钢，涂层高强度钢和镀层高强度钢; （iii）将各个部件组装成组件，使得包括多层钎焊片材产品的镍的层（c）部分或全部地面对与多个多层钎焊片材的芯片不同的金属的至少一个其它部件 层压板材产品; （iv）在真空下或在惰性气氛中在不存在钎焊剂的情况下，在升高的温度下钎焊所述组件足够长的时间以使铝包覆层及其外部的所有层熔化和铺展; （v）冷却钎焊组件。 本发明还涉及使用本发明的方法制造的组件。

公开(公告)号：US20020100693A1

公开(公告)日：2002-08-01

申请号：US10062839

申请日：2002-01-30

发明人： Jiong-Ping Lu ,  David Jay Rose ,  Linlin Chen

IPC分类号： C25D007/12 ,  C25D011/32 ,  C25D005/00 ,  C25D011/02 ,  C25D005/10 ,  C23C028/00

CPC分类号： H01L21/76861 ,  C25D5/34 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76843 ,  H01L21/76873

摘要： An improved method for forming a copper layer (100). After the copper seed layer (116) is formed, any oxidized copper (118) at the surface is electrochemically reduced back to copper rather than being dissolved. Copper (120) is then electrochemically deposited (ECD) over the intact seed layer (116).

摘要翻译： 一种用于形成铜层（100）的改进方法。 在形成铜籽晶层（116）之后，表面处的任何氧化铜（118）被电化学还原成铜而不是溶解。 铜（120）然后在完整的种子层（116）上电化学沉积（ECD）。

公开(公告)号：US20020043466A1

公开(公告)日：2002-04-18

申请号：US09900710

申请日：2001-07-06

申请人： APPLIED MATERIALS, INC.

发明人： Yezdi N. Dordi ,  Peter W. Hey

IPC分类号： C25D005/02 ,  H01L021/288 ,  H01L021/445 ,  C25D005/10 ,  C23C028/02 ,  C25D005/50

CPC分类号： H01L21/68728 ,  C23C18/165 ,  C23C18/1653 ,  C23C18/31 ,  C23C18/36 ,  C25D5/50 ,  C25D7/123 ,  H01L21/68742 ,  H01L21/68792

摘要： Methods and apparatus for forming a conformal conductive layer on a substrate for an electroplating process are provided. In one aspect, a method is provided for processing a substrate including depositing a conductive barrier layer on the substrate, and then depositing a nucleation layer on the conductive barrier layer. The nucleation layer is deposited by depositing a first conductive material on the substrate and then depositing a second conductive material on the first conductive material by an electroless deposition process. The second conductive material may comprise nickel, tin, or combinations thereof. The substrate may then be further processed by electroplating a third conductive material on the second conductive material and/or annealing the substrate.

摘要翻译： 提供了在用于电镀工艺的衬底上形成保形导电层的方法和装置。 在一个方面，提供了一种用于处理衬底的方法，包括在衬底上沉积导电阻挡层，然后在导电阻挡层上沉积成核层。 通过在衬底上沉积第一导电材料然后通过无电沉积工艺将第二导电材料沉积在第一导电材料上来沉积成核层。 第二导电材料可以包括镍，锡或其组合。 然后可以通过在第二导电材料上电镀第三导电材料和/或退火衬底来进一步处理衬底。