公开(公告)号：US10916436B2

公开(公告)日：2021-02-09

申请号：US16696513

申请日：2019-11-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Choongho Rhee ,  Sungchan Kang ,  Hyunwook Kang ,  Cheheung Kim ,  Yongseop Yoon ,  Jaehyung Jang ,  Hyeokki Hong

IPC: H01L21/306 ,  H01L21/3065 ,  H01L21/56 ,  H01L21/683 ,  H01L21/02 ,  H01L21/311 ,  H01L21/3213

Abstract: Provided is a plasma dicing method. The plasma dicing method includes: performing plasma etching on a first surface of a substrate exposed between a plurality of membrane structures; forming a passivation layer on a semiconductor wafer to cover the plurality of membrane structures and at least one trench; performing plasma etching on a second surface of the substrate such that a through hole exposing a portion of the plurality of membrane structures and a dicing lane connected to the trench and having a width less than a width of the through hole are formed at the substrate; and removing the passivation layer and singulating the semiconductor wafer into a plurality of devices including a membrane partially exposed by the through hole.

公开(公告)号：US20200158564A1

公开(公告)日：2020-05-21

申请号：US16398449

申请日：2019-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongseop Yoon ,  Sungchan Kang ,  Cheheung Kim ,  Choongho Rhee ,  Hyeokki Hong

IPC: G01H11/08 ,  H01L41/113 ,  H01L41/25

Abstract: Provided are resonators, a resonator system including the resonators, and a method of manufacturing the resonators. The resonator includes a vibration beam configured to vibrate in response to an external signal, a sensing unit configured to detect the movement of the vibration beam, and a lumped mass unit including a base unit that contacts the vibration beam and a wing unit arranged separately from the vibration beam on the base unit.

公开(公告)号：US10528069B2

公开(公告)日：2020-01-07

申请号：US15869605

申请日：2018-01-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeokki Hong ,  Cheheung Kim ,  Sungchan Kang ,  Jinmyoung Kim ,  Sangha Park ,  Yongseop Yoon ,  Choongho Rhee

IPC: G05F3/08 ,  H03K19/00

Abstract: An integrated circuit includes a highest class core circuit that has a positive power supply terminal connected to a positive power supply terminal of an external power source, and is configured to receive a first supply voltage which is at least a portion of a an input supply voltage that is provided from the external power source based on an operation throughput; and a lowest class core circuit that has a positive power supply terminal connected to a negative power supply terminal of an adjacent upper class core circuit, has a negative power supply terminal connected to a negative power supply terminal of the external power source, and is configured to receive a second supply voltage which is at least a portion of a part of the input supply voltage that excludes the first supply voltage.

公开(公告)号：US10447238B2

公开(公告)日：2019-10-15

申请号：US15643778

申请日：2017-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan Kang ,  Cheheung Kim ,  Sangha Park ,  Yongseop Yoon ,  Choongho Rhee

IPC: H03H9/54 ,  G01H11/08 ,  H03H9/24 ,  H03H9/13 ,  H04R17/02 ,  H04R17/10 ,  H04R25/00

Abstract: A filter system includes a first resonator having a first resonant frequency, and a second resonator having a second resonant frequency different from the first resonant frequency, and electrically connected to the first resonator. A first response characteristic of the first resonator and a second response characteristic of the second resonator with respect to a frequency include a first section in which a first phase of the first resonator is equal to a second phase of the second resonator, and a second section in which the first phase is different from the second phase by 180 degrees. A first electrode of the first resonator is reversely connected to a second electrode of the second resonator.

公开(公告)号：US12181574B2

公开(公告)日：2024-12-31

申请号：US17187097

申请日：2021-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan Kang ,  Cheheung Kim ,  Daehyuk Son

IPC: G01S15/08

Abstract: Provided is a distance measurement system, including: at least one sound source configured to generate an acoustic signal; an acoustic sensor including a plurality of directional acoustic sensors arranged to have directionalities different from one another; and at least one processor configured to: obtain a directionality of the acoustic signal in a particular direction based on at least one of a sum of output signals of the plurality of directional acoustic sensors or a difference between the output signals of the plurality of directional acoustic sensors, the at least one of the sum or the difference being based on applying a weight to at least one of the output signals; and determine a distance between the acoustic sensor and a reflection surface based on a time for the acoustic signal to arrive at the acoustic sensor in the particular direction after being generated and then reflected from the reflection surface.

公开(公告)号：US11961520B2

公开(公告)日：2024-04-16

申请号：US18082977

申请日：2022-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheheung Kim ,  Jaehyung Jang ,  Hyeokki Hong

IPC: G10L15/22 ,  G10L15/30

CPC classification number: G10L15/22 ,  G10L15/30 ,  G10L2015/223

Abstract: Disclosed are a voice recognition system and a display device using the same. The disclosed voice recognition system includes a plate structure, a vibration sensor, and a voice recognition device. The plate structure vibrates based on propagation of a voice wave generated from a user, and the vibration sensor is provided in contact with the plate structure to detect the vibration of the plate structure. The voice recognition device recognizes voice of the user by receiving a signal output from the vibration sensor.

