公开(公告)号：US20220268407A1

公开(公告)日：2022-08-25

申请号：US17370702

申请日：2021-07-08

申请人： FUJIFILM Business Innovation Corp.

发明人： Seiji Ono ,  Yoshinao Kondo ,  Mutsuya Takahashi

IPC分类号： F21K9/90 ,  B32B38/10 ,  F21V23/00

摘要： A method for manufacturing a laminated substrate includes removing a portion not covered with a resist layer from a laminated substrate with an etchant to form a wiring, the laminated substrate including: a base layer including a mesa portion having a trapezoidal cross section, the mesa portion having a first inclined surface extending downward and outward from a top surface and a second inclined surface having an eaves-shaped portion protruding outward from the top surface; a wiring layer formed on an upper surface of the base layer; and the resist layer formed on an upper surface of the wiring layer and having a shape corresponding to a shape of the wiring, and the wiring is arranged at a position where the wiring covers a whole of the eaves-shaped portion of the second inclined surface.

公开(公告)号：US11414233B2

公开(公告)日：2022-08-16

申请号：US14663887

申请日：2015-03-20

申请人： Avery Dennison Corporation

发明人： Ronald Wiegers ,  Di Wu

IPC分类号： B65C9/26 ,  B32B27/08 ,  B32B27/32 ,  B32B27/36 ,  C09J7/40 ,  B44C1/17 ,  B32B27/10 ,  B32B27/28 ,  B32B29/00 ,  B32B37/00 ,  B32B37/12 ,  B32B38/10 ,  B65C9/02 ,  G09F3/02

摘要： Multilayer laminates are described which include one or more layers or regions of printed images or graphics captured under an outer adhesive layer. The laminates include two layers of a release coating applied to opposite faces of a support layer. Also described are systems and methods for applying wound rolls of the multilayer laminates to a collection of articles.

公开(公告)号：US11377312B2

公开(公告)日：2022-07-05

申请号：US17088694

申请日：2020-11-04

申请人： Owens Corning Intellectual Capital, LLC

发明人： James S. Belt ,  Bert W. Elliott

IPC分类号： B32B37/00 ,  B65G57/00 ,  E04D1/00 ,  B32B3/00 ,  B32B5/00 ,  B65G5/00 ,  B32B7/00 ,  B32B38/00 ,  B65G57/02 ,  B32B11/02 ,  B32B11/10 ,  B32B37/12 ,  B32B37/15 ,  B32B37/20 ,  E04D1/26 ,  B65B5/06 ,  B32B3/30 ,  B32B5/02 ,  B32B5/26 ,  B32B7/12 ,  E04D1/34 ,  E04B1/66 ,  E04D1/28 ,  B32B3/10 ,  B32B38/10 ,  B32B37/24

摘要： A method of making a laminated shingle is provided. The method includes coating a shingle mat with roofing asphalt to make an asphalt-coated sheet, adhering a reinforcement member to a portion of the asphalt-coated sheet, covering the asphalt-coated sheet, and optionally covering the reinforcement member, with granules to make a granule-covered sheet, dividing the granule-covered sheet into an overlay sheet and an underlay sheet, wherein the overlay sheet has a tab portion normally exposed on a roof and a headlap portion normally covered-up on a roof, the headlap portion having a lower zone adjacent the tab portion and an upper zone adjacent the lower zone, and wherein the reinforcement member is adhered to the lower zone of the headlap portion and laminating the overlay sheet and the underlay sheet to make the laminated shingle.

公开(公告)号：US11357143B2

公开(公告)日：2022-06-07

申请号：US16780421

申请日：2020-02-03

申请人： Superior Communications, Inc.

发明人： Shraddha Patel ,  Charlie LaColla ,  Thai Dinh ,  Vivian Chou

IPC分类号： B29C63/02 ,  B32B37/00 ,  B32B38/10 ,  H05K13/00 ,  B29C63/00

摘要： Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a roller device may include a carriage or housing and one or more rollers coupled or integrated with the housing, configured to apply a protective material to a surface of the electronic device in a first orientation, and configured to function as a device stand in a second orientation. In addition or alternatively, a roller guide apparatus and/or a wedge may be utilized to assist the roller device in applying the protective material to the surface of the electronic device.

公开(公告)号：US11355382B2

公开(公告)日：2022-06-07

申请号：US16850185

申请日：2020-04-16

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Seiji Yasumoto ,  Masataka Sato ,  Shingo Eguchi ,  Kunihiko Suzuki

IPC分类号： H01L21/683 ,  H01L21/67 ,  H01L51/00 ,  H01L29/786 ,  B32B38/10 ,  H01L51/50

摘要： To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer.

公开(公告)号：US11345135B2

公开(公告)日：2022-05-31

申请号：US16920716

申请日：2020-07-05

申请人： Hailiang Wang

发明人： Hailiang Wang

IPC分类号： B32B37/12 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B27/30 ,  B32B27/28 ,  G06F3/044 ,  B32B38/10

摘要： This disclosure generally relates to an electronic system comprising a touch sensor and a method for manufacturing such system. This disclosure also generally relates to an electronic system comprising a transparent conductive electrode. This disclosure also generally relates to an optoelectronic system including a touch screen. This system may comprise a conductive nano-composite layer, a lamination layer, and a transparent substrate. The conductive nano-composite layer, the lamination layer, and the transparent substrate in combination may have optical transparency higher than 88% at about 550 nm, and sheet resistance lower than 45 ohms per square.

