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51.发明授权Workpiece holder for processing apparatus, and processing apparatus using the same 有权用于处理装置的工件支架及使用其的处理装置公开(公告)号：US07264699B2
公开(公告)日：2007-09-04
申请号：US11249433
申请日：2005-10-14
IPC分类号： C25B9/02
CPC分类号： H01L21/6831
摘要： An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The holder comprises: a ceramic body which has an electrode and a heater circuit and which can holds a workpiece; a tubular member having an end portion connected to the ceramic body; a sealing member which is disposed inside the tubular member and which isolates a space inside the tubular member into two regions: a region on the first end portion (“sealed portion”) and a region on the opposite side (“opposite region”); and power supply conductive members which extend from the opposite region side, penetrating the sealing member to the sealed region side, and which are electrically connected to the electrode and the heater circuit.
摘要翻译： 提供了具有高可靠性的便宜的工件保持器和配备有工件保持器的处理装置，其中防止了由空气中的氧引起的损伤。 保持器包括：陶瓷体，其具有电极和加热器电路，并且可以保持工件; 管状构件，其具有连接到所述陶瓷体的端部; 密封构件，其设置在所述管状构件的内部，并且将所述管状构件内部的空间隔离成两个区域：所述第一端部（“密封部”）上的区域和相对侧（“相对区域”）上的区域。 以及从相对区域侧延伸穿过密封构件到密封区域侧并且与电极和加热器电路电连接的电源导电构件。
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52.发明申请Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit 审中-公开晶片保持器，具有晶片保持器的加热器单元和具有加热器单元的晶片探测器公开(公告)号：US20070082313A1
公开(公告)日：2007-04-12
申请号：US11498276
申请日：2006-08-03
IPC分类号： F24J3/00
CPC分类号： G01R31/2863 , G01R31/2875 , H01L21/68757
摘要： A wafer holder less susceptible to deformation even under high load and having high heat-insulating effect and hence capable of improving positional accuracy, improving thermal uniformity and rapid heating and cooling of chips, as well as a heater unit including the wafer holder and a wafer prober including the heater unit are provided. The wafer holder includes a chuck top having a chuck top conductive layer on its surface and a supporter supporting the chuck top, and has a support member in a space between the chuck top and the supporter. Preferably, the support member is arranged concentric with the supporter or approximately at the center of the supporter, and more preferably, support members arranged concentrically and arranged at the center are both provided.
摘要翻译： 晶片保持器即使在高负载下也不易变形，并且具有高绝热效果，因此能够提高位置精度，提高芯片的热均匀性和快速加热和冷却，以及包括晶片保持器和晶片的加热器单元 提供包括加热器单元的探测器。 晶片保持器包括在其表面上具有卡盘顶部导电层的卡盘顶部和支撑卡盘顶部的支撑件，并且在卡盘顶部和支撑件之间的空间中具有支撑构件。 优选地，支撑构件与支撑件同心地布置，或者大致位于支撑件的中心，并且更优选地，设置在同心且布置在中心的支撑构件。
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公开(公告)号：US20070062929A1
公开(公告)日：2007-03-22
申请号：US11507655
申请日：2006-08-22
IPC分类号： H05B3/68
CPC分类号： H05B3/265 , H01L21/67109
摘要： A heater unit that much improves accuracy in thermal uniformity of an object of heating during cooling, particularly rapid cooling, is provided. The heater unit in accordance with the present invention includes a heater substrate for mounting an object of heating and performing heat treatment thereon, and a cooling module for cooling the heater substrate, and between said heater substrate and the cooling module, an intervening body is arranged. Utilizing deformability of the intervening body, ratio of a non-contact portion can be reduced than when the intervening body is not provided, and temperature uniformity of the heater substrate at the time of cooling can be improved.
摘要翻译： 提供了一种加热器单元，其大大提高了冷却期间加热对象的热均匀性的精度，特别是快速冷却。 根据本发明的加热器单元包括用于安装加热物体并在其上进行热处理的加热器基板，以及用于冷却加热器基板的冷却模块，并且在所述加热器基板和冷却模块之间布置有中间体 。 利用中间体的可变形性，可以比不设置中间体时的非接触部分的比例降低，并且可以提高冷却时的加热器基板的温度均匀性。
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54.发明申请公开(公告)号：US20070056953A1
公开(公告)日：2007-03-15
申请号：US11518878
申请日：2006-09-12
IPC分类号： H05B3/68
CPC分类号： H05B3/143 , H01L21/67109
摘要： A ceramic heater attaining more uniform temperature distribution from the start to the end of cooling is provided. Further, in a cooling module used for cooling the heater, liquid leakage during use is prevented, degradation in cooling capability is prevented and the performance is maintained for a long period of use, and the manufacturing cost of the module is decreased. The ceramic heater includes a ceramic heater body and a cooling module cooling the heater body, and the cooling module has a structure formed by arranging a pipe in a trench formed in a plate-shaped structure.
