公开(公告)号：US20120000613A1

公开(公告)日：2012-01-05

申请号：US13254940

申请日：2010-03-16

申请人： Erich Thallner

发明人： Erich Thallner

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  H01L21/67092 ,  Y10S156/93 ,  Y10S156/931 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/943 ,  Y10T156/1111 ,  Y10T156/19 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1967

摘要： Device for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer with:a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer,a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, andstripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer,the connection release means being made to work in a temperature range from 0 to 350° C., especially from 10 to 200° C., preferably from 20 to 80° C., and more preferably at ambient temperature.Furthermore, the invention relates to a method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer with the following steps:accommodating the carrier-wafer combination consisting of the carrier and the wafer on a receiving means,breaking the connection provided by the interconnect layer between the carrier and the wafer by a connection release means, andstripping the wafer from the carrier, or for stripping the carrier from the wafer by stripping means,the connection release means working in a temperature range of up to 350° C., especially from 10 to 200° C., preferably from 20 to 80° C., and more preferably at ambient temperature.

摘要翻译： 用于通过互连层从通过互连层连接到晶片的载体剥离晶片的装置，用于容纳由载体和晶片组成的载体 - 晶片组合的接收装置，用于断开由互连提供的连接的连接释放装置 载体和晶片之间的层，以及用于从载体剥离晶片或从晶片剥离载体的剥离装置，使得连接释放装置在0至350℃的温度范围内工作，特别是 10〜200℃，优选为20〜80℃，更优选为环境温度。 此外，本发明涉及一种从通过互连层与晶片连接的载体剥离晶片的方法，具有以下步骤：将由载体和晶片组成的载体 - 晶片组合容纳在接收装置上，从而将 通过连接释放装置由载体和晶片之间的互连层提供的连接，以及从载体剥离晶片或通过剥离装置从晶片剥离载体，连接释放装置在最高达 特别是10〜200℃，优选为20〜80℃，更优选为环境温度。

公开(公告)号：US20110192547A1

公开(公告)日：2011-08-11

申请号：US12701065

申请日：2010-02-05

申请人： Siu Ping YIP ,  Chi Ming CHONG ,  Man Wai CHAN ,  Kwok Wai WONG

发明人： Siu Ping YIP ,  Chi Ming CHONG ,  Man Wai CHAN ,  Kwok Wai WONG

IPC分类号： B29C63/00

CPC分类号： H01L21/67132 ,  H01L21/6838 ,  Y10S156/931 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/943 ,  Y10T156/1132 ,  Y10T156/1142 ,  Y10T156/1168 ,  Y10T156/1195 ,  Y10T156/1944 ,  Y10T156/1978 ,  Y10T156/1989 ,  Y10T156/1994

摘要： During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.

摘要翻译： 在从胶带剥离模具的过程中，与粘合带接触的模具的第一侧的内部和外部部分被支撑表面支撑。 夹头与模具的与第一侧相对的第二侧的内部和外部部分接触。 支撑件从模具的外部部分退出，使得模具的第二侧的外部部分远离夹头弯曲，同时支撑表面仅支撑模具的内部。 施加来自夹头的真空抽吸以将模具的外部部分吸引到夹头，并且监视真空吸入压力，直到达到阈值压力，表明模具的外部部分与夹头接触。 此后，在真空抽吸的同时保持模具提起夹头，以使模具与胶带完全分离。

公开(公告)号：US20060237142A1

公开(公告)日：2006-10-26

申请号：US10907991

申请日：2005-04-22

申请人： Soo-San Park ,  Gab-Yong Min ,  Jin-Wook Jeong ,  Hee Bong Lee ,  Jason Lee

发明人： Soo-San Park ,  Gab-Yong Min ,  Jin-Wook Jeong ,  Hee Bong Lee ,  Jason Lee

IPC分类号： B29C63/00

CPC分类号： B29C63/0013 ,  B29L2031/3061 ,  H01L21/67132 ,  Y10S156/932 ,  Y10S438/976 ,  Y10T156/1179 ,  Y10T156/1983

摘要： A system for peeling semiconductor chips from tape is provided with a nose on a housing. The nose has transverse dimensions smaller than the transverse dimensions of a target chip. Apertures are provided through the nose from the housing. Vacuum ports are provided in the housing adjacent the nose. A vacuum source controllably connects to the apertures and the vacuum ports. The nose is positioned adjacent a tape attached on the opposite side thereof to the target chip. Vacuum is applied to attract the tape against the nose and the adjacent portions of the housing to peel the tape from the peripheral edges of the target chip while supporting the tape in the center of the target chip.

