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公开(公告)号:US11131928B2
公开(公告)日:2021-09-28
申请号:US16088440
申请日:2017-03-29
发明人: Yuki Usui , Takahiro Kishioka , Yasushi Sakaida , Hiroto Ogata
IPC分类号: G03F7/11 , C08K5/3445 , C08L63/00 , C08K5/00 , G03F7/40
摘要: The invention provides a resist underlayer film forming composition which contains a compound having a glycoluril skeleton and which prevents collapse of a resist pattern formed on a substrate in a lithography process during semiconductor production; a resist underlayer film which uses this composition; and a method for producing a semiconductor device. The compound is of formula (1-1), wherein each of R1-R4 represents a C2-C10 alkyl group wherein a hydrogen atom is substituted by at least one substituent selected from the group consisting of a hydroxy group, a thiol group, a carboxyl group, C1-C5 alkoxyethyl groups, C1-C5 alkylsulfanyl groups and organic groups containing an ester bond, or a C2-C10 alkenyl group; the R1-R4 moieties may be the same as or different from each other; and each of R5 and R6 represents a hydrogen atom or a group selected from among C1-C10 alkyl groups and a phenyl group.
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公开(公告)号:US12044969B2
公开(公告)日:2024-07-23
申请号:US17438786
申请日:2020-03-05
IPC分类号: H01L51/00 , C08G59/24 , G03F7/11 , H01L21/3105
CPC分类号: G03F7/11 , C08G59/24 , C08G59/245 , H01L21/31058
摘要: A resist underlayer film-forming composition revealing high reflow properties while applying and heating the composition on a substrate, allowing a flat application on a multi-level substrate thus forming a flat film. The composition includes a copolymer having a repeating structural unit of the following Formula (1) and/or a repeating structural unit of the following Formula (2) and an organic solvent:
(in Formulae (1) and (2), R1 is a functional group of Formula (3); in Formula (3), Q1 and Q2 are each independently a hydrogen atom or a C1-5 alkyl group, and * is a dangling bond to an oxygen atom; and in Formula (2), X1 is a C1-50 organic group, and i and j are each independently 0 or 1).-
3.
公开(公告)号:US11674051B2
公开(公告)日:2023-06-13
申请号:US16647146
申请日:2018-09-12
IPC分类号: C09D163/00 , G03F7/11 , G03F7/20 , G03F7/26 , H01L21/027
CPC分类号: C09D163/00 , G03F7/11 , G03F7/2002 , G03F7/26 , H01L21/0274
摘要: A stepped substrate coating composition for forming a coating film having planarity on a substrate, including: a main agent and a solvent, the main agent containing a compound (A), a compound (B), or a mixture thereof, the compound (A) having a partial structure Formula (A-1) or (A-2):
and the compound (B) having at least one partial structure selected from Formulae (B-1)-(B-5), or having a partial structure including a combination of a partial structure of Formula (B-6) and a partial structure of Formula (B-7) or (B-8):
where the composition is cured by photoirradiation or by heating at 30° C.-300° C.; and the amount of the main agent in the solid content of the composition is 95%-100% by mass.-
公开(公告)号:US12072630B2
公开(公告)日:2024-08-27
申请号:US17055433
申请日:2019-05-21
IPC分类号: G03F7/11 , C08G8/26 , C08G10/00 , C09D161/12 , C09D161/18 , H01L21/027 , H01L21/311
CPC分类号: G03F7/11 , C08G8/26 , C08G10/00 , C09D161/12 , C09D161/18 , H01L21/0274 , H01L21/31144
摘要: A resist underlayer film-forming composition formed into a flat film which can exhibit high etching resistance, a good dry etching velocity ratio and a good optical constant, has a good covering property even against a so-called step-structure substrate, and has a small film thickness difference after being embedded. Also, a method for producing a polymer suitable for the resist underlayer film-forming composition; a resist underlayer film using the resist underlayer film-forming composition; and a method for manufacturing a semiconductor device. A resist underlayer film-forming composition containing a reaction product of an aromatic compound having 6 to 60 carbon atoms with a carbonyl group in a cyclic carbonyl compound having 3 to 60 carbon atoms and a solvent, wherein the reaction product has such a structure that one of the carbon atoms in the cyclic carbonyl compound links two molecules of the aromatic compound to each other.
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公开(公告)号:US11635692B2
公开(公告)日:2023-04-25
申请号:US16646987
申请日:2018-09-19
发明人: Mamoru Tamura , Hiroto Ogata , Takahiro Kishioka
IPC分类号: G03F7/11 , C09D163/04 , C08G59/14 , G03F7/16 , G03F7/20 , G03F7/38 , G03F7/32 , H01L21/027 , H01L21/311
摘要: A resist underlayer film forming composition contains a resin containing a unit structure represented by formula (1): [in formula (1), R1 represents a thiadiazole group which is optionally substituted with a C1-6 alkyl group optionally interrupted by a carboxy group, a C1-6 alkyl group optionally substituted with a hydroxyl group, or a C1-4 alkylthio group, and R2 represents a hydrogen atom or formula (2): (in formula (2), R1 is the same as defined above, and * represents a binding moiety)]. The resist underlayer film forming composition provides a resist underlayer film which has excellent solvent resistance, excellent optical parameters, an excellent dry etching rate, and excellent embeddability.
