公开(公告)号：US11287742B2

公开(公告)日：2022-03-29

申请号：US16625957

申请日：2018-06-22

申请人： NISSAN CHEMICAL CORPORATION

发明人： Hirokazu Nishimaki ,  Takafumi Endo

IPC分类号： G03F7/16 ,  G03F7/11 ,  C08G61/12 ,  C09D165/00 ,  H01L21/027

摘要： A method for reducing the level difference (iso-dense bias) (reverse bump) of a resist underlayer film formed on a semiconductor substrate having a stepped portion and a non-stepped portion by 5 nm or more, which comprises a step of applying the composition to an upper surface of the semiconductor substrate having a stepped portion and a non-stepped portion. A method for reducing the level difference (iso-dense bias) of a resist underlayer film, comprising the steps of adding a fluorine-containing surfactant to a resist underlayer film-forming composition containing a polymer and a solvent and applying the composition containing the fluorine-containing surfactant to an upper surface of a semiconductor substrate having a stepped portion and a non-stepped portion. The level difference of a resist underlayer film formed on a semiconductor substrate between a stepped portion and a non-stepped portion (i.e., reverse bump) is reduced by 5 nm or more.

公开(公告)号：US12044969B2

公开(公告)日：2024-07-23

申请号：US17438786

申请日：2020-03-05

申请人： NISSAN CHEMICAL CORPORATION

发明人： Hiroto Ogata ,  Hikaru Tokunaga ,  Hirokazu Nishimaki ,  Makoto Nakajima

IPC分类号： H01L51/00 ,  C08G59/24 ,  G03F7/11 ,  H01L21/3105

CPC分类号： G03F7/11 ,  C08G59/24 ,  C08G59/245 ,  H01L21/31058

摘要： A resist underlayer film-forming composition revealing high reflow properties while applying and heating the composition on a substrate, allowing a flat application on a multi-level substrate thus forming a flat film. The composition includes a copolymer having a repeating structural unit of the following Formula (1) and/or a repeating structural unit of the following Formula (2) and an organic solvent:




(in Formulae (1) and (2), R1 is a functional group of Formula (3); in Formula (3), Q1 and Q2 are each independently a hydrogen atom or a C1-5 alkyl group, and * is a dangling bond to an oxygen atom; and in Formula (2), X1 is a C1-50 organic group, and i and j are each independently 0 or 1).

公开(公告)号：US12025916B2

公开(公告)日：2024-07-02

申请号：US16971357

申请日：2019-02-20

申请人： NISSAN CHEMICAL CORPORATION

发明人： Hirokazu Nishimaki ,  Daigo Saito ,  Ryo Karasawa ,  Keisuke Hashimoto

IPC分类号： G03F7/11 ,  C08L61/06 ,  G03F7/16 ,  G03F7/20 ,  H01L21/027

CPC分类号： G03F7/11 ,  C08L61/06 ,  G03F7/168 ,  G03F7/2037 ,  H01L21/0275

摘要： A resist underlayer film-forming composition including a novolac resin having a structural group (C) formed by reaction between an aromatic ring of an aromatic compound (A) having at least two amino groups and three C6-40 aromatic rings and a vinyl group of an aromatic vinyl compound (B). The structural group (C) may be a group of the following Formula (1):




[wherein R1 is a divalent group containing at least two amino groups and at least three C6-40 aromatic rings]. R1 may be a divalent organic group prepared by removal of two hydrogen atoms from aromatic rings of a compound of the following Formula (2):





R1 may be a divalent organic group prepared by removal of two hydrogen atoms from aromatic rings of N,N′-diphenyl-1,4-phenylenediamine.

公开(公告)号：US11472168B2

公开(公告)日：2022-10-18

申请号：US16761089

申请日：2018-10-30

申请人： NISSAN CHEMICAL CORPORATION

发明人： Hiroshi Ogino ,  Hirokazu Nishimaki ,  Ryo Karasawa ,  Tetsuya Shinjo ,  Satoshi Kamibayashi ,  Shunsuke Moriya ,  Takahisa Okuno

IPC分类号： B32B27/38 ,  C09J7/38 ,  B32B7/023 ,  B32B7/06 ,  B32B7/12 ,  B32B27/16 ,  C09J183/04 ,  H01L21/304 ,  H01L21/683

摘要： A laminated body for polishing a back surface of a wafer, the laminated body including an intermediate layer that is disposed between a support and a circuit surface of the wafer and peelably adheres to the support and the circuit surface, wherein the intermediate layer includes an adhesion layer in contact with the wafer and a peeling layer in contact with the support, and the peeling layer contains a novolac resin that absorbs light with a wavelength of 190 nm to 600 nm incident through the support, resulting in modification. The light transmittance of the peeling layer at a wavelength range of 190 nm to 600 nm may be 1 to 90%. The modification caused by absorption of light may be photodecomposition of the novolac resin.

公开(公告)号：US10585353B2

公开(公告)日：2020-03-10

申请号：US16302603

申请日：2017-05-02

申请人： NISSAN CHEMICAL CORPORATION

发明人： Hirokazu Nishimaki ,  Keisuke Hashimoto ,  Rikimaru Sakamoto

IPC分类号： H01L21/308 ,  G03F7/11 ,  H01L21/306 ,  C09D161/12 ,  G03F7/038 ,  G03F7/32 ,  C08G8/04 ,  C09D161/06 ,  H01L21/02 ,  H01L21/027 ,  H01L21/311 ,  C08G8/00 ,  G03F7/16

摘要： There is provided a novel resist underlayer film forming composition comprising a polymer having a repeating structural unit of formula (1a) and/or (1b): [wherein two R1s are each independently a C1-10 alkyl group, a C2-6 alkenyl group, an aromatic hydrocarbon group, a halogen atom, a nitro group, or an amino group, two R2s are each independently a hydrogen atom, a C1-10 alkyl group, a C2-6 alkenyl group, an acetal group, an acyl group, or a glycidyl group, R3 is an aromatic hydrocarbon group optionally having a substituent or a heterocyclic group, R4 is a hydrogen atom, a phenyl group, or a naphthyl group, two ks are each independently 0 or 1, m is an integer of 3 to 500, p is an integer of 3 to 500, X is a benzene ring, and two —C(CH3)2— groups bonded to the benzene ring are in a meta position or a para position], and a solvent.