摘要:
A method and associated system for evaluating a high-frequency signal (SNE) at a point of interest on a signal path. The high-frequency signal (SNE) at the point of interest on the signal path is calculated by applying an inverse transfer function (iG) for the signal path to an argument of a remote signal (SFE) measured at a remote pickup point on the signal path, wherein the point of interest and the remote pickup point are two distant points on the signal path, wherein the high-frequency signal (SNE) and the remote signal (SFE) are represented as a respective time domain variable, and wherein said calculating is performed by a time domain evaluation process that operates in test equipment for electrical devices. The calculated high-frequency signal (SNE) is transferred to an output device of the test equipment.
摘要:
A system and associated method for evaluating a high-frequency signal at a point of interest on a signal path from a remote signal at a remote pickup point on the signal path. The point of interest is located on a device under test that is coupled to test equipment via the signal path. The high-frequency signal at the point of interest is calculated from the remote signal at the remote pickup point with an inverse transfer function that eliminates degradation effects on the high-frequency signal that is transferred through the signal path. The inverse transfer function may be calculated from measurements acquired in a test signal transfer through a reference path that simulates electrical properties of the signal path, or configured to a predetermined function if electrical properties of the signal path are known.
摘要:
A system and associated method for evaluating a high-frequency signal at a point of interest on a signal path from a remote signal at a remote pickup point on the signal path. The point of interest is located on a device under test that is coupled to test equipment via the signal path. The high-frequency signal at the point of interest is calculated from the remote signal at the remote pickup point with an inverse transfer function that eliminates degradation effects on the high-frequency signal that is transferred through the signal path. The inverse transfer function may be calculated from measurements acquired in a test signal transfer through a reference path that simulates electrical properties of the signal path, or configured to a predetermined function if electrical properties of the signal path are known.
摘要:
A system and associated method for evaluating a high-frequency signal at a point of interest on a signal path from a remote signal at a remote pickup point on the signal path. The point of interest is located on a device under test that is coupled to test equipment via the signal path. The high-frequency signal at the point of interest is calculated from the remote signal at the remote pickup point with an inverse transfer function that eliminates degradation effects on the high-frequency signal that is transferred through the signal path. The inverse transfer function may be calculated from measurements acquired in a test signal transfer through a reference path that simulates electrical properties of the signal path, or configured to a predetermined function if electrical properties of the signal path are known.
摘要:
A signal channel extends from motherboard to a daughter card across an edge connection. The daughter card includes a conductive plane that is held at a constant electrical potential. In order to compensate for a number of sources of inductance within the signal line at the edge connection, a circuit trace forming a portion of the signal channel includes an enlarged portion, spaced inward along the daughter card from the contact pads forming the edge connection, that adds capacitive coupling of the signal channel with the conductive plane.
摘要:
A system and associated method for evaluating a high-frequency signal at a point of interest on a signal path from a remote signal at a remote pickup point on the signal path. The point of interest is located on a device under test that is coupled to test equipment via the signal path. The high-frequency signal at the point of interest is calculated from the remote signal at the remote pickup point with an inverse transfer function that eliminates degradation effects on the high-frequency signal that is transferred through the signal path. The inverse transfer function may be calculated from measurements acquired in a test signal transfer through a reference path that simulates electrical properties of the signal path, or configured to a predetermined function if electrical properties of the signal path are known.
摘要:
A method and associated system for evaluating a high-frequency signal (SNE) at a point of interest on a signal path. The high-frequency signal (SNE) at the point of interest on the signal path is calculated by applying an inverse transfer function (iG) for the signal path to an argument of a remote signal (SFE) measured at a remote pickup point on the signal path, wherein the point of interest and the remote pickup point are two distant points on the signal path, wherein the high-frequency signal (SNE) and the remote signal (SFE) are represented as a respective time domain variable, and wherein said calculating is performed by a time domain evaluation process that operates in test equipment for electrical devices. The calculated high-frequency signal (SNE) is transferred to an output device of the test equipment.
摘要:
A terminator assembly for a twinax wire. According to this embodiment, a PCB is provided which receives the twinax wire and provides a positive connection between a grounding bar of the PCB and the drain wide of the twinax pair. The drain wire is extended in an orthogonal direction to the twinax pair, and is engaged using an interference fit with the grounding bar. The grounding bar assembly also provides improved shielding for the twinax pair, where the integral shielding of the twinax wire has been removed to provide the connection. In an alternate embodiment, the terminating end of the twinax wire itself is encased in a termination clip. This clip provides shielding for the twinax pair, while electrically connecting with the twinax drain wire. The twinax wire, with the terminating clip, can then be easily attached to a connector PCB adapted to receive the terminator clip.
摘要:
A computer processor socket has a base with grounding and signal holes. Each hole contains a pin for electrical interconnection with a circuit board. The socket also contains a grounding device around its perimeter. The grounding device has a continuous ring of wiping members on its upper end. When a processor is mounted to the top of the socket, the wiping members extend slightly above the processor. The heatsink mounted on top of the processor engages the wiping members which are spring-biased against its lower surface. Since the wiping members extend completely around the perimeter of the socket, a continuous electrical ground interface is formed between the heatsink and the socket. The lower ends of the grounding device are electrically interconnected with the socket grounding pins which are grounded to the board.
摘要:
A printed circuit board connector edge tab design has increased tab contact area with a large local capacitance at the connector interface. This serves to balance out the inductive effects of the connector and results in a lower overall channel impedance at the interface. The invention replaces the prior art plated pathway to the upper row of tabs with wider tabs on the lower row. The edges of the lower row tabs are spaced such that each of the connector pins destined for the upper row straddle two of the lower tabs as they travel upward. This design prevents the pins from contacting the fiberglass substrate of the board while it traverses the lower row of tabs. The absence of the prior art plated pathways allows each of the lower row tabs to be expanded into the space formerly occupied by the pathways. This design also allows the increased capacitive area of the edge tabs to be located in very close proximity to the connection area between the connector pins and the edge tabs.