公开(公告)号：US20220128745A1

公开(公告)日：2022-04-28

申请号：US17571039

申请日：2022-01-07

Applicant: Applied Materials, Inc.

Inventor： Yongan XU ,  Rutger MEYER TIMMERMAN THIJSSEN ,  Jinrui GUO ,  Ludovic GODET

IPC: G02B5/18 ,  G03F7/20 ,  G03F1/42

Abstract: A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks are positioned in a second plane, the plurality of masks in the mask layout have edges that each extend parallel to the first plane and parallel or perpendicular to an alignment feature on the substrate, the substrate includes a plurality of areas configured to be patterned by energy directed through the masks arranged in the mask layout. The method further includes directing energy towards the plurality of areas through the plurality of masks arranged in the mask layout over the substrate to form a plurality of patterned features in each of the plurality of areas.

公开(公告)号：US20220025518A1

公开(公告)日：2022-01-27

申请号：US17366832

申请日：2021-07-02

Applicant: Applied Materials, Inc.

Inventor： Andrew CEBALLOS ,  Ludovic GODET ,  Karl J. ARMSTRONG ,  Rami HOURANI

IPC: C23C16/455 ,  G02B1/10 ,  C23C16/56

Abstract: Embodiments of the present disclosure generally relate to methods and materials for optical device fabrication. More specifically, embodiments described herein provide for optical film deposition methods and materials to expand the process window for amorphous optical film deposition via incorporation of dopant atoms by suppressing the crystal growth of optical materials during deposition. By enabling amorphous films to be deposited at higher temperatures, significant cost savings and increased throughput are possible.

公开(公告)号：US20210223704A1

公开(公告)日：2021-07-22

申请号：US16748202

申请日：2020-01-21

Applicant: Applied Materials, Inc.

Inventor： Yongan XU ,  Christopher Dennis BENCHER ,  Robert Jan VISSER ,  Ludovic GODET

IPC: G03F7/20

Abstract: Embodiments of the present disclosure relate to methods for positioning masks in a propagation direction of a light source. The masks correspond to a pattern to be written into a photoresist layer of a substrate. The masks are positioned by stitching a first mask and a second mask. The first mask includes a set of first features having first feature extensions extending therefrom at first feature interfaces. The second mask includes a set of second features having second feature extensions extending therefrom at second feature interfaces. Each first feature extension stitches with each corresponding second feature extension to form each stitched portion of a first stitched portion of the first pair of masks. The stitched portion of the first pair of masks defines a portion of the pattern to be written into the photoresist layer.

公开(公告)号：US20210026257A1

公开(公告)日：2021-01-28

申请号：US17062326

申请日：2020-10-02

Applicant: Applied Materials, Inc.

Inventor： Viachslav BABAYAN ,  Ludovic GODET ,  Kyle M. HANSON ,  Robert B. MOORE

IPC: G03F7/20 ,  G03F7/38 ,  H01L21/67

Abstract: Implementations described herein relate to apparatus for post exposure processing. More specifically, implementations described herein relate to field-guided post exposure process chambers and cool down/development chambers used on process platforms. In one implementation, a plurality of post exposure process chamber and cool/down development chamber pairs are positioned on a process platform in a stacked arrangement and utilize a shared plumbing module. In another implementation, a plurality of post exposure process chamber and cool down/development chambers are positioned on a process platform in a linear arrangement and each of the chambers utilize an individually dedicated plumbing module.

公开(公告)号：US20190318957A1

公开(公告)日：2019-10-17

申请号：US16283560

申请日：2019-02-22

Applicant: Applied Materials, Inc.

Inventor： Ludovic GODET ,  Wayne MCMILLAN ,  Rutger MEYER TIMMERMAN THIJSSEN ,  Naamah ARGAMAN ,  Tapashree ROY ,  Sage DOSHAY

IPC: H01L21/768 ,  H01L21/3213 ,  H01L25/16 ,  H01L25/04 ,  H01L21/311

Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.

公开(公告)号：US20190186046A1

公开(公告)日：2019-06-20

申请号：US16230355

申请日：2018-12-21

Applicant: Applied Materials, Inc.

Inventor： Sangmin JEONG ,  Hann-Ching CHAO ,  Ludovic GODET

IPC: C40B60/00 ,  C40B50/18 ,  C40B60/04 ,  B01L3/00

CPC classification number: C40B60/00 ,  B01J19/0046 ,  B01J2219/00317 ,  B01J2219/00596 ,  B01J2219/00637 ,  B01J2219/00644 ,  B01J2219/00722 ,  B01L3/5085 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2300/0893 ,  C40B50/18 ,  C40B60/04

Abstract: Embodiments described herein generally relate to biomedical devices including a porous layer forming a support structure for a biological probe and methods of making the same. The porous layer can be a porous silicon containing layer. The pore size can be adjusted such that various size biological probes can be incorporated into the pores. Further, the porous silicon containing layer can be used to support a biofunctionalizing layer.

公开(公告)号：US20170363960A1

公开(公告)日：2017-12-21

申请号：US15692087

申请日：2017-08-31

Applicant: Applied Materials, Inc.

