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公开(公告)号:US20220317579A1
公开(公告)日:2022-10-06
申请号:US17222696
申请日:2021-04-05
Applicant: Applied Materials, Inc.
Inventor: Mangesh Ashok BANGAR , Gautam PISHARODY , Lancelot HUANG , Alan L. TSO , Douglas A. BUCHBERGER, JR. , Huixiong DAI , Dmitry LUBOMIRSKY , Srinivas D. NEMANI , Christopher Siu Wing Ngai
IPC: G03F7/20
Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for verification and re-use of process fluids. The apparatus generally includes a tool for performing lithography, and a recirculation path coupled to the tool. The recirculation path generally includes a collection unit coupled at first end to a first end of the tool, and a probe coupled at a first end to a second end of the collection unit, the probe for determining one or more characteristics of a fluid flowing from the tool. The recirculation path of the apparatus further generally includes a purification unit coupled at a first end to a third end of the collection unit, the purification unit further coupled at a second end to a second end of the probe, the purification unit for changing a characteristic of the fluid.
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公开(公告)号:US20220113177A1
公开(公告)日:2022-04-14
申请号:US17067344
申请日:2020-10-09
Applicant: Applied Materials, Inc.
Inventor: Douglas A. BUCHBERGER, Jr. , Gautam PISHARODY , Lancelot HUANG
Abstract: A method and apparatus for determining particle contamination of a process fluid is disclosed herein. In one example, a fluid resistivity measurement probe is provided. The system includes an upstream fluid conduit, a downstream fluid conduit, and a measuring section. The measuring section has a metal rod, and a ground electrode. The ground electrode surrounds and is coaxial with the metal rod. The upstream fluid conduit is coupled to a first end of the ground electrode. The downstream fluid conduit is coupled to a second end of the ground electrode. The metal rod and the ground electrode define a space therebetween. The space flows a fluid from the upstream fluid conduit to the downstream fluid conduit.
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公开(公告)号:US20180374736A1
公开(公告)日:2018-12-27
申请号:US16008569
申请日:2018-06-14
Applicant: Applied Materials, Inc.
Inventor: Niranjan KUMAR , Kim Ramkumar VELLORE , Douglas H. BURNS , Gautam PISHARODY , Seshadri RAMASWAMI , Douglas A. BUCHBERGER, JR.
IPC: H01L21/683 , H01L21/02 , H01L21/67
Abstract: Embodiments of the disclosure relate to the use of an electrostatic carrier for securing, transporting and assembling dies on a substrate. In one embodiment, an electrostatic carrier includes a body having a top surface and a bottom surface, at least a first bipolar chucking electrode disposed within the body, at least two contact pads disposed on the bottom surface of the body and connected to the first bipolar chucking electrode, and a floating electrode disposed between the first bipolar chucking electrode and the bottom surface. In another embodiment, a die-assembling system includes the electrostatic carrier configured to electrostatically secure a plurality of dies, a carrier-holding platform configured to hold the electrostatic carrier, a die input platform and a loading robot having a range of motion configured to pick the plurality of dies from the die input platform and place them on the electrostatic carrier.
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公开(公告)号:US20250022745A1
公开(公告)日:2025-01-16
申请号:US18899055
申请日:2024-09-27
Applicant: Applied Materials, Inc.
Inventor: Qiwei LIANG , Douglas Arthur BUCHBERGER, JR. , Gautam PISHARODY , Dmitry LUBOMIRSKY , Shekhar ATHANI
IPC: H01L21/687 , C23C16/455 , C23C16/458 , C23C16/46 , C23C16/505 , H01J37/32 , H01L21/683
Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support for use in a chemical vapor deposition (CVD) chamber includes: a pedestal to support a substrate, wherein the pedestal includes a dielectric plate coupled to a pedestal body; an RF rotary joint coupled to the pedestal and having a RF connector; and an RF conduit that extends from the RF connector to the pedestal through a central opening of the pedestal body to provide RF bias to the pedestal; an insulator tube disposed about the RF conduit; and a ground tube disposed about the insulator tube and extending from the RF rotary joint to the pedestal, wherein the insulator tube extends vertically above an upper surface of the ground tube.
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公开(公告)号:US20220319896A1
公开(公告)日:2022-10-06
申请号:US17221215
申请日:2021-04-02
Applicant: Applied Materials, Inc.
Inventor: Qiwei LIANG , Douglas Arthur BUCHBERGER, Jr. , Gautam PISHARODY , Dmitry LUBOMIRSKY , Shekhar ATHANI
IPC: H01L21/683 , C23C16/46 , C23C16/458 , C23C16/505
Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support for use in a chemical vapor deposition (CVD) chamber includes: a pedestal to support a substrate, wherein the pedestal includes a dielectric plate coupled to a pedestal body; a rotary union coupled to the pedestal, wherein the rotary union includes a stationary housing disposed about a rotor; a drive assembly coupled to the rotary union; a coolant union coupled to the rotary union and having a coolant inlet fluidly coupled to coolant channels disposed in the pedestal via a coolant line; an RF rotary joint coupled to the coolant union and having an RF connector configured to couple the pedestal to an RF bias power source; and an RF conduit that extends from the RF connector to the pedestal through a central opening of the pedestal body to provide RF bias to the pedestal.
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公开(公告)号:US20250051965A1
公开(公告)日:2025-02-13
申请号:US18232668
申请日:2023-08-10
Applicant: Applied Materials, Inc.
Inventor: Gautam PISHARODY , Parth SWAROOP , Xiaoxiong YUAN , Paneendra Prakash BHAT , Qiwei LIANG , Dmitry LUBOMIRSKY , Adib KHAN , Douglas A. BUCHBERGER, Jr.
Abstract: Disclosed herein are a showerhead and a deposition chamber containing the showerhead. The showerhead includes a first delivery network for a first precursor that comprises a first manifold connected with a first distribution system comprising a plurality of first distribution channels concentrically disposed around an axis, and a second delivery network for a second precursor that comprises a second manifold connected with a second distributions system comprising a plurality of second distribution channels concentrically disposed around the axis. The first delivery network and the second delivery network are isolated from each other within the showerhead.
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公开(公告)号:US20240412957A1
公开(公告)日:2024-12-12
申请号:US18207042
申请日:2023-06-07
Applicant: Applied Materials, Inc.
Inventor: Gautam PISHARODY , Onkara Swamy KORA SIDDARAMAIAH , Vijay D. PARKHE , Douglas A. BUCHBERGER, Jr. , Qiwei LIANG , Dmitry LUBOMIRSKY
IPC: H01J37/32 , H01L21/683
Abstract: Examples of a substrate support are provided herein. In some examples, the substrate support has a ceramic electrostatic chuck having a body. The body has a first side configured to support a substrate and a second side opposite the first side. The body has a chucking electrode, an active edge electrode disposed adjacent the chucking electrode, a floating mesh disposed below the chucking electrode, a heater disposed below the floating mesh, and a ground mesh disposed below the heater, wherein the ground mesh is adjacent the second side.
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