摘要翻译： 用于从胶带剥离半导体芯片的系统在外壳上设置有鼻子。 鼻子的横向尺寸小于目标芯片的横向尺寸。 通过鼻子从外壳提供孔径。 在靠近鼻子的外壳中设有真空口。 真空源可控制地连接到孔和真空端口。 鼻子位于与其相对侧附接到目标芯片的带附近。 施加真空以将胶带吸引到鼻子和壳体的相邻部分，以将带从支撑在目标芯片的中心的磁带的目标芯片的周边边缘剥离。

公开(公告)号：US20060090846A1

公开(公告)日：2006-05-04

申请号：US10977674

申请日：2004-10-29

申请人： Yiu Cheung ,  Shiqiang Yao ,  Gary Widdowson

发明人： Yiu Cheung ,  Shiqiang Yao ,  Gary Widdowson

IPC分类号： B29C63/00

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/67144 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10S156/932 ,  Y10S438/976 ,  Y10T156/1179 ,  Y10T156/1978 ,  Y10T156/1983

摘要： A driving mechanism and driving method are provided for driving a detachment tool adapted to detach a chip from an adhesive tape to which the chip is mounted. The mechanism comprises a first actuator coupled to the detachment tool and operative to drive the detachment tool to move along a first axis substantially perpendicular to a surface of the chip, and a second actuator coupled to the detachment tool and operative to drive the detachment tool to move adjacent to a width of the chip along a second axis perpendicular to the first axis. The first actuator is configured to drive the detachment tool for programmable movement along the first axis with respect to the chip in conjunction with the second actuator driving the detachment tool for movement adjacent the width of the chip to provide controlled lifting of the chip for propagation of delamination between the chip and the adhesive tape.

摘要翻译： 提供驱动机构和驱动方法，用于驱动适于将芯片从安装有芯片的胶带剥离的拆卸工具。 该机构包括联接到分离工具的第一致动器，并且可操作地驱动分离工具沿着基本上垂直于芯片的表面的第一轴线移动;以及第二致动器，其联接到分离工具并且可操作以驱动分离工具 沿垂直于第一轴线的第二轴线相邻于芯片的宽度移动。 所述第一致动器构造成驱动所述分离工具，用于相对于所述芯片沿着所述第一轴线可编程移动，与所述第二致动器一起驱动所述分离工具，以便在所述芯片的宽度附近移动以提供所述芯片的受控提升以传播 芯片与胶带之间的分层。

公开(公告)号：US06889427B2

公开(公告)日：2005-05-10

申请号：US10077538

申请日：2002-02-15

申请人： Lup Kweun Yee ,  Darrell Jacob Belmas

发明人： Lup Kweun Yee ,  Darrell Jacob Belmas

IPC分类号： H01L21/00 ,  H05K3/30

CPC分类号： H01L21/67092 ,  H01L21/67132 ,  H01L2221/68322 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49798 ,  Y10T29/49815 ,  Y10T29/53274 ,  Y10T156/1983

摘要： An apparatus and method for separating a semiconductor die (303) from an adhesive tape (32) are disclosed. The apparatus includes a blade (34) mechanically coupled to a blade holder (36), wherein the blade (34) is inclined relative to the primary surface of the semiconductor die (303). The method further comprises lifting the semiconductor die (303) while it is attached to the adhesive tape (32) to assist disengagement. The blade (34) facilitates peeling of the semiconductor die (303) from the adhesive tape (32) while distributing stress exerted on the semiconductor die (303) over a larger surface area resulting in reduced die fractures (20).

摘要翻译： 公开了一种用于从半导体芯片（303）与胶带（32）分离的设备和方法。 该装置包括机械地联接到刀片保持器（36）的刀片（34），其中刀片（34）相对于半导体管芯（303）的主表面倾斜。 该方法还包括在半导体管芯（303）附接到粘合带（32）时提升半导体管芯（303）以辅助脱开。 刀片（34）有助于从粘合带（32）剥离半导体管芯（303），同时在较大的表面积上分布施加在半导体管芯（303）上的应力，从而减少管芯断裂（20）。

公开(公告)号：US11764098B2

公开(公告)日：2023-09-19

申请号：US17232220

申请日：2021-04-16

申请人： ASMPT SINGAPORE PTE. LTD.

发明人： Ngai Tat Man ,  Yiu Ming Cheung ,  Jun Qi ,  Chi Yung Lee

IPC分类号： B32B43/00 ,  H01L21/683

CPC分类号： H01L21/6838 ,  H01L21/6836 ,  B32B43/006 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1132 ,  Y10T156/1137 ,  Y10T156/1179 ,  Y10T156/1939 ,  Y10T156/1944 ,  Y10T156/1983

摘要： When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.

公开(公告)号：US09245778B2

公开(公告)日：2016-01-26

申请号：US13779934

申请日：2013-02-28

申请人： Fastford Technology Co., Ltd.

