发明授权
US06377474B1 Electrical grounding schemes for socketed processor and heatsink assembly
失效
插座处理器和散热器组件的电气接地方案
- 专利标题: Electrical grounding schemes for socketed processor and heatsink assembly
- 专利标题(中): 插座处理器和散热器组件的电气接地方案
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申请号: US09483796申请日: 2000-01-13
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公开(公告)号: US06377474B1公开(公告)日: 2002-04-23
- 发明人: Bruce Roy Archambeault , Joseph Curtis Diepenbrock , Leonard Douglas Hobgood , Joseph Anthony Holung , Tin-Lup Wong
- 申请人: Bruce Roy Archambeault , Joseph Curtis Diepenbrock , Leonard Douglas Hobgood , Joseph Anthony Holung , Tin-Lup Wong
- 主分类号: H05K900
- IPC分类号: H05K900
摘要:
A computer processor socket has a base with grounding and signal holes. Each hole contains a pin for electrical interconnection with a circuit board. The socket also contains a grounding device around its perimeter. The grounding device has a continuous ring of wiping members on its upper end. When a processor is mounted to the top of the socket, the wiping members extend slightly above the processor. The heatsink mounted on top of the processor engages the wiping members which are spring-biased against its lower surface. Since the wiping members extend completely around the perimeter of the socket, a continuous electrical ground interface is formed between the heatsink and the socket. The lower ends of the grounding device are electrically interconnected with the socket grounding pins which are grounded to the board.
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