公开(公告)号：US11737154B2

公开(公告)日：2023-08-22

申请号：US17462855

申请日：2021-08-31

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing

IPC: H01L23/66 ,  H04W76/10 ,  H01L25/065 ,  H01L25/16 ,  H01Q1/22 ,  H04B1/48 ,  H01L23/00 ,  H04Q1/02 ,  H05K7/14 ,  H01Q3/30 ,  H04B1/38

CPC classification number: H04W76/10 ,  H01L23/66 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01Q1/2266 ,  H01Q1/2283 ,  H04B1/48 ,  H04Q1/15 ,  H05K7/1487 ,  H01L24/16 ,  H01L24/73 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2223/6688 ,  H01L2224/16221 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2225/0652 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/1033 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/19105 ,  H01Q3/30 ,  H04B1/38

Abstract: A patch on interposer (PoINT) package is described with a wireless communications interface. Some examples include an interposer, a main patch attached to the interposer, a main integrated circuit die attached to the patch, a second patch attached to the interposer, and a millimeter wave radio die attached to the second patch and coupled to the main integrated circuit die through the interposer to communicate data between the main die and an external component.

公开(公告)号：US11658418B2

公开(公告)日：2023-05-23

申请号：US17317332

申请日：2021-05-11

Applicant: Intel Corporation

Inventor： Feras Eid ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Aleksandar Aleksov

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q19/22 ,  H01L23/367

CPC classification number: H01Q9/0414 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/526 ,  H01Q19/22 ,  H01L23/3675 ,  H01L2223/6672 ,  H01L2223/6677

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US11652057B2

公开(公告)日：2023-05-16

申请号：US16405610

申请日：2019-05-07

Applicant: Intel Corporation

Inventor： Khang Choong Yong ,  Eng Huat Goh ,  Min Suet Lim ,  Robert Sankman ,  Telesphor Kamgaing ,  Wil Choon Song ,  Boon Ping Koh

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/48 ,  H01L25/065

CPC classification number: H01L23/5381 ,  H01L23/3178 ,  H01L23/3185 ,  H01L23/481 ,  H01L25/0655

Abstract: Embodiments disclose electronic packages with a die assembly and methods of forming such electronic packages. In an embodiment, a die assembly comprises a first die and a second die laterally adjacent to the first die. In an embodiment, the first die and the second die each comprise a first semiconductor layer, an insulator layer over the first semiconductor layer, and a second semiconductor layer over the insulator layer. In an embodiment, a cavity is disposed through the second semiconductor layer. In an embodiment, the die assembly further comprises a bridge substrate that electrically couples the first die to the second die, where the bridge is positioned in the cavity of the first die and the cavity of the second die.

公开(公告)号：US20230077949A1

公开(公告)日：2023-03-16

申请号：US17958300

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Sasha N. Oster

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/498

Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

公开(公告)号：US11509069B2

公开(公告)日：2022-11-22

申请号：US16901243

申请日：2020-06-15

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini

IPC: H01Q21/00 ,  H01Q21/22 ,  H01L23/00 ,  H01Q21/06 ,  H01Q23/00 ,  G06K19/077

Abstract: Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.

公开(公告)号：US20220190806A1

公开(公告)日：2022-06-16

申请号：US17688065

申请日：2022-03-07

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Feras Eid ,  Telesphor Kamgaing ,  Johanna M. Swan

IPC: H03H9/54 ,  H03H9/02 ,  H03H9/64

Abstract: Embodiments may relate to a die such as an acoustic wave resonator (AWR) die. The die may include a first filter and a second filter in the die body. The die may further include an electromagnetic interference (EMI) structure that surrounds at least one of the filters. Other embodiments may be described or claimed.

公开(公告)号：US20210408653A1

公开(公告)日：2021-12-30

申请号：US16911568

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16 ,  H01P1/20 ,  H01P5/08 ,  H01P1/208

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US11211345B2

公开(公告)日：2021-12-28

申请号：US16604144

申请日：2017-06-19

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Telesphor Kamgaing ,  Sri Ranga Sai Boyapati ,  Kristof Darmawikarta ,  Eyal Fayneh ,  Ofir Degani ,  David Levy ,  Johanna M. Swan

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: In-package radio frequency (RF) waveguides as high bandwidth chip-to-chip interconnects and methods for using the same are disclosed. In one example, an electronic package includes a package substrate, first and second silicon dies or tiles, and an RF waveguide. The first and second silicon dies or tiles are attached to the package substrate. The RF waveguide is formed in the package substrate and interconnects the first silicon die or tile with the second silicon die or tile.

公开(公告)号：US11140723B2

公开(公告)日：2021-10-05

申请号：US15748449

申请日：2015-12-02

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing

IPC: H01L23/00 ,  H04W76/10 ,  H01L25/065 ,  H01L25/16 ,  H01L23/66 ,  H01Q1/22 ,  H04B1/48 ,  H04Q1/02 ,  H05K7/14 ,  H01Q3/30 ,  H04B1/38

Abstract: A patch on interposer (PoINT) package is described with a wireless communications interface. Some examples include an interposer, a main patch attached to the interposer, a main integrated circuit die attached to the patch, a second patch attached to the interposer, and a millimeter wave radio die attached to the second patch and coupled to the main integrated circuit die through the interposer to communicate data between the main die and an external component.

公开(公告)号：US11109428B2

公开(公告)日：2021-08-31

申请号：US16600276

申请日：2019-10-11

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Rahul Khanna

IPC: H04W76/10 ,  H01L25/065 ,  H01L25/16 ,  H01L23/66 ,  H01Q1/22 ,  H04B1/48 ,  H01L23/00 ,  H04Q1/02 ,  H05K7/14 ,  H01Q3/30 ,  H04B1/38

Abstract: A blade computing system is described with a wireless communication between blades. In one embodiment, the system includes a first blade in the enclosure having a radio transceiver to communicate with a radio transceiver of a second blade in the enclosure. The second blade has a radio transceiver to communicate with the radio transceiver of the first blade. A switch in the enclosure communicates with the first blade and the second blade and establishes a connection through the respective radio transceivers between the first blade and the second blade.