IN-SITU METHOD AND APPARATUS FOR MEASURING FLUID RESISTIVITY

    公开(公告)号:US20220113177A1

    公开(公告)日:2022-04-14

    申请号:US17067344

    申请日:2020-10-09

    Abstract: A method and apparatus for determining particle contamination of a process fluid is disclosed herein. In one example, a fluid resistivity measurement probe is provided. The system includes an upstream fluid conduit, a downstream fluid conduit, and a measuring section. The measuring section has a metal rod, and a ground electrode. The ground electrode surrounds and is coaxial with the metal rod. The upstream fluid conduit is coupled to a first end of the ground electrode. The downstream fluid conduit is coupled to a second end of the ground electrode. The metal rod and the ground electrode define a space therebetween. The space flows a fluid from the upstream fluid conduit to the downstream fluid conduit.

    ELECTROSTATIC CARRIER FOR DIE BONDING APPLICATIONS

    公开(公告)号:US20180374736A1

    公开(公告)日:2018-12-27

    申请号:US16008569

    申请日:2018-06-14

    Abstract: Embodiments of the disclosure relate to the use of an electrostatic carrier for securing, transporting and assembling dies on a substrate. In one embodiment, an electrostatic carrier includes a body having a top surface and a bottom surface, at least a first bipolar chucking electrode disposed within the body, at least two contact pads disposed on the bottom surface of the body and connected to the first bipolar chucking electrode, and a floating electrode disposed between the first bipolar chucking electrode and the bottom surface. In another embodiment, a die-assembling system includes the electrostatic carrier configured to electrostatically secure a plurality of dies, a carrier-holding platform configured to hold the electrostatic carrier, a die input platform and a loading robot having a range of motion configured to pick the plurality of dies from the die input platform and place them on the electrostatic carrier.

    ROTATING BIASABLE PEDESTAL AND ELECTROSTATIC CHUCK IN SEMICONDUCTOR PROCESS CHAMBER

    公开(公告)号:US20220319896A1

    公开(公告)日:2022-10-06

    申请号:US17221215

    申请日:2021-04-02

    Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support for use in a chemical vapor deposition (CVD) chamber includes: a pedestal to support a substrate, wherein the pedestal includes a dielectric plate coupled to a pedestal body; a rotary union coupled to the pedestal, wherein the rotary union includes a stationary housing disposed about a rotor; a drive assembly coupled to the rotary union; a coolant union coupled to the rotary union and having a coolant inlet fluidly coupled to coolant channels disposed in the pedestal via a coolant line; an RF rotary joint coupled to the coolant union and having an RF connector configured to couple the pedestal to an RF bias power source; and an RF conduit that extends from the RF connector to the pedestal through a central opening of the pedestal body to provide RF bias to the pedestal.

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