公开(公告)号：US20230161260A1

公开(公告)日：2023-05-25

申请号：US17960798

申请日：2022-10-05

Applicant: Applied Materials, Inc.

Inventor： Dmitry LUBOMIRSKY ,  Douglas A. BUCHBERGER, Jr. ,  Hyunjun KIM ,  Alan L. TSO ,  Shekhar ATHANI ,  Qiwei LIANG ,  Ellie Y. YIEH

IPC: G03F7/20 ,  G03F7/16 ,  H01L21/67

CPC classification number: G03F7/2041 ,  G03F7/168 ,  H01L21/67115 ,  H01L21/67109

Abstract: A method and apparatus for performing post-exposure bake cooling operations is described herein. The method begins by post exposure baking a substrate disposed on heated substrate support in a process chamber, the process chamber having a showerhead. The heated substrate support is moved to increase a distance between the heated substrate support and a cooled plate of the showerhead. The substrate is separated from the heated substrate support using a substrate lifting device. The substrate is moved into a close proximity to the cooled showerhead. The substrate is cooled until the substrate is less than about 70 degrees Celsius. The substrate is spaced away from the cooled showerhead using the substrate lifting device and aligning the substrate with a substrate transfer passage of the processing chamber for removal by a robot.

公开(公告)号：US20240160117A1

公开(公告)日：2024-05-16

申请号：US18282509

申请日：2021-04-02

Applicant: Applied Materials, Inc.

Inventor： Dmitry LUBOMIRSKY ,  Kyle M. HANSON ,  Douglas A. BUCHBERGER, Jr. ,  Alan L. TSO ,  Rahul KOZHIKKALKANDI ,  Paul R. MCHUGH ,  Jiayi SUN ,  Qiwei LIANG ,  Nithin Thomas ALEX ,  Lancelot HUANG ,  Ellie Y. YIEH

IPC: G03F7/00 ,  G03F7/40

CPC classification number: G03F7/70875 ,  G03F7/40 ,  G03F7/707 ,  G03F7/70758

Abstract: Apparatus and method for substrate processing are described herein. More specifically, the apparatus and method are directed towards apparatus and method for performing a field guided post exposure bake operation on a semiconductor substrate. The apparatus is a processing module (100) and includes an upper portion (102) with an electrode (400) and a base portion (104) which is configured to support a substrate (500) on a substrate support surface (159). The upper portion (102) and the base portion (104) are actuated toward and away from one another using one or more arms (112) and form a process volume (404). The process volume (404) is filled with a process fluid and the processing module (100) is rotated about an axis (A). An electric field is applied to the substrate (500) by the electrode (400) before the process fluid is drained from the process volume (404).

公开(公告)号：US20220113177A1

公开(公告)日：2022-04-14

申请号：US17067344

申请日：2020-10-09

Applicant: Applied Materials, Inc.

Inventor： Douglas A. BUCHBERGER, Jr. ,  Gautam PISHARODY ,  Lancelot HUANG

IPC: G01F23/24 ,  G01F25/00

Abstract: A method and apparatus for determining particle contamination of a process fluid is disclosed herein. In one example, a fluid resistivity measurement probe is provided. The system includes an upstream fluid conduit, a downstream fluid conduit, and a measuring section. The measuring section has a metal rod, and a ground electrode. The ground electrode surrounds and is coaxial with the metal rod. The upstream fluid conduit is coupled to a first end of the ground electrode. The downstream fluid conduit is coupled to a second end of the ground electrode. The metal rod and the ground electrode define a space therebetween. The space flows a fluid from the upstream fluid conduit to the downstream fluid conduit.

公开(公告)号：US20170363960A1

公开(公告)日：2017-12-21

申请号：US15692087

申请日：2017-08-31

Applicant: Applied Materials, Inc.

Inventor： Viachslav BABAYAN ,  Douglas A. BUCHBERGER, Jr. ,  Qiwei LIANG ,  Ludovic GODET ,  Srinivas D. NEMANI ,  Daniel J. WOODRUFF ,  Randy HARRIS ,  Robert B. MOORE

IPC: G03F7/20 ,  H01L21/687

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

公开(公告)号：US20250051965A1

公开(公告)日：2025-02-13

申请号：US18232668

申请日：2023-08-10

Applicant: Applied Materials, Inc.

Inventor： Gautam PISHARODY ,  Parth SWAROOP ,  Xiaoxiong YUAN ,  Paneendra Prakash BHAT ,  Qiwei LIANG ,  Dmitry LUBOMIRSKY ,  Adib KHAN ,  Douglas A. BUCHBERGER, Jr.

IPC: C30B35/00 ,  C30B25/02

Abstract: Disclosed herein are a showerhead and a deposition chamber containing the showerhead. The showerhead includes a first delivery network for a first precursor that comprises a first manifold connected with a first distribution system comprising a plurality of first distribution channels concentrically disposed around an axis, and a second delivery network for a second precursor that comprises a second manifold connected with a second distributions system comprising a plurality of second distribution channels concentrically disposed around the axis. The first delivery network and the second delivery network are isolated from each other within the showerhead.

公开(公告)号：US20250037974A1

公开(公告)日：2025-01-30

申请号：US18227226

申请日：2023-07-27

Applicant: Applied Materials, Inc.

Inventor： Dmitry LUBOMIRSKY ,  Junghoon KIM ,  Hyun Joo LEE ,  Pranav Vijay GADRE ,  Adib KHAN ,  Nithin Thomas ALEX ,  Douglas A. BUCHBERGER, Jr. ,  Qiwei LIANG ,  Ellie Y. YIEH ,  Shekhar ATHANI

IPC: H01J37/32

Abstract: Disclosed herein is a processing system. The processing system has an upper chamber body and a lower chamber body defining a processing environment. An upper heater is moveably disposed in the upper chamber body. The upper heater has a moveable support and an upper step formed along an outer perimeter. A lower showerhead is fixedly disposed in the lower chamber body. The lower showerhead includes a top surface configured to support a substrate, a lower step disposed along an outer perimeter wherein the substrate is configured to extend from the top surface partially over the lower step. Lift pins are disposed in the lower showerhead and configured to extend through the top surface and support the substrate thereon. Gas holes are disposed in a first zone along the top surface and a second zone on the step and configured to independently flow both a process and non-process gas.

公开(公告)号：US20240412957A1

公开(公告)日：2024-12-12

申请号：US18207042

申请日：2023-06-07

Applicant: Applied Materials, Inc.

Inventor： Gautam PISHARODY ,  Onkara Swamy KORA SIDDARAMAIAH ,  Vijay D. PARKHE ,  Douglas A. BUCHBERGER, Jr. ,  Qiwei LIANG ,  Dmitry LUBOMIRSKY

IPC: H01J37/32 ,  H01L21/683

Abstract: Examples of a substrate support are provided herein. In some examples, the substrate support has a ceramic electrostatic chuck having a body. The body has a first side configured to support a substrate and a second side opposite the first side. The body has a chucking electrode, an active edge electrode disposed adjacent the chucking electrode, a floating mesh disposed below the chucking electrode, a heater disposed below the floating mesh, and a ground mesh disposed below the heater, wherein the ground mesh is adjacent the second side.