摘要翻译： 提供了一种从开始到结束温度分布均匀的陶瓷加热器。 此外，在用于冷却加热器的冷却模块中，防止了使用期间的液体泄漏，防止了冷却能力的劣化，并且长时间使用时保持了性能，并且模块的制造成本降低。 陶瓷加热器包括陶瓷加热器主体和冷却加热器主体的冷却模块，并且冷却模块具有通过将管道设置在形成为板状结构的沟槽中而形成的结构。
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55.发明申请Semiconductor heating heater holder and semiconductor manufacturing apparatus 审中-公开半导体加热器支架和半导体制造装置公开(公告)号：US20070054424A1
公开(公告)日：2007-03-08
申请号：US11504764
申请日：2006-08-16
IPC分类号： H01L21/66
CPC分类号： H01L21/67103
摘要： A semiconductor heater holder for setting a heater for heating a semiconductor, having an opening, wherein the heat capacity of the semiconductor heater holder is not more than 1.5 times the heat capacity of the heater, and a semiconductor manufacturing apparatus comprising this semiconductor heater holder.
摘要翻译： 一种用于设置用于加热半导体的加热器的半导体加热器保持器，具有开口，其中半导体加热器保持器的热容量不大于加热器的热容量的1.5倍，以及包括该半导体加热器保持器的半导体制造装置。
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56.发明申请Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit 审中-公开晶片保持器，具有晶片保持器的加热器单元和具有加热器单元的晶片探测器公开(公告)号：US20070046306A1
公开(公告)日：2007-03-01
申请号：US11498273
申请日：2006-08-03
IPC分类号： G01R31/02
CPC分类号： G01R31/2865 , G01R31/2874
摘要： A wafer holder and a wafer prober including the same are provided in which the positional accuracy of the wafer holder is very high when the wafer holder is moved to a prescribed position in probing, and the positional accuracy are less likely to vary even with repeated movements. The wafer holder in accordance with the present invention includes a chuck top having a chuck top conductive layer on a surface thereof and a support body supporting the chuck top. The weight of the wafer holder is 28000 g or less. Preferably, the weight of the chuck top is 6000 g or less. Preferably, the weight of the support body is 12000 g or less.
摘要翻译： 提供晶片保持器和包括该晶片保持器的晶片探测器，其中当晶片保持器在探测中移动到规定位置时，晶片保持器的位置精度非常高，并且即使重复移动，位置精度也不太可能变化 。 根据本发明的晶片保持器包括其表面上具有卡盘顶部导电层的卡盘顶板和支撑卡盘顶部的支撑体。 晶片保持器的重量为28000g或更小。 卡盘顶部的重量优选为6000g以下。 优选地，支撑体的重量为12000g以下。
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57.发明申请Wafer holder, heater unit used for wafer prober having the wafer holder, and wafer prober having the heater unit 审中-公开用于具有晶片保持器的晶片探测器的晶片保持器，加热器单元和具有加热器单元的晶片探测器公开(公告)号：US20070045778A1
公开(公告)日：2007-03-01
申请号：US11498988
申请日：2006-08-04
IPC分类号： H01L29/06
CPC分类号： H01L21/67103 , G01R31/2865 , G01R31/2875
摘要： A wafer holder for a wafer prober, a heater unit including the same, and a wafer prober including the heater unit are provided in which deformation or breakage of a chuck top can be prevented and proper measurement can be realized even in repeated use. A wafer holder in the present invention includes a chuck top having a chuck top conductive layer on a surface thereof and a support body supporting the chuck top. The chuck top and the support body are fixed to each other by a screw. The difference of thermal expansion coefficient between the screw and the chuck top is 5.0×10−6/K or less.
