Invention Grant
- Patent Title: Method for fabrication of high vertical aspect ratio thin film structures
- Patent Title (中): 高垂直纵横比薄膜结构的制造方法
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Application No.: US207459Application Date: 1994-03-07
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Publication No.: US5660680APublication Date: 1997-08-26
- Inventor: Christopher G. Keller
- Applicant: Christopher G. Keller
- Applicant Address: CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: CA Oakland
- Main IPC: H01L29/84
- IPC: H01L29/84 ; A61K9/00 ; A61K9/50 ; B01D39/16 ; B01D39/20 ; B01D67/00 ; B01D69/02 ; B01D69/12 ; B01D71/02 ; B81B1/00 ; B81C1/00 ; C23C16/01 ; G03F7/00 ; H01L49/00 ; H01L21/00
Abstract:
This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures in excess of 150 microns in height using thin film deposition processes. Wafers may be employed as reusable molds for efficient production of such structures.
Public/Granted literature
- US5055277A Fumigating apparatus for shipping containers Public/Granted day:1991-10-08
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