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公开(公告)号:US11287741B2
公开(公告)日:2022-03-29
申请号:US16605246
申请日:2018-04-27
发明人: Hiroto Ogata , Yuto Hashimoto , Mamoru Tamura , Takahiro Kishioka
IPC分类号: G03F7/11 , C08G59/30 , C09D163/00 , H01L21/027 , H01L21/311 , H01L21/306 , H01L21/308
摘要: A composition for forming a resist underlayer film that functions as an anti-reflective coating during exposure and can be embedded in a recess having a narrow space and a high aspect ratio, and has excellent resistance to an aqueous hydrogen peroxide solution. A resist underlayer film-forming composition containing a resin, a compound of the following Formula (1a) or (1b): wherein X is carbonyl group or methylene group, 1 and m are each independently an integer of 0 to 5 and satisfy a relational expression of 3≤1+m 10, and n is an integer of 2 to 5, and a solvent, wherein the compound of Formula (1a) or (1b) is contained in an amount of 0.01% by mass to 60% by mass relative to the amount of the resin.
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公开(公告)号:US11319514B2
公开(公告)日:2022-05-03
申请号:US16490843
申请日:2018-02-28
发明人: Takahiro Kishioka , Mamoru Tamura , Yuki Usui , Hiroto Ogata
IPC分类号: B32B43/00 , C11D11/00 , B08B7/00 , C08G73/10 , C09J5/00 , C09J179/08 , C11D7/32 , H01L21/02 , H01L21/683 , B32B38/10
摘要: A simplified method for removing foreign matters formed on a substrate in a semiconductor device manufacturing process; and a composition for forming a coating film for foreign matter removal use, which can be used in the method. A coating film is formed on a semiconductor substrate using a composition preferably containing a polyamic acid produced from (a) a tetracarboxylic dianhydride compound and (b) a diamine compound having at least one carboxyl group or a polyamic acid produced from (a) a tetracarboxylic dianhydride compound, (b) a diamine compound having at least one carboxyl group and (c) a diamine compound, and then foreign matters occurring on the coating film are removed together with the coating film by the treatment with a developing solution.
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公开(公告)号:US11112696B2
公开(公告)日:2021-09-07
申请号:US16333551
申请日:2017-09-15
发明人: Yuto Hashimoto , Hikaru Tokunaga , Hiroto Ogata , Tomoya Ohashi , Yasushi Sakaida , Takahiro Kishioka
IPC分类号: G03F7/11 , C08F220/14 , C08G59/32 , C08G59/62 , C09D133/12 , C09D163/06 , H01L21/027
摘要: A composition for forming protective films against aqueous hydrogen peroxide solutions, including: a compound of the following formula (1a) or formula (1b) or a compound having a substituent of the following formula (2) and having a molecular weight of 300 or more and less than 800 or a weight-average molecular weight of 300 or more and less than 800; and a solvent, the composition containing the compound of the formula (1a) or formula (1b) of 0.1% by mass to 60% by mass or the compound having the substituent of the formula (2) of 10% by mass to 100% by mass, relative to solids excluding the solvent: (wherein R1 is a C1-4 alkylene or alkenylene group or a direct bond, k is 0 or 1, m is an integer of 1 to 3, and n is an integer of 2 to 4.)
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公开(公告)号:US11003078B2
公开(公告)日:2021-05-11
申请号:US16098379
申请日:2017-04-21
发明人: Tomoya Ohashi , Hiroto Ogata , Yuto Hashimoto , Yuki Usui , Yasushi Sakaida , Takahiro Kishioka
IPC分类号: H01L29/08 , G03F7/11 , H01L21/308 , G03F7/09 , C08G18/40 , C08G18/48 , C08G18/62 , C09D175/04 , G03F7/16 , G03F7/20 , G03F7/32 , H01L21/027 , H01L21/306 , H01L21/3213
摘要: A composition for forming a protective film against basic aqueous hydrogen peroxide solution, including a crosslinker having, in one molecule, two or more groups at least one selected from the group consisting of a glycidyl group, a terminal epoxy group, an epoxycyclopentyl group, an epoxycyclohexyl group, an oxetanyl group, a vinyl ether group, an isocyanate group, and a blocked isocyanate, a compound having a group of Formula (1): (wherein X1 is a substituent reacting with the crosslinker, R0 is a direct bond or a C1-2 alkylene group, X2 is a C1-2 alkyl group, C1-2 alkoxy group, or fluoro group, a is an integer of 0-2, b is an integer of 1-3, c is an integer of 0-4, and b and c satisfy a relational expression of 1≤(b+c)≤5) on a side chain or a terminal and having a weight average molecular weight of 800 or more, and an organic solvent.
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