Abstract:
A treat-insulation material, includes: a first substrate layer that includes an aerogel and first fibers; and a second substrate layer that is layered on the first substrate layer and that includes an aerogel and second fibers, wherein a volume density of the aerogel in the first substrate layer is larger than a volume density of the aerogel in the second substrate layer, and an amount of the aerogel that is present around a first surface of the second substrate layer inside the second substrate layer, not adjacent to the first substrate layer, is smaller than an amount of the aerogel that is present around a second surface (inside the second substrate layer adjacent to the first substrate layer.
Abstract:
An object of the present invention is to provide a multilayered heat-recoverable article in which an adhesive layer easily flows during heat shrinkage to ensure adhesiveness with an adherend and does not flow out from a base material layer after heat shrinkage, and a wire splice and a wire harness that include a tube formed by thermally shrinking such a multilayered heat-recoverable article. The multilayered heat-recoverable article (1) according to the present invention includes a cylindrical base material layer (10), and an adhesive layer (11) formed on an inner circumferential surface of the base material layer. The adhesive layer (11) is formed of a resin composition that contains a polyamide as a main component and that does not substantially contain an inorganic filler. The resin composition is cross-linked by irradiation with ionizing radiation. A shear viscosity of the adhesive layer (11) at 150° C. is 300 Pa·s or more at a shear rate of 0.01 s−1 and 200 Pa·s or less at a shear rate of 100 s−1. The wire splice and the wire harness according to the present invention includes a tube formed by thermally shrinking the multilayered heat-recoverable article (1).
Abstract:
A composite coating includes a first layer, a second layer, and a fluoropolymer film disposed on the second layer. The first layer includes a polymer matrix with mica particles dispersed throughout, while the second layer includes a polyether ether ketone (PEEK).
Abstract:
Laminate structure suitable as electrical insulation comprising a mica-aramid layer of 35-55 wt % mica, 20-60 wt % binder, and 5 to 25 wt % aramid floc, the mica distributed uniformly in the mica-aramid layer; and an aramid layer comprising 35-75 wt % binder and 25-65 wt % aramid floc, the aramid layer being essentially free of mica; wherein the mica-aramid layer has a limiting oxygen index (LOI) of 37% or greater, and the aramid layer has a LOI of 30% or less and having a tensile strength and elongation greater than the mica-aramid layer; and the mica-aramid layer being homogeneously and continuously bound to the aramid layer; the laminate structure having a thickness of at least 0.10 mm, a LOI greater than 32%, and when exposed to a flame to determine LOI, the laminate burns as one piece.
Abstract:
Disclosed is a polyamide film coated with a vinylidene chloride copolymer mixture, wherein: on at least one side of a biaxially stretched polyamide film, a vinylidene chloride copolymer mixture layer in which no thermal crosslinking agent is copolymerized is formed by coating without through an intermediary of a primer layer; the vinylidene chloride copolymer mixture is a mixture including two or more vinylidene chloride copolymers; and one of the vinylidene chloride copolymers has a crystal melting point of 170° C. or higher and 210° C. or lower and is contained in an amount of 25 to 45 parts by mass in relation to 100 parts by mass of the vinylidene chloride copolymer mixture.
Abstract:
The invention relates to a layered product containing different types of plastic waste and process for preparing the same. Due to its toughness, weldability, insulation property and chemical resistance the layered product according to the invention is usable among others in construction industry, electric industry and chemical industry.
Abstract:
Individual layers of a high gradient insulator (HGI) are first pre-cut to their final dimensions. The pre-cut layers are then stacked to form an assembly that is subsequently pressed into an HGI unit with the desired dimension. The individual layers are stacked, and alignment is maintained, using a sacrificial alignment tube that is removed after the stack is hot pressed. The HGI's are used as high voltage vacuum insulators in energy storage and transmission structures or devices, e.g. in particle accelerators and pulsed power systems.
Abstract:
A dry mica tape includes a base material, a binder resin layer A formed on the base material and including an epoxy resin and an accelerator, a mica paper layer formed in contact with the binder resin layer A, and a binder resin layer B formed in contact with the mica paper layer, including an epoxy resin, and providing a cured resin with a higher glass transition point than that of a cured resin of an impregnating varnish only by reacting with an impregnating varnish including an epoxy resin impregnated into the dry mica tape wound around a conductor.
Abstract:
The present invention provides a laminate having an environmental cracking resistance for a fuel and a fuel impermeability and, in addition, higher in productivity. The present invention is a laminate including a chlorotrifluoroethylene copolymer layer (C) and a fluorine-free organic material layer (K), wherein the chlorotrifluoroethylene copolymer has a melt flow rate of 15.0 to 40.0 (g/10 minutes) and contains 15.0 to 25.0 mole percent of chlorotrifluoroethylene units relative to all monomer units.
Abstract:
The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.