Computer method and apparatus for collaborative web searches
    42.
    发明申请
    Computer method and apparatus for collaborative web searches 有权
    用于协作网络搜索的计算机方法和装置

    公开(公告)号:US20060136377A1

    公开(公告)日:2006-06-22

    申请号:US11014600

    申请日:2004-12-16

    CPC classification number: G06F17/30687 G06F17/30887

    Abstract: Computer method and apparatus for collaborative web search operate in an intranet with non-existent or defective link structure. A search engine produces an initial search result list in response to a user query. A list optimizer reranks pages on the initial list based on implicit user recommendation or endorsement of pages. A last click heuristic defines user endorsement of a page. To form the final result list, the list optimizer scores each page according to reranking, a textual match (or information retrieval score) of the page with the query and an adjustment value.

    Abstract translation: 用于协同网页搜索的计算机方法和装置在具有不存在或有缺陷的链接结构的内联网中操作。 搜索引擎响应于用户查询产生初始搜索结果列表。 列表优化器基于隐含的用户推荐或页面的认可来重新排列初始列表上的页面。 最后点击启发式定义了用户对页面的认可。 为了形成最终结果列表,列表优化器根据重新排序对页面进行分数,具有查询的页面的文本匹配(或信息检索分数)和调整值。

    Integrated circuit structure formed by damascene process

    公开(公告)号:US20050051818A1

    公开(公告)日:2005-03-10

    申请号:US10655666

    申请日:2003-09-05

    Applicant: Mark Tuttle

    Inventor: Mark Tuttle

    CPC classification number: H01L43/12

    Abstract: An integrated circuit structure is formed using a damascene process that involves forming a trench or cavity for the structure in a temporary layer of material. A conductive material, such as copper, can then be deposited on the temporary layer to overfill the trench or cavity, and the excess conductive material can be removed by polishing down to the surface of the temporary layer. The integrated circuit structure can then be exposed by removing the temporary layer. One example of an integrated circuit structure that can be formed using this method is an upper electrode in an MRAM array. By using the process to form an upper electrode in an MRAM array, the process of forming a magnetic keeper around the upper electrode is advantageously simplified.

    Radio Frequency Identification Device Operating Methods, Radio Frequency Identification Device Configuration Methods, and Radio Frequency Identification Devices
    46.
    发明申请
    Radio Frequency Identification Device Operating Methods, Radio Frequency Identification Device Configuration Methods, and Radio Frequency Identification Devices 失效
    射频识别装置操作方法,射频识别装置配置方法和射频识别装置

    公开(公告)号:US20080100422A1

    公开(公告)日:2008-05-01

    申请号:US11968561

    申请日:2008-01-02

    Abstract: An adjustable radio frequency data communications device has a monolithic semiconductor integrated circuit with integrated circuitry, interrogation receiving circuitry provided on the monolithic integrated circuit forming at least part of the integrated circuitry and configured to receive an interrogation signal from the interrogator unit, an antenna electrically coupled to the interrogation receiving circuitry and configured to communicate with the remote interrogator unit, a power source electrically coupled to the integrated circuitry and configured to generate operating power for the communications device, and at least one of the antenna and the interrogation receiving circuitry having reconfigurable electrical characteristics, the electrical characteristics being reconfigurable to selectively tune the at least one of the antenna and the interrogation receiving circuitry within a range of tuned and detuned states to realize a desired receiver sensitivity of the communications device. Additionally, a method for tuning receiver sensitivity and/or transmitter sensitivity according to construction of the above device is disclosed.

    Abstract translation: 一种可调节射频数据通信设备具有集成电路的单片半导体集成电路,在单片集成电路上提供的询问接收电路,其形成集成电路的至少一部分并且被配置为从询问器单元接收询问信号,天线电耦合 所述询问接收电路被配置为与所述远程询问器单元通信;电源,其耦合到所述集成电路并且被配置为生成所述通信设备的操作功率,并且所述天线和所述询问接收电路中的至少一个具有可重新配置的电 特性,电特性是可重构的,以在调谐和失谐状态的范围内选择性地调谐天线和询问接收电路中的至少一个,以实现通信设备的期望接收机灵敏度 e。 此外,公开了根据上述装置的结构来调整接收机灵敏度和/或发射机灵敏度的方法。

    Interconnect for testing semiconductor components

    公开(公告)号:US07304491B2

    公开(公告)日:2007-12-04

    申请号:US11516328

    申请日:2006-09-06

    CPC classification number: G01R31/2886

    Abstract: An interconnect for testing semiconductor components includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. The interconnect can be utilized with a method that includes the steps of bonding the interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect.

Patent Agency Ranking