公开(公告)号：US20210018389A1

公开(公告)日：2021-01-21

申请号：US17063147

申请日：2020-10-05

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Federico Giovanni Ziglioli ,  Bruno Murari

IPC: G01L5/00 ,  G01L1/18 ,  G01L1/20 ,  F16B31/02

Abstract: A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.

公开(公告)号：US10818578B2

公开(公告)日：2020-10-27

申请号：US16151748

申请日：2018-10-04

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Michele Derai ,  Federico Giovanni Ziglioli

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A method of manufacturing semiconductor devices such as integrated circuits comprises: providing one or more semiconductor chips having first and second opposed surfaces, coupling the semiconductor chip or chips with a support substrate with the second surface towards the support substrate, embedding the semiconductor chip or chips coupled with the support substrate in electrically-insulating packaging material by providing in the packaging material electrically-conductive passageways. The electrically-conductive passageways comprise: electrically-conductive chip passageways towards the first surface of the at least one semiconductor chip, and/or electrically-conductive substrate passageways towards the support substrate.

公开(公告)号：US10598578B2

公开(公告)日：2020-03-24

申请号：US15650380

申请日：2017-07-14

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Bruno Murari ,  Federico Giovanni Ziglioli

IPC: G01N3/08 ,  H01L23/31 ,  G01L1/00 ,  G01N3/06 ,  G01L5/103

Abstract: A tensile stress measurement device is to be attached to an object to be measured. The tensile stress measurement device may include an IC having a semiconductor substrate and tensile stress detection circuitry, the semiconductor substrate having opposing first and second attachment areas. The tensile stress measurement device may include a first attachment plate coupled to the first attachment area and extending outwardly to be attached to the object to be measured, and a second attachment plate coupled to the second attachment area and extending outwardly to be attached to the object to be measured. The tensile stress detection circuitry may be configured to detect a tensile stress imparted on the first and second attachment plates when attached to the object to be measured.

公开(公告)号：US10294096B2

公开(公告)日：2019-05-21

申请号：US15621359

申请日：2017-06-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Federico Giovanni Ziglioli

IPC: H01L23/00 ,  B81B3/00 ,  B81C1/00 ,  H04R19/00 ,  H01L25/00 ,  H01L23/31

Abstract: In order to manufacture a packaged device, a die having a sensitive region is bonded to a support, and a packaging mass of moldable material is molded on the support so as to surround the die. During molding of the packaging mass, a chamber is formed, which faces the sensitive region and is connected to the outside environment. To this end, a sacrificial mass of material that may evaporate/sublimate is dispensed on the sensitive region; the packaging mass is molded on the sacrificial mass; a through hole is formed in the packaging mass to extend as far as the sacrificial mass; the sacrificial mass is evaporated/sublimated through the hole.

公开(公告)号：US20180195916A1

公开(公告)日：2018-07-12

申请号：US15914832

申请日：2018-03-07

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Federico Giovanni Ziglioli ,  Bruno Murari

IPC: G01L5/00 ,  F16B31/02 ,  G01L1/18 ,  G01L1/20

CPC classification number: G01L5/0038 ,  F16B31/028 ,  G01L1/18 ,  G01L1/20

Abstract: A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.

公开(公告)号：US20180012827A1

公开(公告)日：2018-01-11

申请号：US15677578

申请日：2017-08-15

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48

Abstract: An electronic component includes one or more circuits having electrical connections coupled therewith. The electrical connections include a lead frame as well as electrical wires coupling the circuit or circuits to respective portions of the lead frame. The electrical wires may be formed as one piece with the respective portion of the lead frame without joints therebetween, e.g., by 3D printing.