公开(公告)号：US11325298B2

公开(公告)日：2022-05-10

申请号：US17194897

申请日：2021-03-08

申请人： TOPPAN PRINTING CO., LTD.

发明人： Koichi Shinoda

IPC分类号： B29C59/04 ,  B32B38/06 ,  B29D11/00 ,  B32B37/00 ,  B32B38/10 ,  B32B39/00 ,  B32B38/00 ,  B32B38/16 ,  B29C35/08 ,  B32B37/20 ,  G02B5/18 ,  H01L21/027 ,  H01L51/00 ,  G09F19/12 ,  G09F3/02 ,  G02B1/12 ,  H01L51/52

摘要： A method and an apparatus for producing a relief-pattern forming, the method and apparatus being suitable for producing a film-like material, such as an embossed film, having a fine relief-structure pattern formed on a surface thereof so as to have a distinctive optical effect with higher quality, good productivity, and fewer defects. A transfer pattern printed layer having an inverted structure of a relief-structure pattern is formed on a second substrate by printing a transfer pattern onto the surface of a first substrate on which the relief-structure pattern is formed at a predetermined position by registration with the relief-structure pattern followed by drying, laminating with the second substrate, curing and peeling.

公开(公告)号：US11319514B2

公开(公告)日：2022-05-03

申请号：US16490843

申请日：2018-02-28

申请人： NISSAN CHEMICAL CORPORATION

发明人： Takahiro Kishioka ,  Mamoru Tamura ,  Yuki Usui ,  Hiroto Ogata

IPC分类号： B32B43/00 ,  C11D11/00 ,  B08B7/00 ,  C08G73/10 ,  C09J5/00 ,  C09J179/08 ,  C11D7/32 ,  H01L21/02 ,  H01L21/683 ,  B32B38/10

摘要： A simplified method for removing foreign matters formed on a substrate in a semiconductor device manufacturing process; and a composition for forming a coating film for foreign matter removal use, which can be used in the method. A coating film is formed on a semiconductor substrate using a composition preferably containing a polyamic acid produced from (a) a tetracarboxylic dianhydride compound and (b) a diamine compound having at least one carboxyl group or a polyamic acid produced from (a) a tetracarboxylic dianhydride compound, (b) a diamine compound having at least one carboxyl group and (c) a diamine compound, and then foreign matters occurring on the coating film are removed together with the coating film by the treatment with a developing solution.

公开(公告)号：US11272621B2

公开(公告)日：2022-03-08

申请号：US16283503

申请日：2019-02-22

申请人： SHENZHEN ROYOLE TECHNOLOGIES CO., LTD.

发明人： Zihong Liu ,  Xiaojun Yu ,  Peng Wei

IPC分类号： H05K3/30 ,  H05K3/00 ,  H01L51/00 ,  G02F1/13 ,  B32B43/00 ,  B32B37/12 ,  B32B37/00 ,  B32B38/10 ,  H01L51/50

摘要： A method for fabricating a flexible electronic device, including the steps of: providing channels on a rigid substrate; adhering a flexible substrate to the rigid substrate with an adhesive; fabricating an electronic device on the flexible substrate; injecting a chemical substance into the channels; and reacting the chemical substance with the adhesive and peeling the flexible substrate from the rigid substrate. The rigid substrate comprises a first surface, a second surface opposite the first surface, and a side wall extending between the first surface and the second surface. The channels are provided on the first surface of the rigid substrate. The channels are in communication with an injection port, the injection port is located on the side wall of the rigid substrate, and a portion of the side wall is located between the injection port and the first surface.

公开(公告)号：US11260553B2

公开(公告)日：2022-03-01

申请号：US16765158

申请日：2018-03-23

申请人： QINGDAO HIGHWAY IOT TECHNOLOGY CO. , LTD. ,  MESNAC CO., LTD.

发明人： Lanfei Dong ,  Luxin Wang ,  Haijun Chen ,  Haibo Qi ,  Qiang Tong

IPC分类号： B26D7/32 ,  B26D5/02 ,  B26D7/02 ,  B26D7/10 ,  B26D7/18 ,  B26F1/40 ,  B32B38/10

摘要： A cutting equipment for radio frequency identification (RFID) tire tags includes: a cling film peeling unit (1) for peeling off the cling film on a material strip; a transport unit (2) for transporting the material strip; a visual detection unit (3) for detecting the position of the material strip; and a cutting and grabbing unit (4) for cutting the material strip and conveying the cutting-formed radio frequency identification (RFID) tire tag to a placement position. The cutting equipment for radio frequency identification (RFID) tire tag can not only improve the processing efficiency and save costs, but also effectively improve the processing accuracy of the radio frequency identification (RFID) tire tags and avoid secondary pollution of the material strip.