HIGH LIMITING OXYGEN INDEX ELECTRICAL INSULATION LAMINATES
    44.
    发明申请
    HIGH LIMITING OXYGEN INDEX ELECTRICAL INSULATION LAMINATES 审中-公开
    高限氧指数电绝缘层压板

    公开(公告)号:US20150360452A1

    公开(公告)日:2015-12-17

    申请号:US14726725

    申请日:2015-06-01

    Abstract: Laminate structure suitable as electrical insulation comprising a mica-aramid layer of 35-55 wt % mica, 20-60 wt % binder, and 5 to 25 wt % aramid floc, the mica distributed uniformly in the mica-aramid layer; and an aramid layer comprising 35-75 wt % binder and 25-65 wt % aramid floc, the aramid layer being essentially free of mica; wherein the mica-aramid layer has a limiting oxygen index (LOI) of 37% or greater, and the aramid layer has a LOI of 30% or less and having a tensile strength and elongation greater than the mica-aramid layer; and the mica-aramid layer being homogeneously and continuously bound to the aramid layer; the laminate structure having a thickness of at least 0.10 mm, a LOI greater than 32%, and when exposed to a flame to determine LOI, the laminate burns as one piece.

    Abstract translation: 叠层结构适合作为电绝缘体,其中云母 - 芳纶层为35-55重量%云母,20-60重量%粘合剂和5-25重量%芳族聚酰胺絮凝物,云母均匀地分散在云母 - 芳族聚酰胺层中; 和包含35-75重量%粘合剂和25-65重量%芳族聚酰胺絮凝物的芳族聚酰胺层,所述芳族聚酰胺层基本上不含云母; 其中所述云母 - 芳族聚酰胺层的极限氧指数(LOI)为37%以上,芳族聚酰胺层的LOI为30%以下,拉伸强度和伸长率大于云母 - 芳族聚酰胺层; 并且云母 - 芳族聚酰胺层均匀且连续地结合到芳族聚酰胺层; 层压结构具有至少0.10mm的厚度,大于32%的LOI,并且当暴露于火焰以确定LOI时,该层压体一起燃烧。

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