Inventor： Viachslav BABAYAN ,  Douglas A. BUCHBERGER, Jr. ,  Qiwei LIANG ,  Ludovic GODET ,  Srinivas D. NEMANI ,  Daniel J. WOODRUFF ,  Randy HARRIS ,  Robert B. MOORE

IPC: G03F7/20 ,  H01L21/687

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

公开(公告)号：US20170350004A1

公开(公告)日：2017-12-07

申请号：US15173356

申请日：2016-06-03

Applicant: Applied Materials, Inc.

Inventor： Tobin KAUFMAN-OSBORN ,  Srinivas D. NEMANI ,  Ludovic GODET ,  Qiwei LIANG ,  Adib KHAN

IPC: C23C16/04 ,  H01L21/67 ,  H01L21/677 ,  H01J37/32 ,  H01L21/8234

CPC classification number: C23C16/042 ,  C23C16/02 ,  C23C16/45502 ,  C23C16/45544 ,  C23C16/45561 ,  C23C16/45582 ,  C23C16/54 ,  C23C16/56 ,  H01J37/32357 ,  H01J37/32724 ,  H01J37/32733 ,  H01J37/32899 ,  H01J2237/327 ,  H01J2237/334 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/68785 ,  H01L21/823431

Abstract: Embodiments described herein relate to apparatus and methods for processing a substrate. In one embodiment, a cluster tool apparatus is provided having a transfer chamber and a pre-clean chamber, a self-assembled monolayer (SAM) deposition chamber, an atomic layer deposition (ALD) chamber, and a post-processing chamber disposed about the transfer chamber. A substrate may be processed by the cluster tool and transferred between the pre-clean chamber, the SAM deposition chamber, the ALD chamber, and the post-processing chamber. Transfer of the substrate between each of the chambers may be facilitated by the transfer chamber which houses a transfer robot.

公开(公告)号：US20160357107A1

公开(公告)日：2016-12-08

申请号：US14733923

申请日：2015-06-08

Applicant: Applied Materials, Inc.

Inventor： Douglas A. BUCHBERGER, JR. ,  Sang Ki NAM ,  Viachslav BABAYAN ,  Christine Y OUYANG ,  Ludovic GODET ,  Srinivas D. NEMANI

IPC: G03F7/20

CPC classification number: G03F7/0045 ,  G03F7/38 ,  G03F7/70 ,  G03F7/70866

Abstract: Methods disclosed herein provide apparatus and method for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes. In one embodiment, an apparatus includes a processing chamber comprising a substrate support having a substrate supporting surface, a heat source embedded in the substrate support configured to heat a substrate positioned on the substrate supporting surface, an electrode assembly configured to generate an electric field in a direction substantially perpendicular to the substrate supporting surface, wherein the electrode assembly is positioned opposite the substrate supporting surface having a downward surface facing the substrate supporting surface, wherein the electrode assembly is spaced apart from substrate support defining a processing volume between the electrode assembly and the substrate supporting surface, and a confinement ring disposed on an edge of the substrate support or the electrode assembly configured to retain an intermediate medium.

Abstract translation: 本文公开的方法提供了在光刻工艺期间没有气隙介入的情况下将电场和/或磁场施加到光致抗蚀剂层的装置和方法。 在一个实施例中，一种设备包括处理室，该处理室包括具有基板支撑表面的基板支撑件，嵌入在基板支撑件中的热源，该热源构造成加热位于基板支撑表面上的基板;电极组件， 基本上垂直于所述基板支撑表面的方向，其中所述电极组件与所述基板支撑表面相对定位，所述基板支撑表面具有面向所述基板支撑表面的向下表面，其中所述电极组件与限定所述电极组件和 衬底支撑表面以及设置在衬底支撑件的边缘上的限制环或被配置为保持中间介质的电极组件。

公开(公告)号：US20160299435A1

公开(公告)日：2016-10-13

申请号：US15091247

申请日：2016-04-05

Applicant: Applied Materials, Inc.

Inventor： Christine Y. OUYANG ,  Ludovic GODET ,  Sang Ki NAM

IPC: G03F7/40 ,  G03F7/20

CPC classification number: G03F7/2053 ,  G03F7/168

Abstract: A method and apparatus for exposing a photoresist in the presence of an electric field using a high power continuous wave source as a radiation source is disclosed herein. In one embodiment, a processing region includes a stage, a translation mechanism, a continuous wave electromagnetic module, and plurality of electrode assemblies. The continuous wave electromagnetic module includes a continuous wave electromagnetic radiation source in the form of a high power continuous wave electromagnetic laser. An electric field is applied to the surface of the substrate using the plurality of electrode assemblies while the continuous wave electromagnetic radiation source selectively irradiates the surface of the substrate.

Abstract translation: 本文公开了一种使用高功率连续波源作为辐射源在存在电场的情况下使光致抗蚀剂曝光的方法和装置。 在一个实施例中，处理区域包括平台，平移机构，连续波电磁模块和多个电极组件。 连续波电磁模块包括大功率连续波电磁激光器形式的连续波电磁辐射源。 使用多个电极组件将电场施加到衬底的表面，同时连续波电磁辐射源选择性地照射衬底的表面。