公开(公告)号：US20170315035A1

公开(公告)日：2017-11-02

申请号：US15650380

申请日：2017-07-14

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Bruno Murari ,  Federico Giovanni Ziglioli

IPC: G01N3/08 ,  H01L23/31 ,  G01N3/06

CPC classification number: G01N3/08 ,  G01L1/005 ,  G01L5/103 ,  G01N3/066 ,  H01L23/3107

Abstract: A tensile stress measurement device is to be attached to an object to be measured. The tensile stress measurement device may include an IC having a semiconductor substrate and tensile stress detection circuitry, the semiconductor substrate having opposing first and second attachment areas. The tensile stress measurement device may include a first attachment plate coupled to the first attachment area and extending outwardly to be attached to the object to be measured, and a second attachment plate coupled to the second attachment area and extending outwardly to be attached to the object to be measured. The tensile stress detection circuitry may be configured to detect a tensile stress imparted on the first and second attachment plates when attached to the object to be measured.

公开(公告)号：US20170133307A1

公开(公告)日：2017-05-11

申请号：US15159212

申请日：2016-05-19

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/4846 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0538 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2924/14 ,  H01L2924/15747 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0295 ,  H05K1/112 ,  H05K3/107 ,  H05K3/205 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/09409 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/025 ,  H05K2203/0338 ,  H05K2203/0361 ,  H05K2203/0369 ,  H05K2203/1189 ,  H05K2203/143 ,  H05K2203/1461 ,  H05K2203/1476 ,  H05K2203/308 ,  H01L2224/45099

Abstract: A substrate for mounting a semiconductor device includes an insulating layer having first and second opposed surfaces defining a thickness. First and second electrically conductive lands are included in the insulating layer. The first electrically conductive lands extend through the whole thickness of the insulating layer and are exposed on both the first and second opposed surfaces. The second electrically conductive lands have a thickness less than the thickness of the insulating layer and are exposed only at the first surface. Electrically conductive lines at the first surface of the insulating layer couple certain ones of the first electrically conductive lands with certain ones of the second electrically conductive lands. The semiconductor device is mounted to the first surface of the insulating layer. Wire bonding may be used to electrically coupling the semiconductor device to certain ones of the first and second lands.

公开(公告)号：US09640506B2

公开(公告)日：2017-05-02

申请号：US14228370

申请日：2014-03-28

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli

IPC: H01L23/00 ,  B81C1/00 ,  H01L21/56 ,  H01L25/065 ,  G01L9/00 ,  G01L19/00 ,  H01L23/31

CPC classification number: H01L24/45 ,  B81C1/0023 ,  G01L9/0044 ,  G01L19/0076 ,  H01L21/561 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/16145 ,  H01L2224/2405 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45032 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48145 ,  H01L2224/48611 ,  H01L2224/48711 ,  H01L2224/48811 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/8293 ,  H01L2224/85205 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2924/01029

Abstract: An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips.

公开(公告)号：US09464952B2

公开(公告)日：2016-10-11

申请号：US14108951

申请日：2013-12-17

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani ,  Federico Giovanni Ziglioli ,  Bruno Murari

IPC: G01M5/00 ,  G01B5/30 ,  G01B7/16 ,  G01L1/00 ,  G01N3/00 ,  G01L1/18 ,  H01L27/20

CPC classification number: G01L1/18 ,  H01L27/20

Abstract: The integrated electronic device is for detecting a local parameter related to a force observed in a given direction, within a solid structure. The device includes at least one sensor configured to detect the above-mentioned local parameter at least in the given direction through piezo-resistive effect. At least one damping element, integrated in the device, is arranged within a frame-shaped region that is disposed around the at least one sensor and belongs to a substantially planar region comprising a plane passing through the sensor and perpendicular to the given direction. Such at least one damping element is configured to damp forces acting in the planar region and substantially perpendicular to the given direction.

Abstract translation: 集成电子装置用于在固体结构内检测与在给定方向上观察到的力有关的局部参数。 该装置包括至少一个传感器，其配置成至少在给定方向上通过压阻效应来检测上述局部参数。 集成在装置中的至少一个阻尼元件布置在围绕至少一个传感器设置的框状区域中，并且属于基本上平面的区域，该区域包括通过传感器并垂直于给定方向的平面。 这样的至少一个阻尼元件构造成阻碍作用在平面区域中并基本垂直于给定方向的力。