发明人： Keita Yamamoto ,  Naoki Okamoto

IPC分类号： B32B38/10 ,  H01L21/67

CPC分类号： H01L21/67121 ,  H01L21/67132 ,  H01L2221/68381 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1744 ,  Y10T156/1944 ,  Y10T156/1983

摘要： A die bonding apparatus includes a work supply/transfer portion for transferring a substrate; a bonding portion for conducting bonding of a die on the substrate; a wafer supply portion for supplying a wafer having the die thereon; and a controller portion for controlling equipment, wherein the wafer supply portion has a push-up unit for pushing up a dicing tape from a lower part, for separating the die from the dicing tape, and the push-up unit has a suction opening portion, which is configured to suck the dicing tape with vacuum, a push-up portion, which is made of an elastic body, sealing a fluid or a power therein, and is configured to push up the dicing tape, a cylinder, which is configured to apply pressure to the push-up portion, and an air supply means for supplying an air for changing the pressure within the cylinder through control of the controller portion.

摘要翻译： 芯片接合装置包括用于传送基板的工件供应/传送部分; 用于在基板上引导模具接合的接合部分; 晶片供给部，用于供给其上具有所述管芯的晶片; 以及用于控制设备的控制器部分，其中晶片供给部分具有用于从下部推动切割带的上推单元，用于将模具与切割带分离，并且上推单元具有吸入开口部分 被配置为真空吸附切割带，由弹性体制成的上推部分将流体或动力密封在其中，并且构造成将切割带向上推动，该构造被配置成 向上推部分施加压力;以及空气供给装置，用于通过控制器部分的控制提供用于改变气缸内的压力的空气。

公开(公告)号：US08932432B2

公开(公告)日：2015-01-13

申请号：US13594151

申请日：2012-08-24

申请人： Keiichi Tanaka ,  Masahiro Yoshihashi

发明人： Keiichi Tanaka ,  Masahiro Yoshihashi

IPC分类号： B32B38/10 ,  H01L21/67

CPC分类号： H01L21/67092 ,  H01L21/67748 ,  H01L21/68742 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/11 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1189 ,  Y10T156/19 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1983

摘要： A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.

摘要翻译： 衬底分离方法包括：在预定位置保持夹在第一保持器和彼此相对的第二保持器之间的衬底; 并且当所述基板保持在所述预定位置时相对移动所述第一保持器和所述第二保持器。 在保持基板时，通过对基板施加加压力或吸力将基板保持在预定位置。 同样在保持基板的同时，基板可以保持与第一保持器和第二保持器中的一个保持接触。

公开(公告)号：US08919412B2

公开(公告)日：2014-12-30

申请号：US12760973

申请日：2010-04-15

申请人： Gregory George ,  Hale Johnson ,  Patrick Gorun ,  Emmett Hughlett ,  James Hermanowski ,  Matthew Stiles

发明人： Gregory George ,  Hale Johnson ,  Patrick Gorun ,  Emmett Hughlett ,  James Hermanowski ,  Matthew Stiles

IPC分类号： B32B38/10 ,  H01L21/67 ,  B32B43/00 ,  H01L21/683 ,  B32B38/18

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer.

摘要翻译： 用于通过粘合剂层临时粘合的晶片脱粘两个的脱粘器装置包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴 驱动控制。 顶部卡盘组件包括加热器和晶片保持器。 X轴驱动控制器将底部卡盘组件从装载区域水平驱动到顶部卡盘组件下方的过程区域，并从工艺区域向后加载到装载区域。 包括通过粘合剂层结合到器件晶片的载体晶片的晶片对被放置在位于底部卡盘组件处的负载区域处，使得器件晶片的未结合表面与底部组件接触并且由X 驱动到顶部卡盘组件下面的处理区域，并且载体晶片的未结合表面被放置成与顶部卡盘组件接触。 X轴驱动控制器启动X轴托架驱动器沿X轴的水平运动，同时通过加热器将热量施加到载体晶片上，同时通过晶片保持器将托架晶片保持在顶卡盘组件上，从而 使得器件晶片分离并从载体晶片滑离。

公开(公告)号：US08905111B2

公开(公告)日：2014-12-09

申请号：US13961940

申请日：2013-08-08

申请人： EV Group GmbH

发明人： Erich Thallner

IPC分类号： B32B38/10 ,  B32B43/00 ,  H01L21/67

CPC分类号： B32B43/006 ,  H01L21/67092 ,  Y10S156/93 ,  Y10S156/931 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/943 ,  Y10T156/1111 ,  Y10T156/19 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1967

摘要： A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.

摘要翻译： 一种用于释放互连层的装置，其提供载体和形成载体 - 晶片组合的晶片之间的连接。 该装置包括用于在释放位置中旋转载体 - 晶片组合的旋转装置，以及用于提供接收载体 - 晶片组合的浸入浴的连接释放装置。