公开(公告)号：US11868870B2

公开(公告)日：2024-01-09

申请号：US16556424

申请日：2019-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungho Kim ,  Cheheung Kim ,  Jaeho Lee

IPC: G06N3/063 ,  G06F7/523 ,  G06F7/501 ,  G11C11/54

CPC classification number: G06N3/063 ,  G06F7/501 ,  G06F7/523 ,  G11C11/54

Abstract: A neuromorphic apparatus configured to process a multi-bit neuromorphic operation including a single axon circuit, a single synaptic circuit, a single neuron circuit, and a controller. The single axon circuit is configured to receive, as a first input, an i-th bit of an n-bit axon. The single synaptic circuit is configured to store, as a second input, a j-th bit of an m-bit synaptic weight and output a synaptic operation value between the first input and the second input. The single neuron circuit is configured to obtain each bit value of a multi-bit neuromorphic operation result between the n-bit axon and the m-bit synaptic weight, based on the output synaptic operation value. The controller is configured to respectively determine the i-th bit and the j-th bit to be sequentially assigned for each time period of different time periods to the single axon circuit and the single synaptic circuit.

公开(公告)号：US11770658B2

公开(公告)日：2023-09-26

申请号：US17182911

申请日：2021-02-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunwook Kang ,  Sungchan Kang ,  Cheheung Kim ,  Choongho Rhee ,  Hyeokki Hong

IPC: H04R17/10 ,  H04R17/02 ,  H10N30/30 ,  H10N39/00 ,  H03H9/24 ,  H03H9/02 ,  G01H1/00 ,  H03H9/17

CPC classification number: H04R17/10 ,  H04R17/02 ,  H10N30/306 ,  H10N39/00 ,  G01H1/00 ,  H03H9/02244 ,  H03H9/02259 ,  H03H9/17 ,  H03H9/2405

Abstract: Provided is a sensor interface including a first cantilever beam bundle including at least one resonator and a first output terminal, a second cantilever beam bundle including at least one resonator and a second output terminal, and a differential amplifier including a first input terminal electrically connected to the first output terminal of the first cantilever beam bundle and a second input terminal electrically connected to the second output terminal of the second cantilever beam bundle.

公开(公告)号：US11747192B2

公开(公告)日：2023-09-05

申请号：US17348184

申请日：2021-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunwook Kang ,  Cheheung Kim ,  Daehyuk Son ,  Hyeokki Hong

IPC: G01H11/00 ,  H03H9/02 ,  H03H17/02 ,  H04R1/40 ,  G01H1/06 ,  G01H11/02 ,  G01S3/802 ,  H04R1/20

CPC classification number: G01H11/00 ,  G01H1/06 ,  G01H11/02 ,  G01S3/802 ,  H03H9/02 ,  H03H17/02 ,  H03H17/0233 ,  H04R1/20 ,  H04R1/406 ,  H04R2410/01 ,  H04R2430/20

Abstract: An acoustic sensor assembly includes a non-directional acoustic sensor having a first directional pattern, a plurality of directional acoustic sensors surrounding the non-directional acoustic sensor and including a plurality of resonators having different resonance frequencies from each other, each of the plurality of directional acoustic sensors having a second directional pattern, and a processor configured to obtain output signals from the non-directional acoustic sensor and the plurality of directional acoustic sensors. The processor is further configured to calculate an acoustic signal having directivity by selecting any one or any combination of the obtained output signals or selectively combining the obtained output signals, and obtain sound around the acoustic sensor assembly, using the calculated acoustic signal.

公开(公告)号：US11665456B2

公开(公告)日：2023-05-30

申请号：US17193720

申请日：2021-03-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeokki Hong ,  Hyunwook Kang ,  Sungchan Kang ,  Cheheung Kim

IPC: H04R1/02 ,  H04R5/027

CPC classification number: H04R1/02 ,  H04R5/027

Abstract: A multi-function acoustic sensor may include a plate structure having a plurality of open spaces that are spaced apart from each other; a plurality of sensors provided on the plate structure, the plurality of sensors including a plurality of sensor elements respectively provided to overlap the plurality of open spaces; and a case having an inner space in which the plurality of sensors are provided, the case including: a first case surface on which the plurality of sensors are provided, the first case surface having at least one first hole, and a second case surface opposite to the first case surface, the second case surface having at least one second hole, wherein the at least one first hole and the at least one second hole form at least one path along which sound is transmitted and sensed through at least one of the plurality of open spaces of the plate structure.