摘要翻译： 提供了用于晶片探测器的晶片保持器，包括该晶片探测器的加热器单元和包括加热器单元的晶片探测器，其中可以防止卡盘顶部的变形或破损，并且即使在重复使用中也可以实现适当的测量。 本发明的晶片保持器包括在其表面上具有卡盘顶部导电层的卡盘顶部和支撑卡盘顶部的支撑体。 卡盘顶部和支撑体通过螺钉彼此固定。 螺杆和卡盘顶部之间的热膨胀系数的差为5.0×10 -6 / K以下。
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58.发明申请Wafer holder, heater unit used for wafer prober and having wafer holder, and wafer prober 审中-公开晶圆支架，用于晶圆探测器的加热器单元和具有晶片支架的晶片探测器公开(公告)号：US20070024304A1
公开(公告)日：2007-02-01
申请号：US11492196
申请日：2006-07-25
IPC分类号： G01R31/02
CPC分类号： G01R31/2875 , G01R31/2865
摘要： Noise leakage from a heater body can be reduced by a wafer holder including a chuck top for mounting a semiconductor wafer, provided with the heater body, and a supporter supporting the chuck top, at least partially covered with a metal member, and by a heater unit for a wafer prober and the wafer prober using the wafer holder. In the wafer holder in accordance with the present invention, the metal member covers the supporter, preferably apart from the supporter by a distance of at most 5 mm, more preferably at most 1 mm and particularly preferably at most 0.2 mm.
摘要翻译： 加热器本体的噪声泄漏可以通过包括用于安装加热器主体的半导体晶片的卡盘顶部的晶片保持架和支撑卡盘顶部的至少部分地被金属部件覆盖的加热器和加热器 用于晶圆探测器的单元和使用晶片架的晶片探测器。 在根据本发明的晶片保持器中，金属构件覆盖支撑件，优选地与支撑件隔开最多5mm，更优选至多1mm，特别优选至多0.2mm的距离。
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公开(公告)号：US20060191639A1
公开(公告)日：2006-08-31
申请号：US10568683
申请日：2004-08-18
CPC分类号： H01L21/68792 , H01L21/67103
摘要： The object of the present invention is to prevent damage due to thermal stress induced into a substrate holding table in a substrate holding structure for holding a substrate to be processed. In the substrate holding structure having the substrate holding table arranged at the top of a support column, a flanged part is defined by an inner circumferential surface and an outer circumferential surface at a joint between the support column and the substrate holding table. The inner circumferential surface is formed of an inclined surface, which is inclined such that the inner diameter of the flanged part successively increases as approaching the lower surface of the substrate holding table. On the lower surface of the substrate holding table to which the flanged part is joined, a U-shaped groove is formed so as to correspond to the outer circumferential surface of the flanged part.
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公开(公告)号：US07090423B2
公开(公告)日：2006-08-15
申请号：US10248771
申请日：2003-02-17
IPC分类号： F16B4/00
CPC分类号： C04B35/581 , B32B2311/12 , B32B2315/02 , C03C29/00 , C04B37/005 , C04B37/006 , C04B2235/3205 , C04B2235/3224 , C04B2235/658 , C04B2235/6581 , C04B2235/6582 , C04B2235/945 , C04B2235/96 , C04B2235/9607 , C04B2237/10 , C04B2237/122 , C04B2237/123 , C04B2237/125 , C04B2237/343 , C04B2237/36 , C04B2237/365 , C04B2237/368 , C04B2237/403 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/72 , C04B2237/76 , Y10T403/21 , Y10T403/213 , Y10T403/217 , Y10T403/478
摘要： Joint formations that, in joining together joining members employed in a variety of electrical and electronic components, yield sufficiently high joint strength in the direction perpendicular to the plane in which two joining members join, and meanwhile in the direction parallel to the joint plane. First and second joining members have respective joint phases each formed with a different number of distinct yet continuous conformational faces, defining the joint phases so that neither is the matching complement of the other. A bonding agent interposed between the joint phases joins the joining members together. The difference in thermal expansion coefficient between the two joining members, and between them and the bonding agent, is 5.0×10−6/° C. or less. The joining members are a metal such as tungsten or Cu—W, or a ceramic such as AlN or Si3N4; and glass or a solder material is utilized for the bonding agent.
摘要翻译： 在接合在各种电气和电子部件中使用的接合部件接合在一起的联接结构中，在垂直于两个接合部件接合的平面的方向上产生足够高的接合强度，同时在平行于接合平面的方向上产生足够高的接合强度。 第一和第二接合构件具有各自的接合阶段，每个接合阶段各自形成有不同数量的不同但连续的构象面，限定了接合阶段，使得两者的匹配互补也不是。 插入在接合部之间的接合剂将接合部件接合在一起。 两个接合构件之间及其与接合剂之间的热膨胀系数的差为5.0×10 -6 /℃以下。 接合构件是诸如钨或Cu-W的金属，或诸如AlN或Si 3 N 4的陶瓷。 并且玻璃或焊料材料用于粘合剂。
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