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    Probe structures for testing electrical interconnections to integrated circuit electronic devices
    52.
    发明授权
    Probe structures for testing electrical interconnections to integrated circuit electronic devices 失效
    用于测试集成电路电子设备的电互连的探头结构

    公开(公告)号：US06525551B1

    公开(公告)日：2003-02-25

    申请号：US09081342

    申请日：1998-05-19

    Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Eugene John O'Sullivan ,  Da-Yuan Shih

    Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Eugene John O'Sullivan ,  Da-Yuan Shih

    IPC: G01R3102

    CPC classification number: G01R1/07307 ,  G01R1/06738 ,  H01L2924/00013 ,  H01L2224/29099

    Abstract: A probe structure for probing an electronic device. The probe has: a substrate having a substrate surface having a plurality of substrate electrical contact locations;a plurality of elongated electrical conductors having a first and second end; the first end of each of the plurality of elongated electrical conductors is electrically connected to one of the plurality of substrate electrical contact locations; a plate having a first and second side, and having a plurality of openings therein extending from the first side to the second side; the plate is disposed so that the first side thereof faces sad substrate; the second end of each of the plurality of elongated electrical conductors extends through one of the openings in the plate; a support for maintaining the plate at a distance from the substrate surface; the distance is selected so that the second ends project out from the second side of the plate a sufficient amount so that when the probe structure is pressed against a device under test the second ends of the elongated electrical conductors are maintained within a displacement from an original position by the opening so that the second ends of the elongated electrical conductors remain in contact with an electrical contact location on the device under test.

    Abstract translation: 用于探测电子设备的探头结构。 所述探针具有：具有基板表面的基板，所述基板表面具有多个基板电接触位置;多个细长电导体，具有第一端和第二端; 所述多个细长电导体中的每一个的第一端电连接到所述多个基板电接触位置中的一个; 具有第一和第二侧的板，并且具有从所述第一侧延伸到所述第二侧的多个开口; 该板被设置成使其第一侧面向悲伤的基板; 多个细长电导体中的每一个的第二端延伸穿过板中的一个开口; 用于将板保持在离基板表面一定距离处的支撑件; 选择距离使得第二端从板的第二侧突出足够的量，使得当探针结构被压靠在被测设备上时，细长电导体的第二端保持在与原件的位移之内 通过开口的位置，使得细长电导体的第二端保持与被测器件上的电接触位置接触。

    Enhanced wire termination for twinax wires
    53.
    发明授权
    Enhanced wire termination for twinax wires 失效
    用于双芯电线的增强型电线终端

    公开(公告)号：US06380485B1

    公开(公告)日：2002-04-30

    申请号：US09634427

    申请日：2000-08-08

    Applicant: Brian Samuel Beaman ,  Joseph Curtis Diepenbrock

    Inventor： Brian Samuel Beaman ,  Joseph Curtis Diepenbrock

    IPC: H01R905

    CPC classification number: H01R9/035 ,  H01R13/6588 ,  H01R13/6589 ,  H01R13/6592 ,  H01R13/6594 ,  H01R13/6597 ,  H01R2105/00 ,  H05K1/0219 ,  H05K1/117

    Abstract: A terminator assembly for a twinax wire. According to this embodiment, a PCB is provided which receives the twinax wire and provides a positive connection between a grounding bar of the PCB and the drain wide of the twinax pair. The drain wire is extended in an orthogonal direction to the twinax pair, and is engaged using an interference fit with the grounding bar. The grounding bar assembly also provides improved shielding for the twinax pair, where the integral shielding of the twinax wire has been removed to provide the connection. In an alternate embodiment, the terminating end of the twinax wire itself is encased in a termination clip. This clip provides shielding for the twinax pair, while electrically connecting with the twinax drain wire. The twinax wire, with the terminating clip, can then be easily attached to a connector PCB adapted to receive the terminator clip.

    Abstract translation: 用于双芯线的终端组件。 根据本实施例，提供了一种PCB，其接收双芯线，并在PCB的接地棒和双轴对的漏极之间提供正向连接。 排水线在与双轴对正交的方向上延伸，并且使用与接地棒的过盈配合接合。 接地棒组件还为双芯线对提供改进的屏蔽，其中已经去除了双芯线的整体屏蔽以提供连接。 在替代实施例中，双芯线本身的终端被封装在终端夹中。 该夹子为双芯线对提供屏蔽，同时与双芯线路电连接。 具有端接夹的双芯线然后可以容易地连接到适于接收终止器夹子的连接器PCB。

    High density test probe with rigid surface structure
    56.
    发明授权
    High density test probe with rigid surface structure 失效
    高密度测试探头具有刚性表面结构

    公开(公告)号：US6062879A

    公开(公告)日：2000-05-16

    申请号：US78174

    申请日：1998-05-13

    Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

    Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

    IPC: G01R1/073 ,  H01R13/24 ,  H05K7/10 ,  H01R4/04

    CPC classification number: H01R13/2414 ,  G01R1/07357 ,  H05K7/1061 ,  H01R12/714

    Abstract: The present invention is a structure for probing an electronic device. The structure has a layer of elastomeric material having a first side and a second side; a plurality of electrical conductors extending from the first side to the second side; each of the electrical conductors has a first end and a second end, the first end extends to the first side, the second end extends to said second side; a layer of dielectric material disposed on the first side; the first end of the plurality of electrical conductors extends into openings in the layer of dielectric material. More particularly, in the present invention, the second side is disposed in contact with a first surface of a substrate and the second ends of the electrical conductors are electrically connected to first electrical contact locations on the first surface.

    Abstract translation: 本发明是用于探测电子设备的结构。 该结构具有具有第一侧和第二侧的弹性体材料层; 从所述第一侧延伸到所述第二侧的多个电导体; 每个电导体具有第一端和第二端，第一端延伸到第一侧，第二端延伸到所述第二侧; 设置在所述第一侧上的介电材料层; 多个电导体的第一端延伸到电介质材料层中的开口中。 更具体地说，在本发明中，第二面设置成与衬底的第一表面接触，并且电导体的第二端电连接到第一表面上的第一电接触位置。

    High density cantilevered probe for electronic devices
    57.
    发明授权
    High density cantilevered probe for electronic devices 失效
    用于电子设备的高密度悬臂式探头

    公开(公告)号：US5914614A

    公开(公告)日：1999-06-22

    申请号：US946141

    申请日：1997-10-07

    Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

    Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

    IPC: G01R1/067 ,  G01R3/00 ,  H05K3/32 ,  H05K3/40 ,  G01R1/073

    CPC classification number: H05K3/326 ,  G01R1/06727 ,  G01R3/00 ,  G01R1/06744 ,  G01R1/06761 ,  H01L2224/1134 ,  H01L2924/00013 ,  H05K3/4015

    Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

    Abstract translation: 描述电子设备探头。 探针通过将多根线球焊接到扇形基板表面上的接触位置而形成。 电线被切断留下残留物。 其中具有电导体图案的图案化聚合物片材设置在延伸穿过片材中的孔的短截线上。 电线的端部被压扁以将聚合物片材放置在适当位置。 导线连接到聚合物片上的电导体，该电导体转换成聚合物片上的接触垫。 将第二根线球焊接到聚合物片上的垫上并切割以留下第二个短截线。 聚合物片材被激光切割，使得每个第二短截线自由地独立于其它第二螺柱移动。 第二短截线的端部设置在诸如FC芯片的电子设备的接触位置，以测试电子设备。

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